• Title/Summary/Keyword: Ti-Co-Si

Search Result 350, Processing Time 0.024 seconds

Preparation of SiO2-TiO2-MxOy ( M = Co, Cr or Cu ) Thin Films by the Chemical Solution Process (스핀코팅에 의한 SiO2-TiO2-MxOy (M = CO, Cr or Cu)계 비정질 박막의 제조)

  • Kim, Sangmoon;Lim, Yongmu;Hwang, Kyuseog
    • Journal of Korean Ophthalmic Optics Society
    • /
    • v.3 no.1
    • /
    • pp.223-228
    • /
    • 1998
  • Glass films of $SiO_2-TiO_2-M_xO_y$ (M = Co, Cr or Cu) have been prepared on soda-lime-silica slide glasses by the chemical solution method using a spin-coating technique. Commercially available tetraethyl orthosilicate, titanium trichloride, and cobalt-, chromium- and copper-nitrates were used as starting materials. No crystalline segregations of $Co_3O_4$, $Cr_2O_3$ and CuO were observed by X-ray diffraction ${\theta}-2{\theta}$ scans. From the optical transmission analysis, cobalt existed as $ Co^{2+}$ in tetrahedral coordination, chromium as $Cr^{6+}$ in tetrahedral symmetry and copper as $Cu^{2+}$ in octahedral coordination. Films with a crack-free and no texture exhibited homogeneous interfaces between the films and the substrates along the cross-section.

  • PDF

Effect of Co-dopant (Cr, Ti) in Zn2Si04:Mn Green Phosphors by Sol-Gel technique.

  • Ahn, Joong-In;Han, Cheong-Hwa;Park, Hee-Dong
    • 한국정보디스플레이학회:학술대회논문집
    • /
    • 2003.07a
    • /
    • pp.840-844
    • /
    • 2003
  • The main objective of this investigation is to improve the photoluminescent of $Zn_{2}SiO_{4}:Mn$ phosphors prepared by the sol-gel technique. We try to use adding a new co-dopan such as Cr and Ti. The calcination temperature of sol-gel technique(1100 $^{\circ}C$) was lower than that of the solid state reaction (1300 $^{\circ}C$). Under 147nm excitation, the maximum emission intensity was obtained when the concentration of Cr and Ti was 0.1mol% with respect to $Zn_{2}SiO_{4}:Mn$. In order to study the effect of co-dopant, the content of Mn and the ratio of water to TEOS were fixed at 2mol% and 36:1, respectively.

  • PDF

MAGNETORESISTANCE OF NiFeCo/Cu/NiFeCo/FeMn MULTILAYERED THIN FILMS WITH LOW SATURATION FIELD

  • Bae, S.T.;Min, K.I.;Shin, K.H.;Kim, J.Y.
    • Journal of the Korean Magnetics Society
    • /
    • v.5 no.5
    • /
    • pp.570-574
    • /
    • 1995
  • Magnetoresistance of NiFeCo/Cu/NiFeCo/FeMn uncoupled exchange biased sandwiches has been studied. The magnetoresistance change ratio, ${\Delta}R/R_{s}$ showed 4.1 % at a saturation field as low as 11 Oe in $Si/Ti(50\;{\AA})/NiFeCo(70\;{\AA})/Cu(23\;{\AA})/NiFeCo(70\;{\AA})/FeMn(150\;{\AA})/Cu(50\;{\AA})$ spin valve structure. In this system, the magnetoresistance was affected by interlayer material and thickness. When Ti and Cu were used as the interlayer material in this structure, maximum magnetoresistance change ratio were 0.32 % and 4.1 %, respectively. 6.1 % MR ratio was obtained in $Si/Ti(50\;{\AA})/NiFeCo(70\;{\AA})/Cu(15\;{\AA})/NiFeCo(70\;{\AA})/FeMn(150\;{\AA})/Cu(50\;{\AA})$ spin valve structure. The magnetoresistance change ratio decreased monotonically as the interlayer thickness increased. It was found that the exchange bias field exerted by FeMn layer to the adjacent NiFeCo layer was ~25 Oe, far smaller than that reported in NiFe/Cu/NiFe/FeMn spin valve structure(Dieny et. al., ~400 Oe). The relationship between the film texture and exchange anisotropy ha been examined for spin valve structures with Ti, Cu, or non-buffer layer.

