• Journal of the Microelectronics and Packaging Society
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• v.22 no.3
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• pp.19-23
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• 2015

In this study, two types of Au/TiW bump samples were fabricated by the electroplating process onto Al/Si and SiN/Si wafers for the COG (Chip On Glass) packaging. TiW was used as the UBM (Under Bump Metallurgy) material of the Au bump and it was deposited by a sputtering method under the sputtering powers ranges from 500 to 5000 Watt. We investigated the delamination phenomenas for the prepared samples as a function of the input sputtering powers. The stable interfacial adhesion condition was found to be 1500 Watt in sputtering power. In addition, the SAICAS (Surface And Interfacial Cutting Analysis System) measurement was used to find the adhesion strength of Au bumps for the prepared samples. TiW UBM films were deposited at the 1500 Watt sputtering power. As a results, there was a similar adhesion strengths between TiW/Au interfacial films on Al/Si and SiN/Si wafers. However, the adhesion strength of TiW UBM sputtering films on Al and SiN under films were 2.2 times differences, indicating 0.475 kN/m for Al/Si wafer and 0.093 kN/m for SiN/Si wafer, respectively.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.861-864
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• 2004

본 연구에서는 Ta이 도핑된 $TiO_2$와 $Au/TiO_2$ nanocomposite 박막을 co-sputtering법으로 제작하였다. Ta-doped $TiO_2$ 박막은 금흥석(rutile)에서 아나타제 상으로 변하는 구조를 유도하는 고용체를 형성했다. $Au/TiO_2$ nanocomposite film의 경우에는, 지름이 약 15 nm인 Au particles들이 $TiO_2$ matrix에 균질하게 분포되었다. Ta가 도핑된 $TiO_2$ 전극과 $Au/TiO_2$ 나노 콤포사이트 전극의 anodic photocurrents가 UV뿐만 아니라 가시광선 영역에서도 관찰되었다. Ta이 도핑된 $TiO_2$ 전극과 $Au/TiO_2$ 나노 콤포사이트 사이의 가시광선 영역에서 photoresponse는 계면 상태로 부터의 bandgap의 감소와 전자의 photoexcitation 때문이다.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.2
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• pp.61-67
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• 2003

The interfacial reaction between ultra-small 58Bi-42Sn solder and Au/Ni/Ti under bump metallurgy (UBM) for ultra-fine flip chip application was investigated. The ultra-small 58Bi-42Sn solder bump, about $46{\mu}m$ in diameter, was fabricated by using the lift-off method and reflowed using the rapid thermal annealing (RTA) system. The intermetallic compounds were characterized using a secondary electron microscopy (SEM), an energy dispersive spectroscopy (EDS), and an x-ray diffractometer (XRD). The faceted and polygonal intermetallic compounds were found in the Bi-Sn solder bumps on $Au(0.1{\mu}m)/Ni/Ti$ UBM and they were indentified as $(Au_xBi_yNi_{1-x-y})Sn_2$ Phase. The intermetallic compounds grown from the $Au(0.1{\mu}m)/Ni/Ti$ UBMinterface were dispersed in the solder bump.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.25 no.6
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• pp.280-284
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• 2015

Au doped $TiO_2$ nanoparticles have been synthesized using a reverse micelle technique combined with metal alkoxide hydrolysis and condensation. Au doped $TiO_2$ was coated with glass substrate. The size of the particles and thickness of the coating can be controlled by manipulating the relative rates of the hydrolysis and condensation reaction of TTIP within the micro-emulsion. The average size of synthesized Au doped $TiO_2$ nanoparticle was about in the size range of 15 to 25 nm and the Au particles formed mainly the range of 2 to 10 nm in diameter. The effect of synthesis parameters, such as the molar ratio of water to TTIP and the molar ratio of water to surfactant, are discussed. The synthesized nanopaticles were coated on glass substrate by a spin coating process. The thickness of thin film was about 80 nm. The degradation of MB on a $TiO_2$ thin film was enhanced over 20 % efficiency by the incorporation of Au.

• Journal of Sensor Science and Technology
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• v.23 no.5
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• pp.305-309
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• 2014

Well-ordered $TiO_2$ nanotubes with Au nanoparticles are a desirable configuration to enhance the gas sensing properties such as response and selectivity due to their high surface area to volume ratio and catalytic effect of Au nanoparticles. We have synthesized the well-ordered $TiO_2$ nanotubes directly on a Pt IDEs patterned $SiO_2/Si$ substrate and then decorated Au nanoparticles on inner and outer surface of $TiO_2$ nanotubes using electrodeposition method. The Au-decorated $TiO_2$ nanotubes shows ultrahigh response to $C2_H_5OH$ and the highest increasing ratio to $H_2$ compared with other gases.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.68-71
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• 2003

