• Nuclear Engineering and Technology
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• v.41 no.9
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• pp.1143-1156
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• 2009

The SPACE code that is based on a multi-dimensional two-fluid, three-field model is under development for licensing purposes of pressurized water reactors in Korea. Among the participating research and industrial organizations, KAERI is in charge of developing the physical models and correlation packages for the constitutive equations. This paper introduces a developed wall-to-fluid heat transfer package for the SPACE code. The wall-to-fluid heat transfer package consists of twelve heat transfer subregions. For each sub-region, the models in the existing safety analysis codes and the leading models in literature have been peer reviewed in order to determine the best models which can easily be applicable to the SPACE code. Hence a wall-to-fluid heat transfer region selection map has been developed according to the non-condensable gas quality, void fraction, degree of subcooling, and wall temperature. Furthermore, a partitioning methodology which can take into account the split heat flux to the continuous liquid, entrained droplet, and vapor fields is proposed to comply fully with the three-field formulation of the SPACE code. The developed wall-to-fluid heat transfer package has been pre-tested by varying the independent parameters within the application range of the selected correlations. The smoothness between two adjacent heat transfer regimes has also been investigated. More detailed verification work on the developed wall-to-fluid heat transfer package will be carried out when the coupling of a hydraulic solver with the constitutive equations is brought to completion.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.12 no.1
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• pp.45-53
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• 2006

Thermal insulation is used in a variety of applications to protect temperature sensitive products from thermal damage. Several factors affect the performance of insulation packages. Among these factors, the thermal resistance of the insulating wall is the most important factor to determine the performance of the insulating package. In many cases, insulating wall consists of multi-layered structure and the heat transfer through this structure is a very complex process. In this study, an one-dimensional mathematical model, which includes all of the heat transfer principles covering conduction, convection and radiation in multi-layered structure, were developed. Based on this model, several heat transfer phenomena occurred in the air space between the layer of the insulating wall were investigated. From the simulation results, it was observed that the heat transfer through the air space between the layer were dominated by conduction and radiation and the low emissivity of the surface of each solid layer of the wall can dramatically increase the thermal resistance of the wall. For practical use, an equation was derived for the calculation of the thermal resistance of a multi-layered wall.

• Proceedings of the KWS Conference
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• v.43
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• pp.58-60
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• 2004

In the field of welding the behavior of a welded structure under consideration may be predicted via heat transfer and residual stress analysis. In order to facilitate the industrial applications of welding, numerical modeling of heat transfer and residual stress in weldment has been carried out applying Finite Element Method (FEM) and the analysis with the external load including this residual stress due to welding has been done. The present work includes the specialized finite element codes for the calculation of nonlinear heat transfer details and residual stress redistributed along with the external load in the welded structures. A basic interface, which allows models, built in commercial preprocessing package access to the data necessary to build standard input decks for these specialized FEM codes, which are not supported by commercial package. The results from the FEM codes are imported back into commercial package for visualization. In addition the residual stress values are exported to commercial package (such as ANSYS, PATRAN etc.) for further analysis with the external loads, which make the FEM codes fully applicable to the industrial purpose.

• Journal of Software Assessment and Valuation
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• v.17 no.1
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• pp.11-16
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• 2021

The importance of software is increasing due to the development of information and communication, and software copyright disputes are also increasing. In this paper, the source of the submitted programs and the files necessary for the execution of the program were taken as the scope of analysis. The large-capacity file transfer solution program to be analyzed provides additional functions such as confidentiality, integrity, user authentication, and non-repudiation functions through digital signature and encryption of data.In this paper, we analyze the program A, program B, and the program C. In order to calculate the program similarity rate, the following contents are analyzed. Analyze the similarity of the package structure, package name, source file name in each package, variable name in source file, function name, function implementation source code, and product environment variable information. It also calculates the overall similarity rate of the program. In order to check the degree of agreement between the package structure and the package name, the similarity was determined by comparing the folder structure. It also analyzes the extent to which the package structure and package name match and the extent to which the source file (class) name within each package matches.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.51 no.6
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• pp.271-277
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• 2002

