• Korean Journal of Metals and Materials
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• v.49 no.11
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• pp.845-852
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• 2011

The Spark Plasma Sintering(SPS) method offers a means of fabricating a sintered-body having high density without grain growth through short sintering time and a one-step process. A titanium compact having high density and purity was fabricated by the SPS process. It can be used to fabricate a Ti sputtering target with controlled parameters such as sintering temperature, heating rate, and pressure to establish the optimized processing conditions. The compact/target(?) has a diameter of ${\Phi}150{\times}6.35mm$. The density, purity, phase transformation, and microstructure of the Ti compact were analyzed by Archimedes, ICP, XRD and FE-SEM. A Ti thin-film fabricated on a $Si/SiO_2$ substrate by a sputtering device (SRN-100) was analyzed by XRD, TEM, and SIMS. Density and grain size were up to 99% and below $40{\mu}m$, respectively. The specific resistivity of the optimized Ti target was $8.63{\times}10^{-6}{\Omega}{\cdot}cm$.

• Journal of the Korean Vacuum Society
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• v.12 no.3
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• pp.168-173
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• 2003

Recently, according to the rapid progress in Flat-panel-display industry, there has been a growing interest in the poly-Si process. Compared with a-Si, poly-Si offers significantly high carrier mobility, so it has many advantages to high response rate in Thin Film Transistors (TFT's). We have investigated a new process for the high temperature Solid Phase Crystallization (SPC) of a-Si films without any damages on glass substrates using thin film heater. because the thin film heater annealing method is a very rapid thermal process, it has very low thermal budget compared to the conventional furnace annealing. therefore it has some characteristics such as selective area crystallization, high temperature annealing using glass substrates. A 500 $\AA$-thick a-Si film was crystallized by the heat transferred from the resistively heated thin film heaters through $SiO_2$ intermediate layer. a 1000 $\AA$-thick $TiSi_2$ thin film confined to have 15 $\textrm{mm}^{-1}$ length and various line width from 200 to 400 $\mu\textrm{m}$ was used as the thin film heater. By this method, we successfully crystallized 500 $\AA$-thick a-Si thin films at a high temperature estimated above $850^{\circ}C$ in a few seconds without any thermal deformation of g1ass substrates. These surprising results were due to the very small thermal budget of the thin film heaters and rapid thermal behavior such as fast heating and cooling. Moreover, we investigated the time dependency of the SPC of a-Si films by observing the crystallization phenomena at every 20 seconds during annealing process. We suggests the individual managements of nucleation and grain growth steps of poly-Si in SPC of a-Si with the precise control of annealing temperature. In conclusion, we show the SPC of a-Si by the thin film heaters and many advantages of the thin film heater annealing over other processes

• Journal of Welding and Joining
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• v.28 no.3
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• pp.92-98
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• 2010

Ferritic stainless steels, which have relatively small thermal expansion coefficient and excellent corrosion resistance, are increasingly being used in vehicle manufacturing, in order to increase the lifetime of exhaust manifold parts. But, there are limits on use because of the problem related to cosmetic resistance, corrosions of condensation and high temperature salt etc. So, Aluminum-coated stainless steel instead of ferritic stainless steel are utilized in these parts due to the improved properties. In this investigation, Al-8wt% Si alloy coated 409L ferritic stainless steel was used as the base metal during Gas Tungsten Arc(GTA) welding. The effects of coated layer on the microstructure and hardness were investigated. Full penetration was obtained, when the welding current was higher than 90A and the welding speed was lower than 0.52m/min. Grain size was the largest in fusion zone and decreased from near HAZ to base metal. As welding speed increased, grain size of fusion zone decreased, and there was no big change in HAZ. Hardness had a peak value in the fusion zone and decreased from the bond line to the base metal. The highest hardness in the fusion zone resulted from the fine re-precipitation of the coarse TiN and Ti(C, N) existed in the base metal during melting and solidification process and the presence of fine $Al_2O_3$ and $SiO_2$ formed by the migration of the elements, Al and Si, from the melted coating layer into the fusion zone.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.5
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• pp.415-420
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• 2008

