• Journal of the Korean Ceramic Society
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• v.49 no.4
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• pp.333-336
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• 2012

The study to give electrical conductivity by dispersing carbon nanotubes (CNT) into silicon nitride ($Si_3N_4$) ceramics has been carried out in recent years. However, the density and the strength of $Si_3N_4$ ceramics were degraded and CNTs disappeared after firing at high temperatures because CNTs prevent $Si_3N_4$ from densification and there is a possibility that CNTs react with $Si_3N_4$ or $SiO_2$. In order to suppress the reaction and the disappearance of CNTs, lower temperature densification is needed. In this study, $HfO_2$ and $TiO_2$ was added to $Si_3N_4-Y_2O_3-Al_2O_3$-AlN system to fabricate CNT-dispersed $Si_3N_4$ ceramics at lower temperatures. $HfO_2$ promotes the densification of $Si_3N_4$ and prevents CNT from disappearance. As a result, the sample by adding $HfO_2$ and $TiO_2$ fired at lower temperatures showed higher electrical conductivity and higher bending strength. It was also shown that the mechanical and electrical properties depended on the quantity of the added CNTs.

• Journal of the Korean Society for Heat Treatment
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• v.22 no.5
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• pp.267-274
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• 2009

Titanium Chromium Nitrided (TiCrN) coatings were deposited on stainless steel 316 L and Si (100) wafer by inductively coupled plasma assisted D.C. magnetron sputtering at the various sputtering power on Cr target and $N_2/Ar$ gas ratio. Increasing the sputtering power of Cr target, XRD patterns were changed from TiCrN to nitride $Cr_2Ti$. The maximum hardness was $Hk_{3g}$ 3900 at $0.3\;N_2/Ar$ gas ratio. The thickness of the TiCrN films increased as the Cr target power increased, and it showed over $Hk_{5g}3100$ hardness at 100 W, 150 W. TiCrN films were deposited by the ICP assisted DC magnetron sputtering shown good wear resistance as the $N_2/Ar$ gas ratio was 0.1, 0.3.

• International Journal of Ocean System Engineering
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• v.2 no.2
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• pp.106-115
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• 2012

In the present study, TiN and CrN films were coated by arc ion plating equipment onto aluminum alloy substrate, A2024. The film thickness was about 4.65 ${\mu}m$. TiN and CrN films were analyzed by X-ray diffraction and energy dispersive X-ray equipments. The Young's modulus and the micro-Vickers hardness of aluminum substrate were modified by the ceramic film coatings. The difference in Young's modulus between substrate and coating film would affect on the wear resistance. The critical load, Lc, was 75.8 N for TiN and 85.5 N for CrN. It indicated from the observation of optical micrographs for TiN and CrN films that lots of cracks widely propagated toward the both sides of scratch track in the early stage of MODE I. TiN film began to delaminate completely at MODE II stage. The substrate was finally glittered at MODE III stage. For CrN film, a few crack can be observed at MODE I stage. The delamination of film was not still occurred at MODE II and then was happened at MODE III. This agrees with critical load measurement which the adhesive strength was greater for CrN film than for TiN film. Consequently, it was difficult for CrN to delaminate because the adhesive strength was excellent against Al substrate. The wear process, which the film adheres and the ball transfers, could be enhanced because of the increase in loading. The wear weight of ball was less for CrN than for TiN. This means that the wear damage of ball was greater for TiN than for CrN film. It is also obvious that it was difficult to delaminate because the CrN coating film has high toughness. The coefficient of friction was less for CrN coating film than for TiN film.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.3
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• pp.1253-1258
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• 2014

The tribological properties of TiC, TiN and TiC/TiN coatings on steels prepared by the cathodic-arc (CA) ion plating technique were investigated. Experiments were carried out on a tribo-test machine using a Falex journal V block system. The friction and wear characteristics of the coatings were determined by varying the applied load and sliding speed. The TiC, TiN and TiC/TiN coatings markedly increased the tribological characteristics of the surface. As far as a single layer coating was concerned, TiN goes better results than TiC. However, the TiC/TiN multilayer coating performed better than either single layer coating. The major factor in the improved performance of the multilayer coating was the role of TiC in improving the adhesion between the external TiN layer and the substrate steel.

