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http://dx.doi.org/10.6117/kmeps.2011.18.3.009

Nano-Composite Solder Technology for the Improvement of Solder Joint Properties  

Ki, Won-Myoung (과학기술연합대학원대학교)
Lee, Young-Kyu (과학기술연합대학원대학교)
Lee, Chang-Woo (한국생산기술연구원)
Yoo, Se-Hoon (한국생산기술연구원)
Publication Information
Journal of the Microelectronics and Packaging Society / v.18, no.3, 2011 , pp. 9-17 More about this Journal
Abstract
Nano-composite solders have been studied to improve the properties of Pb-free solder joints. The nanoparticles in the composite solders were carbon nanotubes(CNTs), metals (Ag, Ni, Cr, etc.), ceramics (SiC, $ZrO_2$, $TiB_2$, etc.). To fabricate the nano-composite solders, mechanical mixing methods and in-situ fabrication method has been used for well-dispersed nano phase. The characteristic properties of the nano-composite solders were high creep resistance, low undercooling, low IMC growth rate and fine microstructures. More researches on the nano-composite solders are required to improve the processibility and the reliability of the nano-composite solder joints.
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Times Cited By KSCI : 2  (Citation Analysis)
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