AAO films were fabricated on two kinds of substrates such as $Al/SiO_2/Si$ and Al/Ni/Ti/Si. To obtain well-aligned AAO film, we optimized process condition for buffer layer, electrolyte and voltage. In the case of oxalic acid, the AAO film with pore size of approximately 45 nm was obtained at voltage of 40 V, temperature of $10^{\circ}C$, oxalic acid of 0.3 M and widening time of 60 min. Then the thickness of barrier is less than 600 nm. In the case of sulfuric acid, the AAO film has pore size of 40 nm and barrier thickness of 400 nm with optimum conditions such as voltage of 25 V, temperature of $8^{\circ}C$, sulfuric acid of 0.3 M and widening time of 60 min.

• Journal of the Korean Ceramic Society
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• v.33 no.10
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• pp.1101-1108
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• 1996

No-doped PZT thin films have been fabricated on Pt/Ti/SiO2/Si substrate using Sol-Gel technique. A fast annealing metho (three times of intermediate and final annealing) was used for the preparation of multi-coated 1800$\AA$ thick Nb-doped PZT thin films. As Nb doping percent was increased leakage current was lowered approximately 2 order but dielectic properties were degraded due to the appearance of pyrochlore phase and domain pinning. Futhermore the increase of the final annealing temperature up to 74$0^{\circ}C$lowered the pyrochlore phase content resulting in enhancing the dielectric properties of the Nb doped films. The 3%-Nb doped PZT thin films with 5% excess Pb showed a capacitance density of 24.04 fF/${\mu}{\textrm}{m}$2 a dielectric loss of 0.13 a switchable polarization of 15.84 $\mu$C/cm2 and a coercive field of 32.7 kV/cm respectively. The leakage current density of the film was as low as 1.47$\times$10-7 A/cm2 at the applied voltage of 1.5 V.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.176.2-176.2
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• 2014

In this work, we demonstrated that the fabrication of flexible graphene-based chemical sensor with heaters by soft lithographic patterning method [1]. First, monolayer and multilayer graphene were prepared by thermal chemical vapor deposition transferred onto SiO2 / Si substrate in order to fabrication of patterned-sensor and -heater. Second, patterned-monolayer and multilayer graphene were detached through soft lithography process, which was transferred on top and bottom sides of PET film. Third, Au / Ti (Thickness : 100/30 nm) electrodes were deposited end of the patterned-graphene line by sputtering system. Finally, we measured sensor properties through injection of NO2 and CO2 gas on different temperature with voltage change of graphene heater.

• Journal of Ceramic Processing Research
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• v.22 no.2
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• pp.214-220
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• 2021

Heterolayered potassium tantalate niobate(KTN(70/30)/KTN(30/70)) thin films on Pt/Ti/SiO2/Si substrates prepared by the sol-gel process and spin coating method. When sintered at 700 ℃ or higher, the X-ray diffraction intensities of the perovskite phase were greatly increased, and it was observed as the main phase of the KTN heterolayered thin film. As the sintering temperature increased from 650 ℃ to 800 ℃, the average grain size increased from 146nm to 380 nm, and the average thickness of the KTN films coated six times was about 394-441 nm. Dielectric constant and dielectric loss of the KTN film sintered at 750 ℃ and room temperature showed good properties of about 2850 and 0.573, respectively, and all films exhibited the typical dielectric relaxation characteristics. The phase transition temperature of KTN thin film was around 12-13 ℃. Remanent polarization and the coercive field of KTN film sintered at 750 ℃ showed excellent properties of 23.98 μC/cm2 and 35.41 kV/cm, respectively. Adiabatic temperature changes (ΔT) and electrocaloric strength of the KTN films sintered at 750 ℃ at 60 ℃ were 2.67℃ and 0.012 KcmkV-1, respectively.

• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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• 2002.10a
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• pp.373-378
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• 2002

Metal matrix composites have a great interest in recent years because high specific strength, high specific stiffness characteristics, and application ranges of the composites are extend to variety industry. In this paper, an investigation was performed on the plane strain fracture toughness and slinding wear properties of AC4CH alloy(Al-Si-Mg line) reinforced with 20wt% aluminum borate whisker expect one, which contained a inorganic binder($TiO_2$). the binder led to the formation of strengthen the whisker each other. The test of fracture toughness was using CT(half size) specimen of thickness 12.5mm, width 25mm. and test of slinding wear of using tribo a pin-on-disk machine and lubricant is used without paraffine 8.2CST at room temperature. As results, Fracture toughness $K_{IC}$ is $8.7MPa-m^{05}$ for ABOw/AC4CH, $9.28MPa-m^{05}$ for ABOw/AC4CH added $TiO_2$. but AC4CH alloy was violated the critical stipulated by ASTM standard for valid measurement of $K_{IC}$. In case of, it was performed $J_{IC}$ test instead of $K_{IC}$ based on ASTM E 1820.

• ETRI Journal
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• v.27 no.5
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• pp.551-556
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• 2005

We have demonstrated a high-power widely tunable sampled grating distributed Bragg reflector (SGDBR) laser integrated monolithically with a semiconductor optical amplifier (SOA) having a lateral tapered waveguide, which is the first to emit a fiber-coupled output power of more than 10 dBm using a planar buried heterostructure (PBH). The output facet reflectivity of the integrated SOA using a lateral tapered waveguide and two-layer AR coating of $TiO_2\;and\;SiO_2$ was lower than $3\;{\times}\;10^{-4}\;over$ a wide bandwidth of 85 nm. The spectra of 40 channels spaced by 50 GHz within the tuning range of 33 nm were obtained by a precise control of SG and phase control currents. A side-mode suppression ratio of more than 35 dB was obtained in the whole tuning range. Fiber-coupled output power of more than 11 dBm and an output power variation of less than 1 dB were obtained for the whole tuning range.

• Journal of the Korean Ceramic Society
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• v.38 no.3
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• pp.274-279
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• 2001

Pt/Ti/Si 기판 위에 성장시킨 박막 전지용 비정질 산화 바나듐 박막에 고상 전해질 박막 LiPON을 이용하여 전고상형 박막전지를 제작하여 충-방전 시험을 시행하였다. 이렇게 제작된 전고상형 박막전지는 500 사이클 이상까지 평균 15$\mu$Ah의 방전용량을 나타내었으나 초기 사이클 영역부터 방전 용량의 감소가 일어나기 시작했다. 박막 전지의 방전 용량 감소에 따른 비정질 산화 바나듐 박막의 구조적 특성 변화를 관찰하기 위하여 고분해능 현미경 분석을 시행하였다. 충-방전을 하지 않은 초기의 산화 바나듐 박막은 입계를 갖지 않고 다결정 특성을 보이지 않는 완전한 비정질 특성을 보였고 이는 TED 결과와 일치하였다. 그러나 450번의 반복적인 충-방전을 시행한 후의 비정질 산화 바나듐 박막 내에는 microcrystalline 형태의 산화 바나듐의 형성됨을 고분해능 전자 현미경 분석을 통해 발견할 수 있었다. 비정질 산화바나듐 박막의 방전 용량 감소의 원인인 Li의 비가역적 탈-삽입은 비정질 내에 형성된 microcrystalline에 의해 유발된다고 사료된다. 또한 LiPON 전해질 박막과 산화 바나듐 박막사이의 계면에 Li 이온과 산화바나듐과의 반응에 의해 형성된 계면 층에 발견할 수 있었는데 이러한 계면 층 역시 Li 확산과 계면 저항에 영향을 주어 방전 용량 감소에 원인으로 작용한다.