• 제목/요약/키워드: Three microstrip lines

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쉬해석에 의한 다층 다중 결합 마이크로스트립 선로 해석 (Numerical Analysis of Multi-Layer Multi-Coupled Microstrip Lines)

  • 서철헌
    • The Journal of the Acoustical Society of Korea
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    • 제13권1E호
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    • pp.5-10
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    • 1994
  • 삼층 기판위의 삼중 결합 마이크로스트립 서로의 해석을 위한 수치해석의 일반식이 얻어졌다. 유한차분식을 얻기 위한 방법과 특이점 처리를 위한 최적의 방법이 구해졌다. 홀수 모드와 짝수 모드의 캐패시턴스와 특성 임피이던스의 수치해석 결과를 보였으며 그 결과들은 이층의 두께와 삼층의 마치크로스트립 폭의 비에 따라 구해졌다. 수치해석으로 구한 짝수 모드 캐패시턴스는 다른 수치해석 결과와 비교되었다.

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세 개의 마이크로스트립 전송선로간의 크로스톡 (Crosstalk among three microstrip transmission lines)

  • 최재연;이상설
    • 전자공학회논문지D
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    • 제34D권5호
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    • pp.14-21
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    • 1997
  • The crosstalk among three identical uniform coupled microstrip transmissiom lines is examined. To analyze the crosstalk, the simultaneous equations for the voltage and current waves on each transmission line are induced from the transmission line equation. The capacitance and the inductance of the line to solve the transmission line equation are calculated by the spectral domain analysis and the space domian analysis. There are three quasi-TEM modes is three microstrip transmission lines and the characteristics mode impedences in each mode are almost equal at a weak coupling state. The crosstalk among three identical microstrip transmission lines is calculated varying the frequency from 50MHz to 3GHz.

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MIC를 위한 2선 및 3선 결합선로의 Quasi TEM Mode 정수계산

  • 류범;김청식;진년강
    • 한국통신학회:학술대회논문집
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    • 한국통신학회 1986년도 춘계학술발표회 논문집
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    • pp.194-197
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    • 1986
  • The normal mode parameters of microstrip coupled lines are datermined from the self and mutual capacitance and inductance of microstrip lines. In this paper, these capacitance are computed by using the relaxation method based on Quas1-TEM model for shoelded structure. Using these results, the normal mode parameters of two and three microstrip coupled lines are obtained.

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Quasi-static Analysis on the Effect of the Finite Metal with the Anisotropic Grooved Dielectric in Microstrip Lines

  • Hong Ic-Pyo
    • 마이크로전자및패키징학회지
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    • 제12권1호
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    • pp.17-20
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    • 2005
  • In this paper, we presented the quasi-static characteristics of novel microstrip lines with anisotropic grooved dielectric in finite metal. A quasi-static mode-matching method has been used to analyze this new structure and the simulation results are validated through comparison with other available results. The results in this paper show that it is possible to control the propagation characteristics of microstrip lines with the use of anisotropic grooved dielectric in finite metal. Also anisotropic grooved dielectric in microstrip line can be newly added to the design parameters of high performance three dimensional monolithic microwave circuits and other microwave applications.

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세 개의 분기선로를 갖는 WLAN에 적용가능한 삼중대역 안테나 설계 및 제작 (Design and Fabrication of Triple-Band Antenna with Three Branch Lines for WLAN Applications)

  • 하성재;윤중한
    • 한국전자통신학회논문지
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    • 제14권1호
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    • pp.119-126
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    • 2019
  • 본 논문에서는 WLAN 표준화에 적합하도록 삼중대역 안테나를 설계, 제작 및 측정하였다. 마이크로스트립 급전방법을 적용하여 세 개의 마이크로스트립 선로를 갖도록 설계하였으며 임피던스 특성을 향상시키기 위해 하나의 스터브 추가하여 삼중대역 특성을 얻었다. 요구되는 주파수 대역과 임피던스 대역폭을 얻기 위해 세개 분기 선로의 길이와 폭을 설정하고 스터브 길이를 조정하고 최적화하였다. 제안된 안테나는 $24.0mm(W){\times}60.0mm(L){\times}1.0mm(t)$의 유전체 기판 위에 $23.0mm(W_2+W_4){\times}53.1mm(L_1)$의 크기로 제작되었다. 제작 및 측정 결과로부터 900 MHz에서는 159 MHz (841~1000 MHz), 2400 MHz 대역에서는 630 MHz (2.32~2.95 GHz) 그리고 5000 MHz 대역에서는 1,040 MHz (4.95~5.99 GHz)의 대역폭을 얻었다. 또한 무반사실의 측정결과로부터 제작된 안테나의 이득과 방사패턴 특성을 확인하였다.

