1 |
F. Vaz, J. Ferreira, E. Ribeiro, L. Rebouta, S. Lanceros-Méndez, J. A. Mendes, E. Alves, Ph. Goudeau, et al, 'Influence of nitrogen content on the structural, mechanical and electrical properties of TiN thin films', Surf. Coat. Tech., Vol. 191, p. 317, 2002
DOI
ScienceOn
|
2 |
송찬일, 김창석, 정천옥, 김병안, 'TiN이 증착된 SiO/TiN 박막의 전압-전류 특성', 전기전자재료학회논문지, 12권, 2호, p. 145, 1999
|
3 |
이근우, 박수진, 유정주, 권영호, 김주연, 전형탁, 배규식, ' 분위기에서 Ti 질화에 의한 TiN 형성', 전기전자재료학회논문지, 17권, 2호, p. 150, 2004
|
4 |
김창조, 조병철, 김좌연, 윤희종, 이재길, 'Cu와 Si 사이에서 확산 방지막으로 사용하기 위한 TiN/Zr(N)/TiN 다층박막의 연구', 전기전자재료학회논문지, 12권, 8호, p. 663, 1999
|
5 |
K.-Y. Chan and B.-S. Teo, 'Atomic fore microscopy (AFM) and X-ray diffraction (XRD) investigations of copper thin films prepared by dc maganetron sputtering technique', Microelectronics Journal, Vol. 35, p. 1064, 2006
|
6 |
T. Polcar, T. Kubart, R. Novák, L. Kopecky, and P. Siroky, 'Comparison of tribological behaviour of TiN, TiCN and CrN at elevated temperatures', Surf. Coat. Tech., Vol. 193, p. 192, 2005
DOI
ScienceOn
|
7 |
J. Y. Yun, B. H. Kim, J. H. Seo, J. M. Lee, S. B. Kang, G. H. Choi, U. I. Chung, and J. T. Moon, 'Investigation of the contact resistance between Ti/TiN and Ru in metal-1/plate contacts of ruthenium insulator silicon capacitor', Jpn. J. Appl. Phys., Vol. 42, p. 1874, 2003
DOI
|
8 |
M. Nakamura, T. Aoki, Y. Hatanaka, D. Korzec, and J. Engemann, 'Comparison of hydrophilic properties of amorphous TiOx films obtained by radio frequency sputtering and plasma-enhanced chemical vapor deposition', J. Mater. Resi., Vol. 16, p. 621, 2001
DOI
ScienceOn
|
9 |
W. Zhou, X. Zhong, X. Wu, L. Yuan, Z. Zhao, H. Wang, Y. Xia, Y. Feng, J. He, and Wangtao, 'The effect of surface roughness and wettability of nanostructured film on TCA-8113 epithelial-like cells', Surf. Coat. Tech., Vol. 200, p. 6155, 2006
DOI
ScienceOn
|
10 |
Efeoglu and R. D. Arnellb, 'Multi-pass sub-critical load testing of titanium nitride coatings', Thin Solid Films, Vol. 377-378, p. 346, 2000
DOI
ScienceOn
|
11 |
A. Kagiyama, K. Terakadoa, and R. Uraob, 'Effect of nitriding and TiN coating temperatures on the corrosion resistance of the combined surface modification layer', Surf. Coat. Tech., Vol. 169-170, p. 397, 2003
DOI
ScienceOn
|
12 |
J. W. Uhm and H. T. Jeon, 'TiN Diffusion barrier grown by atomic layer deposition method for Cu metallization', Jpn. J. Appl. Phys., Vol. 40, p. 4657, 2001
DOI
|