• 제목/요약/키워드: Ti deposition

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화학증착법에 의한 여러 가지 강들위에 증착된 TiC의 결정학적 특성 (The Crystallographic Properties of TiC Deposited on Different Substrate Steel by Chemical VaporDeposition)

  • 윤순길;김호기
    • 한국세라믹학회지
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    • 제24권6호
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    • pp.519-526
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    • 1987
  • TiC was deposited onto several substrate steels by the Chemical Vapor Deposition technique from TiCl4-CH4-H2 gas mixtures in the horizontal resistance furnace. Deposition rates and morphologies of the coatings were investigated with the carbon contents. Deposition thickness increased linearly with the deposition time in the Presence of CH4 gas. The various interlayers of coating by EDS and X-ray Diffraction were proved as Cr7C3 and Fe3C. Chromium contents did not affect the preferred orientation of TiC deposit. The deposition was controlled by a mass transport and a surface reaction in case of 1 wt% C-5.25 wt% Cr steel irrespective of deposition temperature.

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RF-PECVD법에 의한 Ti-Si-N 박막의 증착거동 (Deposition Behaviors of Ti-Si-N Thin Films by RF Plasma-Enhanced Chemical Vapor Deposition.)

  • 이응안;이윤복;김광호
    • 한국표면공학회지
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    • 제35권4호
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    • pp.211-217
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    • 2002
  • Ti-Si-N films were deposited onto WC-Co substrate by a RF-PECVD technique. The deposition behaviors of Ti-Si-N films were investigated by varying the deposition temperature, RF power, and reaction gas ratio (Mx). Ti-Si-N films deposited at 500, 180W, and Mx 60% had a maximum hardness value of 38GPa. The microstructure of films with a maximum hardness was revealed to be a nanocomposite of TiN crystallites penetrated by amorphous silicon nitride phase by HRTEM analyses. The microstructure of maximum hardness with Si content (10 at.%) was revealed to be a nanocomposite of TiN crystallites penetrated by amorphous silicon nitride phase, but to have partly aligned structure of TiN and some inhomogeniety in distribution. and At above 10 at.% Si content, TiN crystallite became finer and more isotropic also thickness of amorphous silicon nitride phase increased at microstructure.

빗각 증착으로 제조된 TiN 박막의 특성 (Properties of TiN Films Fabricated by Oblique Angle Deposition)

  • 정재훈;양지훈;박혜선;송민아;정재인
    • 한국표면공학회지
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    • 제45권3호
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    • pp.106-110
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    • 2012
  • Oblique angle deposition (OAD) is a physical vapor deposition where incident vapor flux arrives at non-normal angles. It has been known that tilting the substrate changes the properties of the film, which is thought to be a result of morphological change of the film. In this study, OAD has been applied to prepare single and multilayer TiN films by cathodic arc deposition. TiN films have been deposited on cold-rolled steel sheets and stainless steel sheet. The deposition angle as well as substrate temperature and substrate bias was changed to investigate their effects on the properties of TiN films. TiN films were analyzed by color difference meter, scanning electron microscopy, nanoindenter and x-ray diffraction. The color of TiN films was not much changed according to the deposition conditions. The slanted and zigzag structures were observed from the single and multilayer films. The relation between substrate tilting angle (${\alpha}$) and the growth column angle (${\beta}$) followed the equation of $tan{\alpha}=2tan{\beta}$. The indentation hardness of TiN films deposited by OAD was low compared with the ones prepared at normal angle. However, it has been found that $H^3/E^2$ ratio of 3-layer TiN films prepared at OAD condition was a little higher than the ones prepared at normal angle, which can confirm the robustness of prepared films.

