• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2015년도 추계학술대회 논문집
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• pp.156-156
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• 2015

도금 시뮬레이션의 목적은 실제 도금 상황에서의 전류밀도 및 도금두께 분포를 정확히 예측하여 최상의 품질과 최적의 공정조건을 확립하는데 있다. 제품에 부착된 도금 두께는 기하학적 배치에 의한 저항 (1차 전류밀도), 전기화학적 전하교환 반응에 의한 분극 (2차 전류밀도) 및 확산, 유동 등 도금물질의 공급에 의한 분극(3차 전류밀도)에 의해 결정이 된다. 현재까지 도금 시뮬레이션은 1차 전류밀도 예측에 대한 전자기학적 해석과 Butler-Volmer 식에 근거한 동력학적 전기화학 해석을 통해 2차 전류밀도 분포 해석만 이루어졌다. 즉, 도금 반응에 있어서 물질공급은 항상 일정하게 유지되는 것을 가정하고 해석을 하였다. 이는 3차 전류밀도 분포에 있어서 전극반응 계면에서의 유동에 의한 물질공급이 전기화학과는 다른 물리(physics) 영역이어서 이를 전기화학과 coupling 하는데 기술적으로 어렵기 때문이었다. 그러므로, 물질공급반응이 속도결정단계가 되는 고속도금이나 저농도 도금, gap, tranch, via hole, through hole 등의 도금의 경우에는 해석결과에 큰 오차를 야기하게 된다. 본 발표에서는 그동안 접근하지 못했던 전기도금 해석에 있어서 유동해석을 커플링하여 다중물리해석을 한 결과를 발표한다. 시편으로는 회전원판전극과 회전 헐셀을 이용하여 회전속도 (rpm)에 따른 전류밀도 및 도금두께 분포의 변화 거동을 예측하였다.

• 대한치과보존학회:학술대회논문집
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• 대한치과보존학회 2003년도 제120회 추계학술대회 제 5차 한ㆍ일 치과보존학회 공동학술대회
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• pp.546.1-546
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• 2003

Laser doppler flowmeter (LDF) has been applied to the measurement of pulpal blood flow (PBF) in human teeth. As far as we searched, the detection area of the pulp in the blood flow measurement has not been clarified, yet. Therefore, the purpose of this study was to obtain information of the detection area in PBF measurement using LDF. The experiments were performed on the artificial blood circulation in extracted human upper central incisors. The apical portions of examined teeth (n=6) were severed and root canals were enlarged from the apical end to the 2mm incisal to the level of enamel-cement junction. An individual resin cap of each tooth was prepared and a hole was drilled 2mm incisal to enamel-cement junction of the labial side of the cap. The measurement probe of LDF (MBF3D, Moor Instrument, UK) was plugged into the hole of the cap. Heparinized human peripheral blood, which was in advance collected and diluted 3 times with physiological saline, was pumped through the apical foramen of the teeth via a silicone tube and a disposable needle (o.d. 0.7mm) and blood flow signals were monitored. The flux signal significantly increased with the enlargement of the root canal to incisal direction (p<0.01, Friedman analysis). The result indicates that the performance of LDF in PBF with human teeth is limited.

• 한국연소학회:학술대회논문집
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• 한국연소학회 2014년도 제49회 KOSCO SYMPOSIUM 초록집
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• pp.379-381
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• 2014

Influence of fuel concentration gradient was investigated near flame extinction limit in buoyancy-suppressed non-premixed counterflow flame with triple co-flow burner. The use of He curtain flow produced a microgravity level of $10^{-2}-10^{-3}g$ in He-diluted non-premixed counter triple co-flow flame experiments. Flame stability map was presented based on flame extinction and oscillation near extinction limit. The stability map via critical diluent mole fraction with global strain rate was represented by varying outer and inner He-diluted mole fractions. The flame extinction modes could be classified into five: an extinction through the shrinkage of the outmost edge flame forward the flame center with and without self-excitation, respectively ((I) and (II)), an extinction via the rapid expansion of a flame hole while the outmost edge flame is stationary (III), both the outermost and the center edge flames oscillate, and then a donut shaped flame is formed or the flame is entirely extinguished (IV), a shrinkage of the outermost edge flame without self-excitation followed by shrinking or sustain the inner flame (V).

