• 반도체디스플레이기술학회지
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• 제9권3호
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• pp.23-27
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• 2010

We prepared Al doped ZnO thin film as a top electrode on a glass substrate with a deposited $Alq_3$ for the top emission organic Light emitting device (TEOLED) with facing target sputtering (FTS) method and radio-frequency (RF) sputtering method, respectively. Before the deposition of AZO thin film, we evaporated the $Alq_3$ on glass substrate by thermal evaporation. And we evaluated the damage of organic layer. As a result, PL intensity of $Alq_3$ on grown by FTS method showed higher than that of grown by RF sputtering method, so we found that the FTS showed the lower damage sputtering than RF sputtering. Therefore, we can expect the FTS method is promising the low-damage sputtering system that can be used as a direct sputtering on the organic layer.

• ETRI Journal
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• 제31권6호
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• pp.653-659
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• 2009

We have investigated the channel protection layer (PL) effect on the performance of an oxide thin film transistor (TFT) with a staggered top gate ZnO TFT and Al-doped zinc tin oxide (AZTO) TFT. Deposition of an ultra-thin PL on oxide semiconductor films enables TFTs to behave well by protecting the channel from a photo-resist (PR) stripper which removes the depleted surface of the active layer and increases the carrier amount in the channel. In addition, adopting a PL prevents channel contamination from the organic PR and results in high mobility and small subthreshold swings. The PL process plays a critical role in the performance of oxide TFTs. When a plasma process is introduced on the surface of an active layer during the PL process, and as the plasma power is increased, the TFT characteristics degrade, resulting in lower mobility and higher threshold voltage. Therefore, it is very important to form an interface using a minimized plasma process.

• 한국전기전자재료학회논문지
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• 제24권8호
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• pp.609-615
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• 2011

This paper is studied for the improvement of the characteristics of gate oxide with 3-nm-thick gate oxide by deuterium ion implantation methode. Deuterium ions were implanted to account for the topography of the overlaying layers and placing the D peak at the top of gate oxide. A short anneal at forming gas to nitrogen was performed to remove the damage of D-implantation. We simulated the deuterium ion implantation to find the optimum condition by SRIM (stopping and range of ions in matter) tool. We got the optimum condition by the results of simulation. We compare the electrical characteristics of the optimum condition with others terms. We also analyzed the electrical characteristics to change the annealing conditions after deuterium ion implantation. The results of the analysis, the breakdown time of the gate oxide was prolonged in the optimum condition. And a variety of annealing, we realized the dielectric property that annealing is good at longer time. However, the high temperature is bad because of thermal stress.

• 상하수도학회지
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• 제20권6호
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• pp.813-822
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• 2006

Soluble manganese removal was analyzed as a function of filter media, filter depth, presence or absence of chlorination, and surface manganese oxide concentration in water treatment processes. Sand, manganese oxide coated sand (MOCS), sand+MOCS, and granular activated carbon(GAC) were used as filter media. Manganese removal, surface manganese oxide concentration, turbidity removal, and regeneration of MOCS in various filter media were investigated. Results indicated that soluble manganese removal in MOCS was rapid and efficient, and most of the removal happened at the top of the filter. When filter influent (residual chlorine 1.0mg/L) with an average manganese concentration of 0.204mg/L was fed through a filter column, the sand+MOCS and MOCS columns can remove 98.9% and 99.2% of manganese respectively on an annual basis. On the other hand, manganese removal in sand and the GAC column was minimal during the initial stage of filtration, but after 8 months of filter run they removed 99% and 35% of manganese, respectively. Sand turned into MOCS after a certain period of filtration, while GAC did not. In MOCS, the manganese adsorption rate on the filter media was inversely proportional to the filter depth, while the density of media was proportional to the filter depth.

• 대한전자공학회논문지
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• 제25권5호
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• pp.495-500
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• 1988

The effectiveness of tri layer resist (TLR) technique is compared with that of single layer resist (SLR) technique in order to make a 0.8um pattern with the linewidth deviation of 10 percents. SLR technique is not appropriate to shape the micro-pattern on oxide and aluminum steps because of the standing wave effect and the light scattering effect in shaping the resist pattern. On the contrary, the uniform line with a width of 0.8um on oxide and aluminum steps can be formed by TLR technique, reducting such effects. The planarization and the light absorption coefficient of the bottom layer resist in TLR are optimized by exposing it to ultra violet light after baking it for 30min at 230\ulcorner. An uniform line with a width of 0.8um on oxide step is defined with the light absorption coefficient of 0.85 whereas that on aluminum step is defined with 0.95.

