• Journal of the Korean Ceramic Society
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• v.35 no.7
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• pp.749-756
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• 1998

TiC-Ni and TiC-Ni-Mo cermet powders were produced by Self-propagating High temperature Synthesis (SHS) process. The cooling rate of synthesized powders were controlled by using the V-shaped copper jig and the carbide size decreased with increasing the cooling rate I. e decreasing the width of copper jig Round shape carbide particles were produced after SHS reaction in TiC-Ni as well as TiC-Ni-Mo powders. Local segregation of Mo rich phases was observed in SHS powder of TiC-Ni-Mo and the uneven dis-triobution of Mo promoted the faster growth rate of carbide particles during sintering compared to the same composition specimen with commercial TiC powder. Howogeneous microstructure of TiC-Ni-Mo cermet was obtained when the elemental Mo powder was mixed with the SHS powder of TiC-Ni.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2002.11a
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• pp.8-8
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• 2002

TiC core/(Ti,Mo)C rim structure in TiC-$Mo_2C$-Ni base cermet which is generally prepared by sintering below 145$0^{\circ}C$ had been believed to be generated by the solid diffusion of Mo atoms 1 into TiC grains (D. Moskowitz and M.Humenik, 1r.:1966). Afterward, it was clarified that the c core/rim structure is generated by solution/re-precipitation mechanism : (1) $Mo_2C$ grains and s small TiC grains dissolve into the Ni liquid, (2) the dissolved Mo, Ti and C atoms migrate to the s surface of TiC coarse grains, (3) the Mo, Ti and C precipitate on the surface of TiC coarse g grains and form (Ti,Mo)C solid solution rim, and (4) the Ostwald ripening (grain growth by s solution/re-precipitation mechanism) of TiC-core/(Ti,Mo)-rim grains continues, and thus the w width of (Ti,Mo)C rim (at the same time, the grain size) increases with sintering time, etc. ( (H.Suzuki, K.Hayashi and O.Terada: 1973). The TiC-core was found not to disappear even by s sintering at 190$0^{\circ}C$ (ibid.: 1974) Recently, FeSi core/$Fe_2Si_5$-rim structure in Fe-66.7at%Si thermoelectric aIloy was found to also h hardly shrink and disappear by long heating at an appropriate temperature (1999: M.Tajima and K K.hayashD. Then, the authors considered its cause, and clarified experimentaIly that the disappearance of FeSi-core/$Fe_2Ski_5$-rim structure could be attributed to the exhaustion of diffusion-contributable vacancies in core/rim structure (N.Taniguchi and K.Hayashi:2001). At p present, the authors and my coworker are investigating whether the non-disappearance of TiC c core can be explained also from the new hypothesis "Exhaustion of diffusion-contributable v vacancies in corelrim structure".ure".uot;.

• Korean Journal of Materials Research
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• v.23 no.11
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• pp.620-624
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• 2013

Nanocrystalline materials have recently received significant attention in the area of advanced materials engineering due to their improved physical and mechanical properties. A solid-solution nanocrystalline powder, (Ti,Mo)C, was prepared via high-energy milling of Ti-Mo alloys with graphite. Using XRD data, the synthesis process was investigated in terms of the phase evolution. Rapid sintering of nanostuctured (Ti,Mo)C hard materials was performed using a pulsed current activated sintering process (PCAS). This process allows quick densification to near theoretical density and inhibits grain growth. A dense, nanostructured (Ti,Mo)C hard material with a relative density of up to 96 % was produced by simultaneous application of 80 MPa and a pulsed current for 2 min. The average grain size of the (Ti,Mo)C was lower than 150 nm. The hardness and fracture toughness of the dense (Ti,Mo)C produced by PCAS were also evaluated. The fracture toughness of the (Ti,Mo)C was higher than that of TiC.

• Journal of Powder Materials
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• v.13 no.1 s.54
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• pp.10-17
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• 2006

Model experiment was introduced to obtain the formation of a core/rim structure by only liquid phase reaction in Ti(C, N)-based cermet alloys. Infiltrated Ti(C, N)-Ni, $MO_2C-Ni$, and TaC-Ni cermets were bonded to sandwiched specimen by heat treatment $1450^{\circ}C$ for 5hr. With nitrogen addition, both (Ti, Mo) (C, N) and (Ti, Ta) (C, N) rim structure was nucleated around comer of cuboidal Ti(C, N) core. However, equilibrium shapes of(Ti, Mo) (C, N) and (Ti, Ta) (C, N) rim were different possibly due to the effect of interface energy. The core/rim and rim! binder interfaces were parallel to each other with TaC addition, while rotated to each other with $MO_2C$ addition.

• The Korean Journal of Ceramics
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• v.5 no.3
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• pp.230-234
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• 1999

Ti(CN)-0.3mole% $Mo_2C$ ceramics were prepared by pressureless sintering. $Mo_2C$ dissolved in Ti(CN) more easily in a nitrogen environment than in the other environment because nitrogen forced Mo to form a solid solution, (Ti, No)(C, N). A "core-rim" structure developed within the grains. The boundary between the "core" and the rim was delineated by thermal etching in the sample with more than 2 mole% $Mo_2C$. The rim thickness and the grain size decreased as the $Mo_2C$ content increased. The hardness and the flexural strength showed maxima of 18.2 GPa and 1.23 GPa, respectively when the $Mo_2C$ content was 2 mole%. The post-sintering heat treatments improved the properties.oved the properties.