  • PDF

DC/RF Magnetron Sputtering deposition법에 의한 $TiSi_2$ 박막의 특성연구

  • Lee, Se-Jun;Kim, Du-Soo;Sung, Gyu-Seok;Jung, Woong;Kim, Deuk-Young;Hong, Jong-Sung
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 1999.07a
    • /
    • pp.163-163
    • /
    • 1999
  • MOSFET, MESFET 그리고 MODFET는 Logic ULSIs, high speed ICs, RF MMICs 등에서 중요한 역할을 하고 있으며, 그것의 gate electrode, contact, interconnect 등의 물질로는 refractory metal을 이용한 CoSi2, MoSi2, TaSi2, PtSi2, TiSi2 등의 효과를 얻어내고 있다. 그중 TiSi2는 비저항이 가장 낮고, 열적 안정도가 좋으며 SAG process가 가능하므로 simpler alignment process, higher transconductance, lower source resistance 등의 장점을 동시에 만족시키고 있다. 최근 소자차원이 scale down 됨에 따라 TiSi2의 silicidation 과정에서 C49 TiSi2 phase(high resistivity, thermally unstable phase, larger grain size, base centered orthorhombic structure)의 출현과 그것을 제거하기 위한 노력이 큰 issue로 떠오르고 있다. 여러 연구 결과에 따르면 PAI(Pre-amorphization zimplantation), HTS(High Temperature Sputtering) process, Mo(Molybedenum) implasntation 등이 C49를 bypass시키고 C54 TiSi2 phase(lowest resistivity, thermally stable phase, smaller grain size, face centered orthorhombic structure)로의 transformation temperature를 줄일 수 있는 가장 효과적인 방법으로 제안되고 있지만, 아직 그 문제가 완전히 해결되지 않은 상태이며 C54 nucleation에 대한 physical mechanism을 밝히진 못하고 있다. 본 연구에서는 증착 시 기판온도의 변화(400~75$0^{\circ}C$)에 따라 silicon 위에 DC/RF magnetron sputtering 방식으로 Ti/Si film을 각각 제작하였다. 제작된 시료는 N2 분위기에서 30~120초 동안 500~85$0^{\circ}C$의 온도변화에 따라 RTA법으로 각각 one step annealing 하였다. 또한 Al을 cosputtering함으로써 Al impurity의 존재에 따른 영향을 동시에 고려해 보았다. 제작된 시료의 분석을 위해 phase transformation을 XRD로, microstructure를 TEM으로, surface topography는 SEM으로, surface microroughness는 AFM으로 측정하였으며 sheet resistance는 4-point probe로 측정하였다. 분석된 결과를 보면, 고온에서 제작된 박막에서의 C54 phase transformation temperature가 감소하는 것이 관측되었으며, Al impuritydmlwhswork 낮은온도에서의 C54 TiSi2 형성을 돕는다는 것을 알 수 있었다. 본 연구에서는 결론적으로, 고온에서 증착된 박막으로부터 열적으로 안정된 phase의 낮은 resistivity를 갖는 C54 TiSi2 형성을 보다 낮은 온도에서 one-step RTA를 통해 얻을 수 있다는 결과와 Al impurity가 존재함으로써 얻어지는 thermal budget의 효과, 그리고 그로부터 기대할 수 있는 여러 장점들을 보고하고자 한다.

  • PDF

Epitaxial Growth of CoSi2 Layer on (100)Si Substrate using CoNx Interlayer deposited by Reactive Sputtering (반응성 스퍼터링법으로 증착된 CoNx 중간층을 이용한 (100)Si 기판 위에서의 에피택셜 CoSi2 성장 연구)

  • Lee, Seung-Ryul;Kim, Sun-Il;Ahn, Byung-Tae
    • Korean Journal of Materials Research
    • /
    • v.16 no.1
    • /
    • pp.30-36
    • /
    • 2006
  • A novel method was proposed to grow an epitaxial $CoSi_2$ on (100)Si substrate. A $CoN_x$ interlayer was deposited by reactive sputtering of Co in an Ar+$N_2$ flow. From the Ti/Co/$CoN_x$/Si structure, a uniform and thin $CoSi_2$ layer was epitaxially grown on (100)Si by annealing above $700^{\circ}C$. Two amorphous layers were found at the $CoN_x$/Si interface, where the top layer has a silicon nitride (Si-N) bonding state with some Co content and the bottom layer has a Co-Si intermixing state. The SiNx amorphous layer seems to play a critical role of suppressing the diffusion of Co into Si substrate for the direct formation of epitaxial $CoSi_2$.