• JSTS:Journal of Semiconductor Technology and Science
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• 제7권3호
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• pp.133-139
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• 2007

Future MEMS systems will be composed of larger varieties of devices with very different functionality such as electronics, mechanics, optics and bio-chemistry. Integration technology of heterogeneous devices must be developed. This article first deals with the current development trend of new fabrication technologies; those include self-assembling of parts over a large area, wafer-scale encapsulation by wafer-bonding, nano imprinting, and roll-to-roll printing. In the latter half of the article, the concept towards the heterogeneous integration of devices and functionality into micro/nano systems is described. The key idea is to combine the conventional top-down technologies and the novel bottom-up technologies for building nano systems. A simple example is the carbon nano tube interconnection that is grown in the via-hole of a VLSI chip. In the laboratory level, the position-specific self-assembly of nano parts on a DNA template was demonstrated through hybridization of probe DNA segments attached to the parts. Also, bio molecular motors were incorporated in a micro fluidic system and utilized as a nano actuator for transporting objects in the channel.

• 반도체디스플레이기술학회지
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• 제3권3호
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• pp.5-9
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• 2004

A new wafer level packaging scheme is presented as an alternative to MEMS package. The proof-of-concept structure is fabricated and evaluated to confirm the feasibility of the idea for MEMS wafer level packaging. The scheme of this work is developed using an electroplated tin (Sn) solder. The critical difference over conventional ones is that wafers are laterally bonded by solder reflow after LEGO-like assembly. This lateral bonding scheme has merits basically in morphological insensitivity and its better bonding strength over conventional ones and also enables not only the hermetic sealing but also its electrical interconnection solving an open-circuit problem by notching through via-hole. The bonding strength of the lateral bonding is over 30 Mpa as evaluated under shear and the hermeticity of the encapsulation is 2.0$\times10^{-9}$mbar.$l$/sec as examined by pressurized Helium leak rate. Results show that the new scheme is feasible and could be an alternative method for high yield wafer level packaging.

• 대한신경집중치료학회지
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• 제11권2호
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• pp.119-123
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• 2018

Background: Since the first report of a rapidly resolved subdural hemorrhage (SDH) in 1986, few additional case reports have been presented in the literature. Case Report: An 82-year-old female patient presented with a SDH over the left convexity. The SDH was removed via catheter drainage through a burr hole trephination. Post-operative computed tomography (CT) following 300 mL drainage from the chronic SDH demonstrated a newly developed SDH along the right convexity. A follow-up CT performed 2 hours later revealed an unexpected significant resolution of the acute SDH. Conclusion: The spontaneous resolution of acute SDH is believed to result from redistribution by washout of the hematoma by cerebrospinal fluid dilution. However, its exact pathophysiology is not well understood. When surgical evacuation is considered in acute SDH, conservative management should also be considered because spontaneous resolution of hemorrhage remains a possibility.

• 센서학회지
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• 제29권5호
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• pp.354-359
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• 2020

The high vacuum hermetic sealing technique ensures excellent performance of MEMS resonators. For the high vacuum hermetic sealing, the customization of anodic bonding equipment was conducted for the glass/Si/glass triple-stack anodic bonding process. Figure 1 presents the schematic of the MEMS resonator with triple-stack high-vacuum anodic bonding. The anodic bonding process for vacuum sealing was performed with the chamber pressure lower than 5 × 10^-6 mbar, the piston pressure of 5 kN, and the applied voltage was 1 kV. The process temperature during anodic bonding was 400 ℃. To maintain the vacuum condition of the glass cavity, a getter material, such as a titanium thin film, was deposited. The getter materials was active at the 400 ℃ during the anodic bonding process. To read out the electrical signals from the Si resonator, a vertical feed-through was applied by using through glass via (TGV) which is formed by sandblasting technique of cap glass wafer. The aluminum electrodes was conformally deposited on the via-hole structure of cap glass. The TGV process provides reliable electrical interconnection between Si resonator and aluminum electrodes on the cap glass without leakage or electrical disconnection through the TGV. The fabricated MEMS resonator with proposed vacuum packaging using three-layer anodic bonding process has resonance frequency and quality factor of about 16 kHz and more than 40,000, respectively.