TiN 박막 성장거동에 미치는 증착온도의 영향 (The Effect of Deposition Temperature on the Growth behavior of TiN deposited by PECVD)

  • 이인우;남옥현;김문일
    • 열처리공학회지
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    • 제6권4호
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    • pp.223-229
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    • 1993
  • Extensive reseach has been performed on the process condition-micro structure-stress relations of TiN film. The various proposed models are mainly base on physical vapor deposition processes. Especially the study on the micro-structure and deposition condition has not been sufficient in TiN deposited by PECVD. In this study, therefore, we discussed the morphological changes of TiN films by PECVD with different temperature and pressure, and compared it with the structure zone model. We could find out that the oxygen and chlorine contents and the texture coefficient increased with deposition temperature, and the morphology of TiN transformed from Zone 1 to Zone T, but deposition pressure didn't remarkly affected.

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D. C. 마그네트론 스퍼터링에 의한 증착조건이 TiN다층박막의 밀착력에 미치는 영향 (The effect of deposition conditions on the adhesion strength of TiN multilayer by D. C. magnetron sputtering)

  • 김선규;유정광;이건환;권식철
    • 한국표면공학회지
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    • 제29권4호
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    • pp.261-267
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    • 1996
  • The characteristics and adhesion strength of TiN layer deposited by D. C. magnetron sputtering were investigated. Three types of TiN layers were deposited on STS304 stainless steel. Scratch tests were performed to determine the effect of deposition temperature, the thickness of coated TiN layer and the titanium inter-layer on the adhesion strength. TiN multilayer with titanium inter-layer showed the highest critical load in the deposition temperature range of $25^{\circ}C$ to $300^{\circ}C$. Adhesion strength of TiN multilayer with titanium inter-layer was raised from 15N to 20N by raising deposition temperature from $25^{\circ}C$ to $400^{\circ}C$. Adhesion strength was raised from 18N to 38N by increasing the thickness of outer layer of TiN multilayer from 2.1 $\mu\textrm{m}$ to 9.5 $\mu\textrm{m}$.

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초연합금절단공구상에 TiN의 화학증착피막에 관한 연구 (The Chemical Vapor Deposition of TiN on Cemented Tungsten Carbide Cutting Tools)

  • 이상래
    • 한국표면공학회지
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    • 제15권3호
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    • pp.138-145
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    • 1982
  • The effects of the simultaneous variations of the ratio of feed gases(H2/N2 Flow ratio), feed gas flow rate (H2/N2, total-flow rate) and partial pressures of TiCl4 (PTiCl41) as well as deposition time and cobalt content of the substrate on the deposition rate of the TiN Coated Cemented Tungsten Carbide Tools were investigated. Deposition was carried out in the temperature range of 930$^{\circ}C$-1080$^{\circ}C$ and an activation energy of 46.5 Kcal/mole can be calculated. Transverse rupture strength was noticeably reduced by the TiN coating on the virgin surfa-ce of Cemented Tungsten Carbide, the extent of which was decreased according to the coa-ting thickness. Microhardness value observed on the work was in the range of 1700∼2000kg/mm, which were in well agreement with the value of bult TiN. The wear resistance of TiN layers was performed by turning test and it was observed that crater and flank resistance remarkably enhanced by TiN coating.

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스퍼터링 증착변수에 따른 SKD 61강 기판상 TiN 박막의 증착거동 변화 (Effects of sputtering conditions on the growth behavior of TiN thin films on SKD 61 steel substrates)

  • 김상섭;임태홍;박용범
    • 한국진공학회지
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    • 제7권4호
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    • pp.314-319
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    • 1998
  • 반응성 스퍼터링 방법을 사용해서 SKD 61강 기판상에 TiN박막을 제조하였으며, 다 양한 증착조건의 변수에 따른 박막의 증착거동 및 제조된 박막의 물성을 평가하였다. 챔버 내의 가스압력 및 RF인가전압이 높을수록 증착속도는 급격하게 증가하였다. 반면에 혼합가 스의 질소함량이 높을수록 증착속도는 감소하였으며, 박막의 표면에 hillock이 발생하였다. 대표적인 증착조건으로 제조된 TiN박막의 경우(111) 우선배향성을 보였으며, 비교적 순수한 TiN의 화학양론비를 충족하는 박막임을 알 수 있었다.