Microstructure and Magnetic Properties of Til-xCoxO2 Diluted Magnetic Semiconductor Thin Films with Various Co Concentrations by Metal Organic Chemical Vapor Deposition (유기 금속 화학 기상 증착법으로 제조된 자성반도체 Til-xCoxO2 박막의 Co 조성 변화에 따른 미세구조 및 자기적 특성)

  • Seong, Nak-Jin;Oh, Young-Nam;Cho, Chae-Ryong;Yoon, Soon-Gil
    • Korean Journal of Materials Research
    • /
    • v.13 no.11
    • /
    • pp.737-741
    • /
    • 2003
  • Polycrystalline $Ti_{l-x}$ $Co_{x}$ $O_2$thin films on $SiO_2$ (200 nm)/Si (100) substrates were prepared using liquid-delivery metalorganic chemical vapor deposition. Microstructures and ferromagnetic properties were investigated as a function of doped Co concentration. Ferromagnetic behaviors of polycrystalline films were observed at room temperature, and the magnetic and structural properties strongly depended on the Co distribution, which varied widely with doped Co concentration. The annealed $Ti_{l-x}$ $Co_{x}$ $O_2$thin films with $x\leq$0.05 showed a homogeneous structure without any clusters, and pure ferromagnetic properties of thin films are only attributed to the X$l-x_{l-x}$ $Co_{x}$X$O_2$phases. On the other hand, in case of thin films above x = 0.05, Co-rich clusters formed in a homogeneous $Ti_{l-x}$ $Co_{x}$ $O_2$phase, and the overall ferromagnetic (FM) properties depended on both FMTCO and FMCo. Co-rich clusters with about 10-150 nm size decreased the value of Mr (the remanent magnetization) and increased the saturation magnetic field.

Enhanced Self-Cleaning Performance of Ag-F-Codoped TiO2/SiO2 Thin Films

  • Kim, Byeong-Min;Kim, Jung-Sik
    • Korean Journal of Materials Research
    • /
    • v.28 no.11
    • /
    • pp.620-626
    • /
    • 2018
  • Highly self-cleaning thin films of $TiO_2-SiO_2$ co-doped with Ag and F are prepared by the sol-gel method. The asprepared thin films consist of bottom $SiO_2$ and top $TiO_2$ layers which are modified by doping with F, Ag and F-Ag elements. XRD analysis confirms that the prepared thin film is a crystalline anatase phase. UV-vis spectra show that the light absorption of $Ag-F-TiO_2/SiO_2$ thin films is tuned in the visible region. The self-cleaning properties of the prepared films are evaluated by a water contact angle measurement under UV light irradiation. The photocatalytic performances of the thin films are studied using methylene blue dye under both UV and visible light irradiation. The $Ag-F-TiO_2/SiO_2$ thin films exhibit higher photocatalytic activity under both UV and visible light compared with other samples of pure $TiO_2$, Ag-doped $TiO_2$, and F-doped $TiO_2$ films.

Growth Behavior and Thermal Stability of CoSi2 Layer on Poly-Si Substrate Using Reactive Chemical Vapor Deposition (반응성 CVD를 이용한 다결정 실리콘 기판에서의 CoSi2 layer의 성장거동과 열적 안정성에 관한 연구)

