• Journal of Electrical Engineering and Technology
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• v.2 no.4
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• pp.518-524
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• 2007

This paper describes several improved characterizations of the EPIC CCD, which now has modified electrode and channel structures. From a 3-D numerical simulation of the device, its channel doping and potential distributions are then observed for the optimization of the charge transfer. A wavelength-dependence on the device structure is observed in terms of the reflectivity of the incident radiation. The optical properties of ultra-low energy levels, when using an open-electrode structure, are then considered to improve their quantum efficiency.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.60 no.9
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• pp.1663-1667
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• 2011

Voltage variation caused by large loads such as arc furnace and large motors, which use the large and instantaneous currents, can cause the voltage flicker. The flicker irritates the human's eyes and also has an adverse effect on protection device, rotating machine and electronic device etc, therefore the flicker needs to be managed effectively. Recently, the Korea power quality standard has been established on the IEC standards. This paper presents the flicker management standard for distribution power system and suggests the flicker transfer coefficients for Korea power system based on the IEC 61000-3-7.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.860-864
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• 2003

Recently. use of compound semiconductor is widely increasing in the area of LED and RF device. In this study, wafer bonding module is designed and optimized to bond 6 inches device wafer and carrier wafer. Bonding process is performed in vacuum environment and resin is used to bond two wafers. Load spreader and double heating mechanisms are adopted to minimize wafer warpage and void. Structure and heat transfer analyses show the designed mechanisms are very effective in performance improvement.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.31 no.5
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• pp.570-577
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• 2007

A micromachined convective accelerometer is a recently developed device. Typical micromachined accelerometers use a solid proof mass for measuring acceleration. But a micromachined convective accelerometer does not use a solid proof mass. A micromachined convective accelerometer is composed of a heating resistor and temperature sensors. This device measures acceleration by using convective heat transfer phenomenon. Therefore characteristics of a micromachined convective accelerometer are different as compared with typical micromachined accelerometer. In this research, we analyze the convective accelerometer by using transient convective heat transfer analysis. Based on the results of a convective accelerometer, we propose a new model which has improved performance.

• ETRI Journal
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• v.33 no.6
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• pp.973-976
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• 2011

This letter describes an efficient technique for maximum power point tracking (MPPT) of an energy harvesting device. It is based on controlling the device voltage at the point of maximum power. Using a microcontroller with a power saving technique, the MPPT algorithm maintains the maximum power with low power consumption. An experiment shows that the algorithm maximizes the energy transfer power using an energy management IC fabricated in a 0.18-${\mu}m$ process. Compared to direct energy transfer to a battery, the proposed technique is more efficient for low-energy harvesting under variable conditions.

• Korean Journal of Optics and Photonics
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• v.6 no.3
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• pp.173-177
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• 1995

The scanning type modulation transfer function (MTF) measurement system of linear charge coupled device (CCD) imagers is fabricated and the MTF of a linear CCD imager is tested. Measured MTF values are very sensitive to small angle knife-edge skew within 1 degree and show different results in several wavelengths. The MTF of the linear CCD imager is measured in different color temperatures of a tungsten filament lamp and the MTF uniformity of ti,t eel) pixels is tested.tested.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.166-169
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• 2000

The Organic Electroluminescence (OEL) device, that was consisted of ALq3(8-hydroxyquinoline aluminum) and TPD(N,N'-diphenyl-N,N'-bis(3-methylphenyl)-1,1'-biphenyl-4,4'-diamine), has been used. We investigated characteristics of brightness and current density about OEL that was oxidated each layers. We used two samples that were fabricated each continuous and non-continuous method. Emission was observed above 10mA/$\textrm{cm}^2$ and luminance was measured to be 1530cd/$\textrm{cm}^2$ at a current density of 100mA/$\textrm{cm}^2$. A luminance of over 2600cd/$\textrm{cm}^2$ was also observed after the final fabrication process.

• Journal of the Semiconductor & Display Technology
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• v.18 no.2
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• pp.1-5
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• 2019

As the number of IOT devices is growing rapidly, various 'see-thru connection' techniques have been reported for efficient communication with them. In this paper, we propose a deep learning based IOT device recognition system for interaction with these devices. The overall system consists of a TensorFlow based deep learning server and two Android apps for data collection and recognition purposes. As the basic neural network model, we adopted Google's inception-v3, and modified the output stage to classify 20 types of IOT devices. After creating a data set consisting of 1000 images of 20 categories, we trained our deep learning network using a transfer learning technology. As a result of the experiment, we achieve 94.5% top-1 accuracy and 98.1% top-2 accuracy.

• Journal of the Semiconductor & Display Technology
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• v.17 no.1
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• pp.62-65
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• 2018

In the era of the 4th Industrial Revolution, IoT products of various and specialized fields are being developed and produced. Especially, the generation of the artificial intelligence, robotic technology Multilayer substrates and packaging technologies in the notebook, mobile device, display and semiconductor component industries are demanding the need for flexible materials along with miniaturization and thinning. To do this, this work use FCCL (Flexible Copper Clad Laminate), which is a flexible printed circuit board (PCB), to implement FPCB (Flexible PCB), COF (Chip on Film) Use is known to be essential. In this paper, I propose a transfer device which prevents the occurrence of scratches by analyzing the mechanism of wrinkle and scratch mechanism during the transfer process of thin film material in which the thickness increases while continuously moving in air or solution.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.9 no.1
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• pp.181-187
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• 2005

This paper proposes and implements a service model to transfer messages safely for PDA on CDMA wireless network and a secure massage transfer protocol which considers characteristics of PDA. Proposed service uses SMS(Short Message Service) connect to a off-line client device with the wired network for data communication. After receiving SMS message, client device processes the SMS message and creates a data channel through RAS(Remote Access Service), then the data of the server can be pushed to clients. The implemented security protocol can provide safe data transmission on each communication line through two way channels(SMS and data). Also, by using security nonce table, this protocol can reduce a number of transmissions for exchanging a safe session key, so intensity of encryption can be increased.