• Journal of the Korean Society for Heat Treatment
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• v.3 no.1
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• pp.1-7
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• 1990

To investigate the influence of r.f. power and electrode distance on the TiN deposition, TiN films were deposited onto STC3, STD11 steel and Si-wafer from gas mixtures of $TiC_4/N_2/H_2$ using the radio frequency plasma assisted chemical vapor deposition. The crystallinity of TiN film could be improved by the increase of r.f. power and the decrease of electrode distance. The TiN coated layer contains chlorine, its content were decreased with increasing r.f. power as well as decreasing electrode distance. And the thickness of deposited TiN was largely affected by r.f. power and electrode distance. The hardness of deposited TiN reached a maximum value of about Hv 2,000.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.118-118
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• 1999

CVD방법에 의한 TiN 박막 형성에 있어서 ICP-CVD 방법이 대두되고 있다. 이것은 precursor에 대한 radical 형성, 식각된 패턴에서 양 벽의 self-shadowing 효과, 낮은 tress등으로 dense 한 박막을 얻을 수 있기 때문이다. TiN 박막은 Si 기판의 온도를 상온에서 50$0^{\circ}C$까지 유지하면서 TEMAT의 유량을 5-20sccm으로 변화시키면서 증착하였다. 증착 후 TiN 박막의 결정화에 따른 열처리는 Ar과 N2-가스분위기에서 in-situ로 증착하였다. 증착 후 TiN 박막증착 조건수립에 따른 플라즈마 특성진단은 전자의 온도와 밀도, 평균 전자밀도, 이온 에너지 분포, radical 분포, negative 이온분포 등으로 측정하였다. 플라즈마 변수에 따른 TiN 박막의 결정성과 상 변화는 XRD로 분석하였고, 조성비 및 TiN 박막의 원소화학적 상태, 결합에너지, 각 상에 따른 결합 에너지 천이정도, 초기 형성과정 및 반응기구 등은 RBS와 XPS로 조사하였다. TiN 박막의 표면상태, morphology 거칠기, TiN/Si(100)구조에서 계면상태 등은 SEM, AFM, 그리고 HRTEM으로 분석하였다. TiN 구조 박막의 비저항, carrier concentration 그리고 mobility 측정은 박막의 표면이 균일하고 bls-홀이 없는 것으로 하여 4-point probe 방법으로 측정하였다. 이들 분석으로부터 ICP-CVD 방법에 의하여 형성된 TiN 박막이 초고집적 반도체 소자의 contact barrier layer로서의 적용 가능성을 평가하였다.

• Korean Journal of Materials Research
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• v.13 no.7
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• pp.460-464
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• 2003

Ni and Ti films were deposited by the thermal evaporator, and then annealed in the N$_2$ ambient at 300-80$0^{\circ}C$ in a RTA(rapid thermal annealing) system. Four point probe, AEM, FESEM, AES, and XPS were used to study the effects of Ti-capping layers on the thermal stability of NiSi thin films. The Ti-capped NiSi was stable up to $700^{\circ}C$ for 100 sec. RTA, while the uncapped NiSi layers showed high sheet resistance after $600^{\circ}C$. These results were due to that the Ni in-diffusion and Si out-diffusion were retarded by the capping layer, resulting in the suppression of the formation of NiSi$_2$and Si grains at the surface.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.2
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• pp.150-155
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• 2004

This study attempts to form a TiN barrier layer against Cu diffusion by the easier and more convenient method. In this new approach, Ti was sputter-deposited, and nitrided by heat-treating in the NH$_3$ambient. Sheet resistance of as-deposited Ti was 20 Ω/$\square$, but increased to 195 Ω/$\square$ after the heat-treatment at 30$0^{\circ}C$, and lowered to 120 Ω/$\square$ after the heat-treatment at 50$0^{\circ}C$, and $600^{\circ}C$. AES results for these thin films confirmed that the atomic ratio of Ti and N was close to 1:1 at or above 40$0^{\circ}C$ heat-treatment. However, it was also found that excessive oxygen was contained in the TiN layer. To examine the barrier property against Cu diffusion, 100nm Cu was deposited on the TiN layer and then annealed at 40$0^{\circ}C$ for 40 min.. Cu remained at the surface without diffusing into the Si layer.