  • Kim, Sun-Il;Lee, Heui-Seung;Park, Jong-Ho;Ahn, Byung-Tae
    • Korean Journal of Materials Research
    • /
    • v.13 no.1
    • /
    • pp.1-5
    • /
    • 2003
  • Uniform polycrystalline $CoSi_2$layers have been grown in situ on a polycrystalline Si substrate at temperature near $625^{\circ}C$ by reactive chemical vapor deposition of cyclopentadienyl dicarbonyl cobalt, Co(η$^{5}$ -C$_{5}$ H$_{5}$ )(CO)$_2$. The growth behavior and thermal stability of $CoSi_2$layer grown on polycrystalline Si substrates were investigated. The plate-like CoSi$_2$was initially formed with either (111), (220) or (311) interface on polycrystalline Si substrate. As deposition time was increasing, a uniform epitaxial $CoSi_2$layer was grown from the discrete $CoSi_2$plate, where the orientation of the$ CoSi_2$layer is same as the orientation of polycrystalline Si grain. The interface between $CoSi_2$layer and polycrystalline Si substrate was always (111) coherent. The growth of the uniform $CoSi_2$layer had a parabolic relationship with the deposition time. Therefore we confirmed that the growth of $CoSi_2$layer was controlled by diffusion of cobalt. The thermal stability of $CoSi_2$layer on small grain-sized polycrystalline Si substrate has been investigated using sheet resistance measurement at temperature from $600^{\circ}C$ to $900^{\circ}C$. The $CoSi_2$layer was degraded at $900^{\circ}C$. Inserting a TiN interlayer between polycrystalline Si and $_CoSi2$layers improved the thermal stability of $CoSi_2$layer up to $900^{\circ}C$ due to the suppression of the Co diffusion.

Nucleation and Growth Rate of CVD-W on TiN (TiN상에서의 CVD-W의 핵생상 및 성장속도)

  • Kim, Eui-Song;Lee, Chong-Mu;Lee, Jong-Gil
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 1992.11a
    • /
    • pp.28-30
    • /
    • 1992
  • Long incubation period of W nucleation on the TiN glue layer is a serious problem in blanket W process. In this study we investigated the dependence of W nucleation and growth rate on the preparation method of the TiN film, deposition temperature, chemistry, $SiH_4/WF_6$ ratio and sputter etching, ion implantation, and $SiH_4$ flushing pre-treatments. Incubation periods of W nucleation and deposition rates of W growth on three different TiNs are in the order of TiN>RTP-TiN> annealed TiN and TiN${\leq}$RTP-TiN${\leq}$ annealed TiN, respectively. $\beta$-W is not found on TiN substrate even for high $SiH_4/WF_6$ ratio. Sputter etching pre-treatment increases incubation period of W nucleation, while it decreases deposition rate. $SiH_4$ flushing pre-treatment decreases incubation period, but it slightly decreases deposition rate.

  • PDF

A study on the fabrication of $Pb(Fe^{0.5},Nb^{0.5}O_3$ thin films by a Co-sputtering technique and their characteristics properties (동시 스퍼터링법에 의한$Pb(Fe^{0.5},Nb^{0.5}O_3$박막의 제조 및 특성 평가에 대한 연구)

  • 이상욱;신동석;최인훈
    • Journal of the Korean Vacuum Society
    • /
    • v.7 no.1
    • /
    • pp.17-23
    • /
    • 1998
  • $Pb(Fe_{0.5}Nb_{0.5}O_3(PFN)$ thin films were prepared by rf magnetron co-sputtering method on $SiO_2/Si$, ITO/glass, and $Pt/Ti/SiO_2/Si$ substrates and post-annealed at the $N_2$ atmosphere by RTA(rapid thermal annerling). The degree of crystallinity of PFN films was identified on various substrates. Electrical properties of PFN films was characterized for $Pt/PFN/Pt/Ti/SiO_2/Si$ structure. The composition of PFN films was estimated by EPMA (electron probe micro analysis). PFN films would be crystallized better to perovskite phase on ITO/glass substrate than $SiO_2/Si$ substrate. This may be induced by the deformation of Pb deficient pyrochlore phase due to Pb diffusion into $SiO_2/Si$ substrate. PFN films on $Pt/Ti/SiO_2/Si$ substrate. PFN films with 5-10% Pb excess were crystallized to perovskite phase from $500^{\circ}C$ temperature. In summary, we show that Pb composition and annealing temperature were critically influenced on crystallinity to perovskite phase. When PFN film with 17% Pb excess was annealed at $600^{\circ}C$ at the $N_2$ atmosphere for 300kV/cm and 88. Its remnant polarization coercive field $2.0 MC/cm^2$ and 144kV/cm, respectively.

  • PDF