The reaction of ultra-small eutectic 58Bl-42Sn solder bump with Au/Ni/Ti and Au/Cu/Ti UBMs during reflow was studied. The eutectic Bi-Sn solder bumps of $46{\mu}m$ diameter were fabricated by using the evaporation method and were reflowed using the rapid thermal annealing system. The intermetallic compound was characterized using a SEM, an EDS, and an XRD. The $(Cu_xAu_{1-x})_6Sn_5$ compounds formed at the interface between Bi-Sn solder and Au/Cu/Ti UBM. On the other hand, in the Bi-Sn solder bump on Au/Ni/Ti UBM, the faceted and rectangular intermetallic compounds were observed on the solder bump surface and inside the solder bump as well as at the UBM interface. These intermetallic compounds were Identified as $(Au_{l-x-y}Bi_xNi_y)Sn_2$ phase.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.1 s.34
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• pp.87-93
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• 2005

Interfacial reactions between 48Sn-52In solder and $0.1{\mu}m$ Ti/3 ${\mu}m$ Cu/Au under bump metallurgies(UBM) with various Au thickness of $0.1{\~}0.7{\mu}m$ have been investigated after solder reflow at $150^{\circ}C,\;200^{\circ}C$, and $250^{\circ}C$ for 1 minute. Ball shear strength and shear energy of the Sn-52In solder bump on each UBM was also evaluated. With reflowing at $150^{\circ}C$ and $200^{\circ}C$, $Cu_6(Sn,In)_5$ and $AuIn_2$ intermetallic compounds were formed at UBW solder interface. However, UBM was consumed almost completely with reflowing at $250^{\circ}C$. While ball shear strength was not consistent with UBM/solder reactions, ball shear energy matched well with UBM/solder reactions.

• Bulletin of the Korean Chemical Society
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• v.28 no.6
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• pp.1015-1020
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• 2007

A simple approach to prepare arrays of Au/TiO2 composite nanoparticles by using Au-loaded block copolymers as templates combined with a sol-gel process is described. The organic-inorganic hybrid films with closely packed inorganic nanodomains in organic matrix are produced by spin coating the mixtures of polystyrene-block-poly(ethylene oxide) (PS-b-PEO)/HAuCl4 solution and sol-gel precursor solution. After removal of the organic matrix with deep UV irradiation, arrays of Au/TiO2 composite nanoparticles with different compositions or particle sizes can be easily produced. Different photoluminescence (PL) emission spectra from an organic-inorganic hybrid film and arrays of Au/TiO2 composite nanoparticles indicate that TiO2 and Au components exist as separate state in the initial hybrid film and form composite nanoparticles after the removal of the block copolymer matrix.

• Journal of Technologic Dentistry
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• v.31 no.4
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• pp.15-23
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• 2009

The aim of this study was to evaluate the bond strength of using a Au bonding agent applied on cp-Ti and nonprecious metal-gold-ceramic system. Metallic frameworks(diameter: 5mm, height: 20mm)(N=56, n=7per group) cast in Ni-Cr alloy, Co-Cr alloy and cp-Ti were obtained using acrylic templates and airborne particle abraded with $110{\mu}m$ aluminum oxide. Au bonding agent was applied on wash opaque firing as intermediate layer. SEM and SEM/EDS line profile were performed on the cutting the cross-section of the metal substrate-porcelain with intermediate Au coating. Groups were tested using shear bond strength(SBS) testing at 0.5mm/min. The mean SBS values for the ceramic-Au layer-metal combination were significantly higher than those ceramic-metal combination. While ceramic-Au layer-cp-Ti combinations failed to increase bond strength instead of using a titanium bonding porcelain. The appication of using Au intermediate layer significantly improve the bond strength combination with metal-ceramic system.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.288-288
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• 2013

We report the catalytic activity of Au/$TiO_2$ and Pt/$TiO_2$ nanocatalysts under CO oxidation fabricated by arc plasma deposition (APD), which is a facile dry process with no organic materials involved. Using APD, the catalyst nanoparticles were well dispersed on $TiO_2$ powder with an average particle size (2~4 nm) well below that of nanoparticles prepared by the sol-gel method (10 nm). We found that the average particle size of the dispersed gold nanoparticles can be controlled by changing the plasma discharge voltage of APD. Accordingly, the amount of loaded gold on the $TiO_2$ powder increased with increasing discharge voltage, but the specific surface area of the Au/$TiO_2$ samples decreased. As for catalytic reactivity, Au/$TiO_2$ showed a higher catalytic activity than Pt/$TiO_2$ in CO oxidation. The catalytic activity of the Au/$TiO_2$ samples showed size dependence where higher catalytic activity occurred on smaller gold nanoparticles. The study suggests that APD is a simple way to fabricate catalytically active nanocatalysts.