In this paper, a MEMS silicon package is newly designed, fabricated for HMIC, and characterized for microwave and millimeter-wave device applications. The proposed package is fabricated by using two high resistivity silicon substrates and surface/bulk micromachining technology. It has a good performance characteristic such as -20㏈ of $S_11$/ and -0.3㏈ of $S_21$ up to 20㎓, which is useful in microwave region. It has also better heat transfer characteristics than the commonly used ceramic package. Since the proposed silicon MEMS package is easy to fabricate and wafer level chip scale packaging is also possible, the production cost can be much lower than the ceramic package. Since it will be a promising low-cost package for mobile/wireless applications.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.4
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• pp.91-95
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• 2017

Package-On-Package (PoP) technology is developing toward smaller form factors with high-speed data transfer capabilities to cope with high DDR4x memory capacity. The common application processor (AP) used for PoP devices in smartphones has the bottom package as logic and the top package as memory, which requires both thermally and electrically enhanced functions. Therefore, it is imperative that PoP designs consider both thermal and power distribution network (PDN) issues. Stacked packages have poorer thermal dissipation than single packages. Since the bottom package usually has higher power consumption than the top package, the bottom package impacts the thermal budget of the top package (memory). This paper investigates the thermal and electrical characteristics of PoP designs, particularly the bottom package. Findings include that via and dense via-cluster volume have an important role to lower thermal resistance to the motherboard, which can be an effective way to manage chip hot spots and reduce the thermal impact on the memory package. A Cu block and dense via-cluster layout with an optimal location are proposed to drain the heat from the chip hot spots to motherboard which will enhance thermal and electrical performance at the design stage. The analytical thermal results can be used for design guidelines in 3D packaging.

• Food Science of Animal Resources
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• v.33 no.1
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• pp.31-38
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• 2013

If the time-temperature indicator (TTI) experienced a different temperature than the accompanied packaged food, influenced by heat transfer between the TTI, package, and ambient air, TTI would incorrectly predict the food quality changes with temperature. Temperature distributions of a finite slab with different sizes, representing beef packaged with TTI, were estimated by the finite element method (FEM). The thermal properties of the beef and TTI, such as heat capacity, density, and heat conductivity, were estimated from the relevant equations using their chemical compositions. The FEM simulations were performed for three cases: different locations of TTIs on the beef, different thicknesses of beef, and non-isothermal conditions of ambient air. The TTIs were mounted in four different locations on the beef. There was little difference in temperature between four locations of the TTI on the package surface. As the thickness of the slab increased, the temperature of the TTI changed faster, followed by the corner surface, as well as middle and bottom parts, indicating the possible error for temperature agreement between the TTI and the slab. Consequently, it was found that any place on the package could be selected for TTI attachment, but the package size should carefully be determined within a tolerable error of temperature.

• Transactions of the Korean Society of Automotive Engineers
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• v.9 no.6
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• pp.178-185
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• 2001

This paper describes the correlation between the interior noise and the trunk wall vibration. Using the vibro-acoustic reciprocity, effect of the trunk wall vibration on the compartment noise is investigated on a medium size car. In the low frequency range, vehicle interior noise is dominated by several acoustic modes of the passenger compartment and the vibration modes of the surrounding shell parts. Especially, vibration of the trunk wall radiates sound and it is transferred through holes on the package tray into the passenger compartment. This paper experimentally reveals that sound can be well produced at some particular vibration modes of the trunk lid and it strongly influences the compartment noise through package tray holes. Contributions of the trunk walls to the interior noise are estimated by measuring the acoustic-structural transfer function, based on the vibro-acoustical reciprocity theorem.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2011.04a
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• pp.534-537
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• 2011

This Paper present prediction Vehicle Interior Noise using ATF(Acoustic Transfer Function) and engine radiated sound power. This is useful tool to qualifying the effectiveness of Air-borne noise Path. Furthermore This method provide acoustic package performance of the vehicle and able to prepare frequency band to same segment or benchmarking vehicle.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.22 no.1
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• pp.327-332
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• 2021

At the package level, semiconductor reliability inspections involves mounting a semiconductor chip package on a test socket. The form of the test socket is basically determined by the form of the chip package. It also acts as a medium to connect with test equipment through mechanical contact of the leads and socket leads in the chip package, and it minimizes signal loss in a signal transmission process so that an inspection signal can be delivered well to the semiconductor. In this study, a technique was applied to examine the interdependence of adjacent electrical transfer routes and the structure of adjacent electrical transfer paths. The goal was to enable short-circuit testing of fewer than 100 silicon test sockets through a single interface for life tests and precision measurements. The test results of the developed device show a test precision of 99% or more and a simultaneous test speed characteristic of 0.66 sec or less.