• Korean Journal of Materials Research
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• v.17 no.9
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• pp.484-488
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• 2007

Mo(Ti) alloy and pure Cu thin films were subsequently deposited on $SiO_2-coated$ Si wafers, resulting in $Cu/Mo(Ti)/SiO_2$ structures. The multi-structures have been annealed in vacuum at $100-600^{\circ}C$ for 30 min to investigate the outdiffusion of Ti to Cu surface. Annealing at high temperature allowed the outdiffusion of Ti from the Mo(Ti) alloy underlayer to the Cu surface and then forming $TiO_2$ on the surface, which protected the Cu surface against $SiH_4＋NH_3$ plasma during the deposition of $Si_3N_4$ on Cu. The formation of $TiO_2$ layer on the Cu surface was a strong function of annealing temperature and Ti concentration in Mo(Ti) underlayer. Significant outdiffusion of Ti started to occur at $400^{\circ}C$ when the Ti concentration in Mo(Ti) alloy was higher than 60 at.%. This resulted in the formation of $TiO_2/Cu/Mo(Ti)\;alloy/SiO_2$ structures. We have employed the as-deposited Cu/Mo(Ti) alloy and the $500^{\circ}C-annealed$ Cu/Mo(Ti) alloy as gate electrodes to fabricate TFT devices, and then measured the electrical characteristics. The $500^{\circ}C$ annealed Cu/Mo($Ti{\geq}60at.%$) gate electrode TFT showed the excellent electrical characteristics ($mobility\;=\;0.488\;-\;0.505\;cm^2/Vs$, on/off $ratio\;=\;2{\times}10^5-1.85{\times}10^6$, subthreshold = 0.733.1.13 V/decade), indicating that the use of Ti-rich($Ti{\geq}60at.%$) alloy underlayer effectively passivated the Cu surface as a result of the formation of $TiO_2$ on the Cu grain boundaries.

• Journal of Powder Materials
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• v.6 no.1
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• pp.62-68
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• 1999

The effects of the carbon content ranging from 17.5 to 21.0 wt.% in TiC-30vol.% $Ni_3Al$ cenmet and the $Mo_2C$ content raging from 0 to 30 wt.% in TiC-20 vol.% $Ni_3Al$ cermet were investigated in the relation to the microstures and harbness. The speciment were sintered at 140$0^{\circ}C$, 143$0^{\circ}C$ and 145$0^{\circ}C$ for 60minutes. The results were summarized as follows; 1) The shrinkages and relative densitites of the specimens were incrased up to 20.0 wt.% C and then decreased. 2) The grains of TiC were almost the same size with the different content of carbon. Free carbons were appeared on the microstrures when carbon was added over 20.5 wt.% while TiC and $Ni_3Al$l were formed when carbon was added below 20.0 wt.%; 3) The lattice parameters of the $Ni_3Al$ and TiC phases were increased up to 20.5 wt.% C, and then saturated. 4) The hardess was increased up to 20.0 wt.% C, and then decreased. 5) The $Mo_2C$ made the TiC grains fine and the surrounding structure around TiC gains. 6) The micropores were decreased with increasing the binder and the sintering temperature. 7) The lattice parameter of the $Ni_3Al$l ana TiC were almost the samp up to 10 wt.% $Mo_2C$ and then decreased. 8) The hatdness was increased up to 5wt.% $Mo_2C$ and then decreased owing to the micrpores. 9) The more the binder phase, the higher the relative density and the proper $Mo_2C$ amount of $TiC-Ni_3Al$ cermets were obtained.

• Journal of Powder Materials
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• v.6 no.2
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• pp.178-185
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• 1999

MoSi$_2$-TiC composite powders were fabricated by in-situ reaction through mechanical alloying. Also the monolithic MoSi$_2$ as well as TiC were synthesiced by mechanical alloying for comparison. An abrupt increase of vial surface temperature was detected due to a sudden reaction between elemental powders during milling. The reaction time for synthesis of composite powders decreased with increasing the content of (Ti+C) powder. It was found that a significant decrease of Ti grain size was observed with increasing the milling time. And the synthesis reaction of MoSi$_2$-TiC composite powders were largely dependent on the reaction between Ti and C powders.

• Journal of the Korean Ceramic Society
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• v.36 no.4
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• pp.451-458
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• 1999

TiC-Mo2C composites were prepared from Ti-C-Mo system by HPCS which has a great advantage of simulataneous synthesis and sintering In this study physical properties and microstructures of the com-posites were measured and observed to compare the sintering effects of Ni and Co each other : The results showed that the role of 5 wt% Ni in the sintering of the carbide composites was superior to that of 5wt% Co and the optimum content of Mo in the Ti-C-Mo system was 20wt% The carbide composites prepared under these two conditions had the best properties with 1.0% in apparent porosity 97.6% in relative density 19.1GPa in Vickers hardness and 5.3MPa$.$m1/2 in fracture toughness.

• Analytical Science and Technology
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• v.5 no.3
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• pp.319-325
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• 1992

Plasma are melting method was used in making Mo-1.17 Ti-0.18 Zr-0.06 C ingot having over 99% of the theoretical density. Oxygen content herewith, decreased from the origin of 830ppm to 40ppm. After cold rolling of Mo alloy by 50%, the recrystallization behaviors were studied in the temperature range from $800^{\circ}C$ to $2100^{\circ}C$ for 1 hr isochronical holding time and also at $1400^{\circ}C$, $1500^{\circ}C$, $1600^{\circ}C$ for varying isothermal holding time 0 to 108000sec. The complete recrystallization temperature of Mo was $1400^{\circ}C$ but that of Mo alloy was $1700^{\circ}C$. 50%-1 hr recrystallization temperature of Mo alloy sheet was about $1500^{\circ}C$ and when compared to Mo there was an increase of over $300^{\circ}C$. The activation energy of recrystallization of Mo alloy sheet was 508kJ/mol.