• Korean Journal of Plant Resources
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• v.4 no.2
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• pp.39-45
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• 1991

Proximate compositions of the roots of cultured and wild Codonopsis lanceolata were examined as tile basic reasearch for the study of their source of processed foods.No significant difference in the contents was found between the wild root and thecultivated at 3$0^{\circ}C$ in biotronroom. In view of the results to have measured mineralswhich is included in 14 sorts of Codonopsis lanceolata and surveyed their distribution.12 kinds of minerals including T1, Co, Ge, Sm, Mo, Sc, Be, Cd, As, Ga, Bi, ph are ne-vel or little included in almost source. Other twenty-one sorts of minerals (Ni, Se,Ba, Sb, Si, Ti, B, Li, Ifs, Ca, Sr, Mn, Fe, Cu, Zn, p, Al, Na, V, Cr, K) are more or less in-cluded in all source and Ca, Mg, p, K, and Fe are metals that are included in large qu-entities in comparison with others. No minerals difference in the contents was foundbetween the cultivated temperature. The content of elements of inorganic metal differsaccording to the part of C. lanceolata.

• Journal of the Mineralogical Society of Korea
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• v.11 no.1
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• pp.20-31
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• 1998

Adsorption of metal elements onto illite and halloysite was investigated at $25^{\circ}C$ using pollutant water collected from the gold-bearing metal mine. Incipient solution of pH 3.19 was reacted with clay minerals as a function of time: 10 minute, 30 minute, 1 hour, 12 hour, 24 hour, 1 day, 2 day, 1 week, and 2 week. Twenty-seven cations and six anions from solutions were analyzed by AAs (atomic absorption spectrometer), ICP(induced-coupled plasma), and IC (ion chromatography). Speciation and saturation index of solutions were calculated by WATEQ4F and MINTEQA2 codes, indicating that most of metal ions exist as free ions and that there is little difference in chemical species and relative abundances between initial solution and reacted solutions. The adsorption results showed that the adsorption extent of elements varies depending on mineral types and reaction time. As for illite, adsorption after 1 hour-reaction occurs in the order of As>Pb>Ge>Li>Co, Pb, Cr, Ba>Cs for trace elements and Fe>K>Na>Mn>Al>Ca>Si for major elements, respectively. As for halloysite, adsorption after 1 hour-reaction occurs in the order of Cu>Pb>Li>Ge>Cr>Zn>As>Ba>Ti>Cd>Co for trace elements and Fe>K>Mn>Ca>Al>Na>Si for major elements, respectively. After 2 week-reaction, the adsorption occurs in the order of Cu>As>Zn>Li>Ge>Co>Ti>Ba>Ni>Pb>Cr>Cd>Se for trace elements and Fe>K>Mn>Al, Mg>Ca>Na, Si for major elements, respectively. No significant adsorption as well as selectivity was found for anions. Although halloysite has a 1:1 layer structure, its capacity of adsorption is greater than that of illite with 2:1 structure, probably due to its peculiar mineralogical characteristics. According to FTIR (Fourier transform infrared spectroscopy) results, there was no shift in the OH-stretching bond for illite, but the ν1 bond at 3695 cm-1 for halloysite was found to be stronger. In the viewpoint of adsorption, illite is characterized by an inner-sphere complex, whereas halloysite by an outer-sphere complex, respectively. Initial ion activity and dissociation constant of metal elements are regarded as the main factors that control the adsorption behaviors in a natural system containing multicomponents at the acidic condition.

• Economic and Environmental Geology
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• v.26 no.1
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• pp.107-114
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• 1993

For the blue sapphires from Santung, China, the color change before and after has been investigated by UV-Visible spectrophotometry method. The blue sapphires from Shantung show four groups of absorption bands: the bands A (374, 386 and 450 nm) being attributed to single $Fe^{3+}$ ion, the band B (560, 579 and $704n{\breve{m}}$) to $Fe^{2+}$/$Ti^{4+}$ pairs, the band C (-800 nm) to $Fe^{2+}$/$Fe^{3+}$ pairs, and the D (528 nm) to $Ti^{3+}$ dd transitions. From those UV-VIS characteristics the origin of blue color of the sapphires is confirmed to be attributed by the factors such as $Fe^{2+}$/$Fe^{3+}$ and $Ti^{3+}$/$Ti^{4+}$. The absorption spectra of natural blue sapphires before and after heat treatment show distintive features, comparing with those of sapphires from other localities: the bands of 689 nm and of $Cr^{3+}$ are not recorded on the spectra of sapphires from Shantung. The band (492 nm), which resulted from $Ti^{3+}$, is not shown and the intensity of the band 528 nm decreases after the heat treatment. Decoloration of ink-blue sapphires are found to be successful by heat treatment with the control of annealing and atmosphere. During the diffusion process the excess components of impurities contained originally in the host crystal were expelled to the surface of crystals, enhancing the transparency of the crystals noticeably.