• Transactions on Electrical and Electronic Materials
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• 제7권5호
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• pp.267-270
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• 2006

The Indium tin oxide (ITO) films were deposited on CR39 substrate using DC magnetron sputtering. ITO thin films deposited at room temperature because CR39 substrates its glass-transition temperature of is $130^{\circ}C$. ITO thin films used bottom and top electrode and for organic thin film transparent transistor.(OTFT) ITO thin film electrodes electrical properties and optical transparency properties in the visible wavelength range (300 - 800 nm) strongly dependent on volume of oxygen percent. For the optimum resistivity and transparency of ITO thin film electrode achieved with a 75 W plasma power, 10 % volume of oxygen and a 27 nm/min deposition rate. Above 85 % transparency in the visible wavelength range (300 - 800 nm) measured without post annealing process and $9.83{times}10{-4}{\Omega}cm$ a low resistivity was measured thickness of 300 nm.

• 한국전기전자재료학회논문지
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• 제15권10호
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• pp.844-850
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• 2002

Linearly graded profiles on the field area oxide are frequently used in power integrated circuits to reduce the surface electric field when power devices are operated in forward or reverse blocking modes. It is shown here that tapered windows can be made using the difference of etch rates between the bottom and the top layer of TEOS film. Annealed TEOS films are etched at a lower rate than the TEOS film without annealing Process. The fast etching layer results in window walls having slopes in the range of 25$^{\circ}$∼ 80$^{\circ}$ with respect to the wafer surface. Taper etching technique by annealing the TEOS film applies to high voltage LDMOS, which is compatible with CMOS process, due to the minimum changes in both of design rules and thermal budget.

• 한국전기전자재료학회논문지
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• 제21권8호
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• pp.711-714
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• 2008

Metal-oxide-semiconductor (MOS) capacitors were fabricated to investigate the plasma damage caused by reactive ion etching (RIE) on (100) oriented silicon-on-insulator (SOI) substrates. The thickness of the top-gate oxide, SOI, and buried oxide layers were 10 nm, 50 nm, and 100 nm, respectively. The MOS/SOI capacitors with an etch-damaged SOI layer were characterized by capacitance-voltage (C-V) measurements and compared to the sacrificial oxidation treated samples and the reference samples without etching. The measured C-V curves were compared to the numerical results from corresponding 2-dimensional (2-D) structures by using a Silvaco Atlas simulator.

• 한국재료학회지
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• 제17권4호
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• pp.232-235
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• 2007

Indium tin oxide (ITO) films were deposited on polycarbonate CR39 substrate using DC magnetron sputtering. ITO thin films were deposited at room temperature because glass-transition temperature of CR39 substrate is $130^{circ}C$ ITO thin films are used as bottom and top electrodes and for organic thin film transparent transistor (OTFT). The electrodes electrical properties of ITO thin films and their optical transparency properties in the visible wavelength range (300-800 nm) strongly depend on the volume of oxygen percent. The optimum resistivity and transparency of ITO thin film electrode was achieved with a 75 W plasma power, 10 % volume of oxygen and a 27 nm/min deposition rate. Above 85% transparency in the visible wavelength range (300-800 nm) was measured without post annealing process, and resistivity as low as $9.83{\times}^{TM}10^{-4}{\Omega}$ cm was measured at thickness of 300 nm.

• 한국진공학회지
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• 제3권4호
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• pp.414-419
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• 1994

알루미늄 박편 위에 Pt/$Al_2O_3$ 모델 촉매를 만들었다. 알루미늄 표면을 $10 ^5Torr$의 산소 압력 하에서 산화시킨후 plasma evaporation source를 사용하여 Pt을 증착시켰다. 이 모델 촉매 표면에서 일 어나는 1-butene 의 반응을 연구하였다. 산화알루미늄 표면에서는 이성질화 반응이 일어 났으나 Pt을 증착시킨 산화알루미늄 표면에서는 수소첨가반응이 일어남이 관찰되었다. 알루미나 표면의 Pt이 증가함 에 따라 수소첨가반응으로서 선택성이 증가되었다.