• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.4
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• pp.352-356
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• 2007

The Ni/Cr/Al/Cu (51/41/4/4 wt%) thin films were deposited by using DC magnetron sputtering method for the application of the resistors having low TCR (temperature coefficients of resistance) and high resistivity from the former printed-results[3]. The TCR values measured on the as-deposited thin film resistors were less than ${\pm}10\;ppm/^{\circ}C$ and $-6{\sim}+1\;ppm/^{\circ}C$ after annealing and packaging process. The TCR values were $-3{\sim}1\;ppm/^{\circ}C$ (ratio of variation : about 0.02 %) and $-30{\sim}20\;ppm/^{\circ}C$ (ratio of variation : about $0.5{\sim}1\;%$) for the thermal cycling and PCT (pressure cooker test), respectively. It was confirmed that the reliability properties of the thin film resistor were good for electronic components.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07b
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• pp.782-784
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• 2002

Many compound semiconductors which have high carrier mobility and small band gap have attentive in application of various practical a field. Especially, InSb served for Hall device and magnetic resistor such as magnetic sensor because InSb thin film has high mobility. Many studies on InSb thin film deposition because In and Sb has been very different feature of vapor pressure($10^4$ times) When In and Sb deposited. In this paper studied it In and Sb deposited simultaneously using by method of co-sputtering deposotion. This process, get to effects of manufacture process simplification. After that this paper observed micro structure and electronic behavior of InSb thin film using by co-sputtering.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.11a
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• pp.370-374
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• 2002

Many compound semiconductors which have high carrier mobility and small band gap have attentive in application of various practical a field. Especially, InSb served for Hall device and magnetic resistor such as magnetic sensor because InSb thin film has high mobility. Many studies on InSb thin film deposistion because In and Sb has been very different feature of vapor pressure ($10^{-4}$ times) When In and Sb deposited. In this paper studied it In and Sb deposited simultaneously using by method of co-sputtering deposotion. This process, get to effects of manufacture process simplification. After that this paper observed micro structure and electronic behavior of InSb thin film using by co-sputtering and we study properties of magneto-resistance by annealing.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.08a
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• pp.128-132
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• 2002

Many compound semiconductors which have high carrier mobility and small band gap have attentive in application of various practical a field. Especially, InSb served for Hall device and magnetic resistor such as magnetic sensor because InSb thin film has high mobility. Many studies on InSb thin film deposistion because In and Sb has been very different feature of vapor pressure($10^{-4}$ times) When In and. Sb deposited. In this paper studied it In and Sb deposited simultaneously using by method of co-sputtering deposotion. This process, get to effects of manufacture process simplification. After that this paper observed micro structure and electronic behavior of InSb thin film using by co-sputtering and we study properties of magneto-resistance by annealing

• Journal of the Korean Vacuum Society
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• v.6 no.1
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• pp.77-84
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• 1997

Super precision resistor was manufactured by controlling properly the thickness of $TaN_{0.1}$ (negative TCR) and Cr(positive TCR) deposited on cylindrical alumina substrate (diameter: 4 mm, length: 11 mm). Multilayer thin film resistor of $Ta_2O_5/TaN_{0.1}$/Cr/Alumina (substrate) was manufactured by depositing of $Ta_2N_5$ film on $TaN_{0.1}$ film to increase Rs to the level of 1;k{\Omega}/{\box}$ and to passivate the film. Super precision resistor with TCR of $20\pm5 ppm/^{\circ}C$ and Rs of $1\;k{\Omega}/{\box}$ was manufactured by depositing thin layers of about 10 nm $Ta_2O_5$, 100 nm $TaN_{0.1}$ and 50 nm Cr film under the properly controlled sputtering condition.

• Journal of the Korean Vacuum Society
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• v.16 no.6
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• pp.439-445
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• 2007

SiGe integrated circuits are being used in the field of high-speed wire/wireless communications and microwave systems due to the RF/high-speed analog characteristics and the easiness in the fabrication. Reducing the resistance variation in SiGe thin film resistors results in enhancing the reliability of integrated circuits. In this paper, we investigate the causes that generate the resistance nonuniformity after the silicon-based thin film resistor was fabricated, and consider the counter plan against that. Because the Ti-B precipitate, which formed during the silicide process of the SiGe thin film resistor, gives rise to the nonuniformity of SiGe resistors, the boron ions should be implanted as many as possible. In addition, the resistance deviation increases as the size of the contact hole that interconnects the SiGe resistor and the metal line decreases. Therefore, the size of the contact hole must be enlarged in order to reduce the resistance deviation.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.809-812
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• 2001

We were fabricated of NiCr thin film resistors on A1$_2$O$_3$and SiO$_2$/Si substrates by dc magnetron sputtering system. The AC characteristics of resistors were studied. The cut-off frequency were found >10 MHz for the resistors with 39 ohm value of Alumina substrates, but the cut-off frequency were found 400 kHz for the resistors with 168 ohm value of SiO$_2$/Si substrates. In high frequency applications, the substrate selection is the most important factor.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.126-126
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• 2012

In past decades, the themal inkjet (TIJ) printer has been widely used as one of the most well-known digital printing technology due to its low cost, and high printing quality. Since the printing speed of TIJ printers are much slower than that of laser printers, however, there has been intensive efforts to raise the printing speed of TIJ printers. One of the most plausible methods to raise the printing speed of TIJ printers is to adopt a page-wide array TIJ printhead. To accomplish this goal, the high efficiency inkjet heating resistor films should be developed to settle the high power consumption problem of a page-wide array TIJ printhead. In this study, we investigated noble metal based multicomponent thin film resistor films prepared by atomic layer deposition (ALD) for a high efficiency inkjet printhead. Design concept, preparation, material properties of noble metal based multicomponent thin films will be discussed in terms of mutlfunctionality.

• Proceedings of the Korean Institute of Communication Sciences Conference
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• 1983.04a
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• pp.45-47
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• 1983

In integrated circuit, for a saving in total chip area per circuit, stably high value resistor was fabricated. Hence this paper explained that the measurement and fabrication of high value semiconductor resistor using ITO thin film. It is also used special material and new method fabrication.

• Proceedings of the Materials Research Society of Korea Conference
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• 1992.05b
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• pp.78-78
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• 1992