• Journal of Korean Society for Atmospheric Environment
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• v.20 no.3
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• pp.397-409
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• 2004

There has been few studies of either domestic or international to apply CCT-ICP-MS for the precise analysis of As and Cr components associated with airborne particulate matter. To date, the use of CCT-ICP-MS is strongly recommended for the accurate analysis of the toxic trace metals; this is because CCT-ICP-MS technique prevents polyatomic spectral interferences involved in the determination of As and/or Cr components. Taking advantage of CCT-ICP-MS technique, the measurements of about 20 metals were undertaken in this study. The standard reference material (NIST SRM 2783) was used for analytical quality control. To improve analytical accuracy and of acid efficiency, we selected nitric acid based on a test of three kinds of acid for microwave digestion method 1 ) nitric acid. 2) nitric acid and hydrogen peroxide. and 3) nitric acid and perchloric acid. When this method was employed, relative errors to SRM values of Al, As, Cr Fe, Mg, Mn, Pb, Sb, V, and Zn fell below 20%, while those or Ca, Si, and Ti were higher than 20%. The overall results of our study show that the concentrations of As and V determined by CCT-ICP-MS were satisfied with the certificated values within a relative error of 20e1c, whereas those determined by ICP-MS were 10 times higher than the certificated values.

• Journal of Welding and Joining
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• v.13 no.3
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• pp.147-156
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• 1995

The change of microstructure in the bonded interlayer and tensile properties of joints were studied for liquid phase diffusion bonding using STS-310 and Incoloy-825 as base metal and base metal+B alloy as insert inetal. Main experimental results obtained in this study are as follows. 1) The optimum amount of B addition into the insert metal was found to be about 4mass%. 2) When isothermal solidification was completed, the microstructure in the bonded interlayer was the same with that of the base metal because of the grain boundary migration in the bonded interlayer. 3) All of the tensile specimen fractured at base metal and joints bonded at optimum condition exhibited tensile properties in excess of base metal requirements. 4) It was determined that fine car-borides and bordes such as M$_{23}$(C,B)$_{6}$, Cr$_{2}$B, and CrB in STS-310S and TiB in Incoloy-825 exist at the grain boundary around bonded interlayer. These precipitates almost disappeared after homogenizing treatment at 1373K for 86.4ks.s.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.3
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• pp.9-17
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• 2011

Nano-composite solders have been studied to improve the properties of Pb-free solder joints. The nanoparticles in the composite solders were carbon nanotubes(CNTs), metals (Ag, Ni, Cr, etc.), ceramics (SiC, $ZrO_2$, $TiB_2$, etc.). To fabricate the nano-composite solders, mechanical mixing methods and in-situ fabrication method has been used for well-dispersed nano phase. The characteristic properties of the nano-composite solders were high creep resistance, low undercooling, low IMC growth rate and fine microstructures. More researches on the nano-composite solders are required to improve the processibility and the reliability of the nano-composite solder joints.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.14-14
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• 2011

W (tungsten)-alloys will be the most promising plasma facing armor materials in highly loaded plasma interactive components of the next step fusion reactors due to its high melting point, high sputtering resistance and low deuterium/tritium retention. The bonding technology of tungsten to Cu alloy was one of the key issues. In this paper, W/CuCrZr diffusion bonding has been performed successfully by inserting pure metal interlay. The joint microstructure, interfacial elements migration and phase composition were analyzed by SEM, EDS, XRD, and the joint shear strength and micro-hardness were investigated. The mock-ups were fabricated successfully with diffusion bonding and the cladding technology respectively, and the high heat flux test and thermal fatigue test were carried out under actively cooling condition. When Ni foil was used for the bonding of tungsten to CuCrZr, two reaction layers, Ni4W and Ni(W) layer, appeared between the tungsten and Ni interlayer with the optimized condition. Even though Ni4W is hard and brittle, and the strength of the joint was oppositely increased (217 MPa) due primarily to extremely small thicknesses (2~3 ${\mu}m$). When Ti foil was selected as the interlayer, the Ti foil diffused quickly with Cu and was transformed into liquid phase at $1,000^{\circ}C$. Almost all of the liquid was extruded out of the interface zone under bonding pressure, and an extremely thin residual layer (1~2 ${\mu}m$) of the liquid phase was retained between the tungsten and CuCrZr, which shear strength exceeded 160 MPa. When Ni/Ti/Ni multiple interlayers were used for bonding of tungsten to CuCrZr, a large number of intermetallic compound ($Ni_4W/NiTi_2/NiTi/Ni_3T$) were formed for the interdiffusion among W, Ni and Ti. Therefore, the shear strength of the joint was low and just about 85 MPa. The residual stresses in the clad samples with flat, arc, rectangle and trapezoid interface were estimated by Finite Element Analysis. The simulation results show that the flat clad sample was subjected maximum residual stress at the edge of the interface, which could be cracked at the edge and propagated along the interface. As for the rectangle and trapezoid interface, the residual stresses of the interface were lower than that of the flat interface, and the interface of the arc clad sample have lowest residual stress and all of the residual stress with arc interface were divided into different grooved zones, so the probabilities of cracking and propagation were lower than other interfaces. The residual stresses of the mock-ups under high heat flux of 10 $MW/m^2$ were estimated by Finite Element Analysis. The tungsten of the flat interfaces was subjected to tensile stresses (positive $S_x$), and the CuCrZr was subjected to compressive stresses (negative $S_x$). If the interface have a little microcrack, the tungsten of joint was more liable to propagate than the CuCrZr due to the brittle of the tungsten. However, when the flat interface was substituted by arc interfaces, the periodical residual stresses in the joining region were either released or formed a stress field prohibiting the growth or nucleation of the interfacial cracks. Thermal fatigue tests were performed on the mock-ups of flat and arc interface under the heat flux of 10 $MW/m^2$ with the cooling water velocity of 10 m/s. After thermal cycle experiments, a large number of microcracks appeared at the tungsten substrate due to large radial tensile stress on the flat mock-up. The defects would largely affect the heat transfer capability and the structure reliability of the mock-up. As for the arc mock-up, even though some microcracks were found at the interface of the regions, all microcracks with arc interface were divided into different arc-grooved zones, so the propagation of microcracks is difficult.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.166.2-166.2
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• 2016