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플라즈마 화학 증착법(PACVD)에 의한 TiN 증착시 증착변수가 미치는 영향(I) -증착온도를 중심으로- (Effects of Deposition Parameters on TiN Film by Plasma Assisted Chemical Vapor Deposition(I) -Influence of Temperature on the TiN Deposition-)

  • 신영식;하선호;김문일
    • 열처리공학회지
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    • 제2권4호
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    • pp.1-10
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    • 1989
  • To investigate the influence of temperature on the TiN film, it was deposited on the STC-3 steel and Si-wafer from $TiCl_4/N_2/H_2$ gas mixture by using the radio frequency plasma assisted chemical vapor deposition. The deposition was performed at temperature of $400^{\circ}C-500^{\circ}C$. The results showed that crystalline TiN film was deposited over $480^{\circ}C$, and all specimens showed the crystalline TiN X-ray diffraction peaks after vacuum heat treatment for 3 hrs, at $1000^{\circ}C$, $10^{-5}torr$. While the film thickness was increased above $480^{\circ}C$, it was decreased under $480^{\circ}C$ as temperature increased. And the contents of titanium were increased and it of chlorine were decreased as temperature increased. Because temperature increase was attributed to the increase in the density of TiN film, surface hardness of TiN film was increased with temperature.

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이온 플레이팅의 TiN코팅층에 미치는 작업인자의 영향 (The Effects of Process parameters on TiN Films deposited by Ion Plating Technique)

  • 백응승;권식철;이상로;이건환
    • 한국표면공학회지
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    • 제23권2호
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    • pp.24-29
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    • 1990
  • The TiN filmms were deposited on the stainless steel substrates by BARE techinique in order to investigate the effects of process parameters such as source-to-substate distance (15-35cm), N2 pressure(4$\times$10-10 -1$\times$10-3mb)and bias voltage(O-2000V), on the deposition rate, the concentration ratio [N/Ti] and the surface color of the films. The deposition rate was deduced from the weight measurement, the [N/ti] ratio by ESCA. The deposition rate decreased with a relationship of=40.2/D2 where D was source-to-substrate distance. The effect of the bias voltage and the N2pressure on the deposition rate, however, appeared negligble. The [N/Ti] ratio was in the narrow range of 0.7 tp 0.8 It increased slightly with the N2 partial pressure and deceased with the source-to-substrate distance. It was confired by ESCA that a significant amount of oxygen and carbon was contaminated after deposition in the top surface of TiN films. The surface color of TiN film was changed from light gold yellow to reddish gold yellow with increasing [N/Ti] ratio.

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플라즈마 화학증착법(PACVD)에 의한 TiN증착시 증착변수가 미치는 영향(II) -TiCl4, N2의 입력분율을 중심으로- (Effects of Deposition Parameters on TiN Film by Plasma Assisted Chemical Vapor Deposition(II) -Influence of TiCl4, N2 inlet Fraction on the TiN Deposition-)

  • 이병호;신영식;김문일
    • 열처리공학회지
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    • 제2권4호
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    • pp.11-18
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    • 1989
  • To investigate the influence of $TiCl_4$, $N_2$ inlet fraction on the TiN layer, TiN film was deposited onto the STC3 and STD11 steel from gas mixtures of $TiCl_4/N_2/H_2$ by the radio frequency plasma assisted chemical vapor deposition. The films were deposited at various $TiCl_4$, $N_2$ inlet fractions. The results showed that the film thickness was increased with $TiCl_4$ inlet fraction. However, while the thickness was increased with $N_4$ inlet fraction under 0.4 the thickness was decreased with increasing $N_2$ inlet fraction over 0.4. The density of deposited films was varied as $TiCl_4$, $N_2$ inlet fraction and its maximum value was about $5.6g/cm^3$. The contents of chlorine were increased with increasing $TiCl_4$ inlet fraction and nearly constant with increasing $N_2$ inlet fraction.

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