• Journal of the Microelectronics and Packaging Society
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• v.5 no.2
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• pp.59-64
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• 1998

Pt/SiO2/Si 기판구조위에 스크린인쇄법과 졸-겔법에 의해 (Pb, La)TiO3(PLT) 후막 과 박막을 도포시켜 $650^{\circ}C$후속열처리 온도에서 결정화한후 결정특성과 전기적 특성을 조사 하였다. $650^{\circ}C$ 온도에서 후속열처리된 PLT 시료의 경우 전형적인 perovskite 결정구조를 보 여주었다. SEM 단면형상으로부터 Pt 전극과 PLT막 사이에는 비교적 평활한 계면형상을 보여주었다. PLT 후막과 박막시료의 잔류분극(2Pr) 값은 약 1$\mu$C/cm2 으로각각 나타났으며 이와같이 후막 PLT시료에 비해 박막시료의 잔류분극값이 큰이유는 박막시료가 보다 양호 한 결정성을 지니기 때문이었다. 상온부근에서 후막과 박막시료의 초전계수값은 약 1.5nC/cm2.$^{\circ}C$와 4.0nC/cm2.$^{\circ}C$의 값을 각각 나타내었으며 누설전류의 크기는 약 0.3~0.8$\mu$ A/cm2의 비교적 양호한 누설전류 특성을 얻었다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.581-584
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• 2003

The austenitic STS 304 stainless steel was turned to clarify the effects of tool geometry on the tool wear. The wear of TiN-TiCN-TiC-TiAlN coated tungsten carbide tool was the smallest, exhibiting larger wear in the order of Si-Al-O-N ceramic, TiN coated tungsten carbide, TiN-TiCN-TiN coated tungsten carbide, TiC-TiN cermet and M20 tungsten carbide tools at the same cutting conditions. The S-type tool of M20 with large approach angle showed the longest tool life of all tools used in this tests due to preventing the groove wear of the side cutting edge. The wear of the S-type tool with the rake angle of 15$^{\circ}$became smaller than with that of -5$^{\circ}$, but the tool with the nose radius of 0.8mm did not perform much better with increasing the rake angle.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.10
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• pp.56-64
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• 2003

The effect of tool geometry on the tool wear in turning the austenitic stainless steel, STS 304 was investigated. The wear of TiN-TiCN-TiC-TiAlN coated tungsten carbide tool was the smallest, showing larger wear in the order of Si-Al-O-N ceramic, TiN coated tungsten carbide, TiN- TiCN- TiN coated tungsten carbide, TiC-TiN cermet and M20 tungsten carbide tools at the same cutting conditions. The S-type tool of M20 with the larger side cutting edge angle showed the smallest tool wear in all tests due to preventing the groove wear of the side cutting edge. The wear of the S-type tool with the rake angle of $15^{\circ}$ became smaller than with that of $-5^{\circ}$, but the tool with the nose radius of 0.8mm did not perform much better with increasing the rake angle.

• Journal of the Korean Ceramic Society
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• v.31 no.12
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• pp.1545-1551
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• 1994

Various kinetic parameters of the nucleation and crystallization in anorthite glass (CaO.Al2O3.2SiO2) were calculated by nonisothermal differential thermal analysis. Base glass and glass with TiO2 were prepared by melting. In base glass, the temperature where nucleation can occur ranges from 85$0^{\circ}C$ to 9$25^{\circ}C$ and the temperature for maximum nucleation was 900$\pm$5$^{\circ}C$. In glass with TiO2, the nucleation temperature range was 800~875$^{\circ}C$ and the maximum nucleation temperature was 850$\pm$5$^{\circ}C$. Kissinger equation, Bansal equation, and modified Ozawa equation were used for calculating activation energy for crystallization, Ec. The results showed the same activation energies for both glasses with and without TiO2 in the different equations. The shape of maximum exotherm peak and Ozawa equation were used for Avrami exponent, n. The n value for each glass was 2, indicating that each glass crystallized primarily by bulk crystallization.

• Korean Journal of Metals and Materials
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• v.47 no.9
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• pp.591-596
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• 2009

$TiN_xO_y/TiN_x$ multi-layer thin films with a high resistance(${\sim}k{\Omega}$) were deposited on $SiO_2/Si$ substrates at room temperature by sputtering. The $TiN_x$ thin films show island and smooth surface morphology in samples prepared by ${\alpha}$ and RF magnetron sputtering, respectively. $TiN_xO_y/TiN_x$ multi-layer in has been developed to control temperature coefficient of resistance(TCR) by the incorporation of $TiN_x$ layer(positive TCR) inserted into $TiN_xO_y$ layers(negative TCR). Electrical and structural properties of sputtered $TiN_xO_y/TiN_x$ multi-layer films were investigated as a function of annealing temperature. In order to achieve a stable high resistivity, multi-layer films were annealed at various temperatures in oxygen ambient. Samples annealed at $700^{\circ}C$ for 1 min exhibited good TCR value of approximately $-54 ppm/^{\circ}C$ and a stable high resistivity around $20k{\Omega}/sq$. with good reversibility.

• Journal of the Korean Ceramic Society
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• v.29 no.4
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• pp.328-334
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• 1992

TiO2 sols were prepared by hydrolysis and polymerization of titanium tetra-isopropoxide (TTIP) in the presence of diethanolamine (DEA). The optimal mole ratio of water to TTIP is 2 and the concentration of the TiO2 sol 0.7 M. Golden TiN films without cracks were obtained by dipping Si(110) wafers into the TiO2 sol and followed by nitridation in NH3 at 1100$^{\circ}C$ for 5 h. The TiN films were studied by an optical microscope, DTA, TGA and X-ray analysis.