최근 생산 장비의 발달로 인해 절삭공구, 전기전자 부품, 항공 및 자동차 부품 생산에 필요한 생산 장비의 수명연장, 고속 절단 및 고성능화가 중요시 되면서 우수한 내구성, 내마모성 및 고온 안정성을 갖는 기계부품 및 공구를 요구하게 되었다. 내마모성을 가지는 표면을 얻기 위해서는 TiN, TiC, AlN, Al2O3, CrN, ZrO2와 같은 경도 높은 물질을 증착하여 특성을 개선시키는 방법이 있다. 특히 AlN은 비교적 우수한 경도와 고온 안정성을 가지고 있어, 생산 장비의 고속 절단 및 반복되는 정밀 작업으로 인한 열충격과 마모를 완화시키는 역할을 하는 코팅재로 사용하기 적합하다. 본 실험에서는 RF-magnetron sputtering 방법을 이용하여 AlN 박막을 파워 150W, 질소가스 분압비에 따라 25%, 50%, 75%, 100%의 조건으로 금속기판 위에 증착하였다. 금속 기판 위에 제작된 AlN막은 XRD (X-ray Diffraction)을 사용하여 배향성을 확인하였고, HM-220 (Micro-vickers hardness tester)을 사용하여 AlN박막의 경도를 측정하였으며, SEM (Scanning Electron Microscope), AFM (Atomic Force Microscope)을 이용하여 표면의 구조와 거칠기를 측정하였다. 이 실험을 통하여 우수한 물성과, 치밀한 조직의 AlN박막이 고속 절삭 공구, 유공압 실린더, 베어링과 같은 금속부품의 코팅소재로 적용가능 할 것으로 기대된다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11b
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• pp.332-336
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• 2001

In this study, the reaction at UBM(Under Bump Metallurgy) and solder interface was investigated. The UBM employed in conventional optical packages, Au/Pt/Ti layer, were found to dissolve into molten Au-Sn eutectic solder during reflow soldering. Therefore, the reaction with different diffusion barrier layer such as Fe, Co, Ni were investigated to replace the conventional Pt layer. The reaction behavior was investigated by reflowing the solder on the pad of the metals defined by Cr layer for 1, 2, 3, 4, and 5 minutes at $330^{\circ}C$. Among the metals, Co was found to be most suitable for the diffusion barrier layer as the wettability with the solder was reasonable and the reaction rate of intermetallic formation at the interface is relatively slow.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.332-336
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• 2001

In this study, the reaction at UBM(Under Bump Metallurgy) and solder interface was investigated. The UBM employed in conventional optical packages, Au/Pt/Ti layer, were found to dissolve into molten Au-Sn eutectic solder during reflow soldering. Therefore, the reaction with different diffusion barrier layer such as Fe, Co, Ni were investigated to replace the conventional R layer. The reaction behavior was investigated by reflowing the solder on the pad of the metals defined by Cr layer for 1, 2, 3, 4, and 5 minutes at 330$^{\circ}C$. Among the metals, Co was found to be most suitable for the diffusion barrier layer as the wettability with the solder was reasonable and the reaction rate of intermetallic formation at the interface is relatively slow.