• Journal of the Optical Society of Korea
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• 제18권5호
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• pp.531-537
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• 2014

Through-silicon vias (TSVs) are fine, deep holes fabricated for connecting vertically stacked wafers during three-dimensional packaging of semiconductors. Measurement of the TSV geometry is very important because TSVs that are not manufactured as designed can cause many problems, and measuring the critical dimension (CD) of TSVs becomes more and more important, along with depth measurement. Applying white-light scanning interferometry to TSV measurement, especially the bottom CD measurement, is difficult due to the attenuation of light around the edge of the bottom of the hole when using a low numerical aperture. In this paper we propose and demonstrate four bottom CD measurement methods for TSVs: the cross section method, profile analysis method, tomographic image analysis method, and the two-dimensional Gaussian fitting method. To verify and demonstrate these methods, a practical TSV sample with a high aspect ratio of 11.2 is prepared and tested. The results from the proposed measurement methods using white-light scanning interferometry are compared to results from scanning electron microscope (SEM) measurements. The accuracy is highest for the cross section method, with an error of 3.5%, while a relative repeatability of 3.2% is achieved by the two-dimensional Gaussian fitting method.

• 마이크로전자및패키징학회지
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• 제21권4호
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• pp.91-96
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• 2014

TSV기술은 실리콘 칩에 관통 홀(through silicon via)을 형성하고, 비아 내부에 전도성 금속으로 채워 수직으로 쌓아 올려 칩의 집적도를 향상시키는 3차원 패키징 기술로서, 와이어 본딩(wire bonding)방식으로 접속하는 기존의 방식에 비해 배선의 거리를 크게 단축시킬 수 있다. 이를 통해 빠른 처리 속도, 낮은 소비전력, 높은 소자밀도를 얻을 수 있다. 본 연구에서는 웨이퍼 레벨에서의 TSV 충전 경향을 조사하기 위하여, 실리콘의 칩 레벨에서부터 4" 웨이퍼까지 전해 도금법을 이용하여 Cu를 충전하였다. Cu 충전을 위한 도금액은 CuSO4 5H2O, H2SO4 와 소량의 첨가제로 구성하였다. 양극은 Pt를 사용하였으며, 음극은 $0.5{\times}0.5 cm^2{\sim}5{\times}5cm^2$ 실리콘 칩과 4" 실리콘 wafer를 사용하였다. 실험 결과, $0.5{\times}0.5cm^2$ 실리콘 칩을 이용하여 양극과 음극과의 거리에 따라 충전률을 비교하여 전극간 거리가 4 cm일 때 충전률이 가장 양호하였다. $5{\times}5cm^2$ 실리콘 칩의 경우, 전류 공급위치로부터 0~0.5 cm 거리에 위치한 TSV의 경우 100%의 Cu충전률을 보였고, 4.5~5 cm 거리에 위치한 TSV의 경우 충전률이 약 95%로 비아의 입구 부분이 완전히 충전되지 않는 경향을 보였다. 전극에서 멀리 떨어져있는 TSV에서 Cu 충전률이 감소하였으며, 안정된 충전을 위하여 전류를 인가하는 시간을 2 hrs에서 2.5 hrs로 증가시켜 4" 웨이퍼에서 양호한 TSV 충전을 할 수 있었다.

• Journal of Korean Neurosurgical Society
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• 제29권11호
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• pp.1505-1513
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• 2000

Objectives : Many surgical procedures have been introduced to a symptomatic lumbar stenosis. Most of these procedures still have been regarded as an extensive surgical intervention with respect to normal aging process of the lumbar spine. We adopted a microsurgical decompression procedure via unilateral exposure as a minimally invasive intervention for symptomatic lumbar stenosis without instability. Materials and Methods : Fifty-seven patients with symptomatic lumbar stenosis underwent microsurgical decompression via unilateral laminotomy between March 1998 and December 1999. The conceptual modification and technical refinements were added to the previously reported microsurgical decompression procedure. Bilateral decompression through a unilateral laminotomy hole was performed in 11 patients. These patients profile also included 9 cases of degenerative spondylolisthesis(Grade I) without instability. Results : Preoperative neurogenic intermittent claudication(NIC) was more notably improved than low back pain, 60% to 82% during the follow-up period. Overall clinical results were excellent in 20(35%), good in 29(51%), fair in 6(11%) and poor in 2(3%). Conclusions : Microsurgical decompression for lumbar stenosis with stable spine provided a satisfactory symptomatic improvement without extensive destruction of the weight-bearing structures and functional mobile segments, even bilateral symptoms existed.