시간 영역 유한 차분법을 이용한 마이크로스트립 구조의 풀-웨이브 해석 (Full-Wave Analysis of Microstrip Structures by Time-Domain Finite Difference (TDFD) Method)

  • 김동욱;홍성철;이기로
    • 전자공학회논문지A
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    • 제29A권7호
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    • pp.31-38
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    • 1992
  • In this paper, numerical analysis package using Time-Domain Finite Difference (TDFD) method is developed to solve the initial value problem of Maxwell's equation and applied to several microstrip structures. TDFD allows us to show graphically the evolution of the crosswalk between microstrip lines. Moreover, we can obtain transmission line parameters and scattering parameters through Fourier transform of TDFD results in easy and efficient ways. TDFD is successfully applied to :1) wide band electromagnetic wave propagation along the single microstrip line, 2) crosswalk analysis between two microstrip lines, and 3) three metal line side-coupled filter. Our results show much better agreement with other theoretical experimental results reported in the literature. Thus we expect that TDFD is very useful to designing MMIC(Monolithic Microwave Integrated Circuit).

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Analysis and Reduction of Crosstalk on Coupled Microstrip tines by Using FDTD Method

  • Pichaya Supanakoon;Monchai Chamchoy;Panarat Rawiwan;Prakit Tangtisanon;Sathaporn Promwong;Teerasilpa Dumwipata;Takada, Jun-ichi
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2002년도 ITC-CSCC -1
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    • pp.523-526
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    • 2002
  • The crosstalk among coupled microstrip lines is the major limiting factors of signal qualities in the high-speed digital and communication equipment. In this paper, a three-dimensional finite difference time domain (FDTD) method is applied to analyze the crosstalk between the coupled microstrip lines. The proposed structures of the coupled microstrip lines are investigated to reduce the coupling in a simple way by modifying their ground plane with an optimum gap. The examples of these structures with the different sizes of the gaps on their ground plane are studied. These structures are considered as the four-port network to evaluate transmission efficiency, near- and far-end crosstalk. Gaussian pulse is excited to evaluate the frequency characteristics from dc to 30 ㎓. The transmission efficiency, near- and far-end crosstalk of each structure of the coupled microstrip lines are demonstrated. The numerical results of this study show that the majority of crosstalk is the far-end crosstalk. The usage of the optimum gap on the ground plane can reduce the far-end crosstalk of the coupled microstrip lines while the transmission efficiency is nearly equal.

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적응 PEEC 격자를 이용한 마이크로스트립의 인덕턴스 계산 (Inductance Extraction of Microstrip Lines using Adaptive PEEC Grid)

  • 김한;안창회
    • 한국전자파학회논문지
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    • 제14권8호
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    • pp.823-829
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    • 2003
  • 고주파용 마이크로스트립 선로의 모델링에 필수적인 인덕턴스의 빠른 추출을 위해서 고속화 알고리즘(fast mutilpole method)과 결합된 적응 PEEC 격자분할법(adaptive PEEC grid refinement algorithm)을 제안하였다. 격자의 세분화는 마이크로스트립 선로의 구조와 사용주파수에 따른 전류분포에 적합하도록 이루어졌는데, 이 적응 격자는 주로 전류분포가 높은 영역에서 더 세분화된다. 이 기법을 이용하여 마이크로스트립 선로의 인덕턴스를 구하였고, 계산결과는 빠르게 수렴하여 계산시간과 격자 수를 줄이는데 효율적임을 보였다.

전자기적 결합을 이용한 이층 마이크로스트립선로의 접속 구조 (Interconnection structures of bilevel microstriplines using electromagnetic coupling)

  • 박기동;이현진;임영석
    • 전자공학회논문지A
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    • 제32A권8호
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    • pp.47-55
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    • 1995
  • Proximity-coupled open-end microstrip interconnections in bilevel planar structures are investigated through three-dimensional finite-difference time-domain(3D-FDTD) method. Three types of EMC (electromagnetically coupled) microstriplines are considered, collinear lines, transverse lines and modified EMC structure. From the analyzed results, it is found that these EMC interconnections have the coupling coefficient enough to interconnect lines in bilevel structures over a broad-band. The computed results of the modified EMC structure was compared with measurement from physical model and the computed results of via hole interconnection.

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A TX Clock Timing Technique for the CIJ Compensation of Coupled Microstrip Lines

  • Jung, Hae-Kang;Lee, Soo-Min;Sim, Jae-Yoon;Park, Hong-June
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제10권3호
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    • pp.232-239
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    • 2010
  • By using the clock timing control at transmitter (TX), the crosstalk-induced jitter (CIJ) is compensated for in the 2-bit parallel data transmission through the coupled microstrip lines on printed circuit board (PCB). Compared to the authors' prior work, the delay block circuit is simplified by combining a delay block with a minimal number of stages and a 3-to-1 multiplexer. The delay block generates three clock signals with different delays corresponding to the channel delay of three different signal modes. The 3-to-1 multiplexer selects one of the three clock signals for TX timing depending on the signal mode. The TX is implemented by using a $0.18\;{\mu}m$ CMOS process. The measurement shows that the TX reduces the RX jitters by about 38 ps at the data rates from 2.6 Gbps to 3.8 Gbps. Compared to the authors' prior work, the amount of RX Jitter reduction increases from 28 ps to 38 ps by using the improved implementation.