• Journal of Powder Materials
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• v.17 no.2
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• pp.142-147
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• 2010

The ultrafine titanium carbonitride ($TiC_xN_y$) particles below 100 nm in mean size, including various carbon and nitrogen contents (x=0.55~0.9, y=0.1~0.5), were successfully synthesized by new Mg-thermal reduction process. Nanostructured sub-stoichiometric titanium carbide ($TiC_x$) particles were initially produced by the magnesium reduction of gaseous $TiCl_4+x/2C_2Cl_4$ at $890^{\circ}C$ and post heat treatments in vacuum were performed for 2 hrs to remove residual magnesium and magnesium chloride mixed with $TiC_x$. Finally, well C/N-controled $TiC_xN_y$ phases were successfully produced by nitrification heat treatment under normal $N_2$ gas atmosphere at $1150^{\circ}C$ for 2 hrs. The values of purity, mean particle size and oxygen content of produced particles were about 99.3%, 100 nm and 0.2 wt.%, respectively.

• Journal of Welding and Joining
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• v.25 no.2
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• pp.62-69
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• 2007

A kinetic model fur the particle coarsening behavior was developed. The proposed model considered the critical particle size which can be derived from Gibbs-Thomson equation unlike the conventional approach. In this study, the proposed particle coarsening model was applied to study the coarsening behavior of titanium nitride (TiN particle) in microalloyed steel weld HAZ. Particle size distributions and mean particle size by the proposed model were in agreement with the experimental results. Meanwhile, using additivity rule, the isothermal model was extended to predict particle coarsening behavior during continuous thermal cycle.

• Journal of the Korean Society for Precision Engineering
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• v.26 no.8
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• pp.112-118
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• 2009

A pressure rise is generated while air bearing stages are moving in high vacuum environment. This study analyzed this pressure rise phenomenon theoretically and verified it experimentally using two different kinds of stages - linear and rotary air bearing stages. Results indicate that the pressure rise was caused by additional leakage resulting from stage velocity, along with adsorption and outgassing of gas molecules from the guide rail surface. Though tilting of the stage due to acceleration and deceleration reached several micrometers, it had a negligible effect on pressure rise because the tilting time was very short. Therefore, a rotary air bearing stage showed much less pressure rise than a linear stage because the rotary stage theoretically has nothing to do with the above causes. Additional leakage caused by stage velocity was inevitable if the stage had movements, but pressure rise caused by adsorption and outgassing could be suppressed by improving the surface quality to reduce real surface area, and by coating the guide rail surface with titanium nitride (TiN) which has less adhesion probability of gas molecules. The results also indicate that the pressure rise increased when the air bearing stage operated under high vacuum conditions.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.7
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• pp.660-664
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• 2008

Titanium nitride (TiN) thin films are widely used for hard coatings due to their superior hardness, chemical stability, low friction and good adhesion properties. In this study, we investigated the effect of DC power on the characteristics of TiN thin films deposited on Si and glass substrates by DC magnetron sputtering using TiN target. We made TiN films of 300 nm thickness with various DC powers. The structural properties of films are investigated by x-ray diffractions (XRD) and tribological properties are measured by nano-indentation, nano-scratch tester. The rms roughness was measured by atomic forced microscopy (AFM). In the result, TiN films had the smooth surface and exhibited (111) directions with the increase of DC Power. Also, especially in case of 175 W DC power, TiN film exhibited the maximum hardness about 8 GPa, and the critical load near 25.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.10 no.4
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• pp.96-101
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• 2011

The thin films of TiN have been used extensively as wear-resistant materials, for instance, such as tools of high-speed cutting, metal mold forming etc. In these days, because the thin films capable of being used more severe conditions are needed, the technologies of arc ion plating are tried to improve its characteristics. The purpose of this study is to investigate the characteristics of thin films of (Ti,Cr)N compared with those of TiN. The method of arc ion plating, which is known as showing good tight-adherence and productivity, was used. After manufacturing thin films of ($Ti_{1-x}Cr_{x}$)N (x=0~1) with change of Cr in (Ti,Cr) target, atomic concentration, structure, size of crystallite, residual stress and surface roughness of thin films on substrate were investigated. As the results, it was confirmed that Cr atomic concentrations of thin films were proportionally changed with Cr atomic concentrations of target, and thin films of ($Ti_{1-x}Cr_{x}$)N (x=0~1) showed NaCl type and CrN existed as solid solution to TiN.

• Journal of the Korean Vacuum Society
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• v.6 no.4
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• pp.314-320
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• 1997

A chemical reaction and electronic structure change at the interface between copper and titanium nitride were investigated by XPS. A thin Cu layer was deposited on a TiN substrate oxidized by exposure to air at room temperature. We observed the Ti(2p), O(1s), N(1s), Cu(2p) core-level, and Cu LMM Auger line spectra. With increasing of the thickness of Cu layer, these spectra do not show any changes in the line shape as well as in peak position. In addition, the valence band spectra in XPS do not show any changes, which indicates that Cu does not react with Ti, N, and O. This inreactivity of Cu might cause a poor adhesion between Cu and TiN.