• Title/Summary/Keyword: Thin film evaporation

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The Change of Physical Properties of Thin Metal Film with than Evaporating Incident Angles (증착 입사각에 따른 금속박막의 물성 변화)

  • Jin, Hui-Chang;Jo, Hyeon-Chun;Baek, Su-Hyeon
    • Journal of the Korean institute of surface engineering
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    • v.20 no.2
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    • pp.43-48
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    • 1987
  • Chromium and Aluminum films were deposited by evaporation technique in $3{\times}10^{-6}$ mbar vacuum level at the incident angles ranging from $0^{\circ}\;to\;60^{\circ}$ with various evaporation rates. We measured the sheet resistances and light transmittances, and observed diffraction patterns by TEM of these films. Relations among diffraction patterns, sheet resistances and light transmittances were discussed. The sheet resistances and light transmittances were shown the lowest values at 25$^{\circ}C$ of incident angle for all kinds of evaporation rates.

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Optical Transmittance Variation to Thickness of Nickel Thin Films (니켈박막의 두께에 따른 광투과율변화)

  • Yang, Ki-Won;Son, Jeong-Sik;Kwak, Ho-Weon;Lee, Haeng Ki;Park, Sang Chul
    • Journal of Korean Ophthalmic Optics Society
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    • v.13 no.1
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    • pp.49-52
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    • 2008
  • To study the optical transmittance through nickel thin films with various thicknesses. Methods: We measured the optical transmittance through thin nickel film with various thicknesses. Results: The thickness dependence of the optical transmittance through nickel thin films deposited by thermal evaporation had been investigated. The optical transmittance rapidly decreased with the Ni film thickness less than 70 nm while it slightly decreased with the thickness more than 70 nm. In the experiment of optical dispersion, most of the light transmitted in the incidence direction. The result of experiment showed that optical dispersion was negligibly. Conclusions: Optical transmittance exponentially decreased as nickel thin film thickness increased.

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Evaluation of Transparent Amorphous $V_2O_5$ Thin Film Prepared by Thermal Evaporation (진공증착법으로 제조한 투명 비정질 $V_2O_5$박막의 특성평가)

  • Hwang, Kyu-Seog;Jeong, Seol-Hee;Jeong, Ju-Hyun
    • Journal of Korean Ophthalmic Optics Society
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    • v.13 no.1
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    • pp.27-30
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    • 2008
  • Purpose: This research is that $V_2O_5$ cathode's composition is possible in low temperature. Methods: Transparent in visible spectra range and crystallographically amorphous $V_2O_5$ thin films were prepared by simple vacuum thermal evaporation on soda-lime-silica slide glass substrate. After annealing at 100$^{\circ}C$, 150$^{\circ}C$ and 200$^{\circ}C$ for 10 minutes in air, the surface morphology and the fracture-cross section of the films were investigated by field emission - scanning electron microscope. Transmittance in visible spectra range and surface roughness of the films were analyzed by ultra violet - visible spectrophotometer and scanning probe microscope, respectively. Results: As the increase of annealing temperature from 100$^{\circ}C$ to 150$^{\circ}C$ and 200$^{\circ}C$, transmittance of the $V_2O_5$ films decreased. Optical properties will be fully discussed on the basis of the surface morphological results. Conclusions: Optical transmissivity was superior in case of 100$^{\circ}C$, and could make amorphous $V_2O_5$ thin film that surface quality of thin film did homogeneity.

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Thermal and Adhesive Properties of Cu Interconnect Deposited by Electroless Plating (무전해도금 구리배선재료의 열적 및 접착 특성)

  • 김정식;허은광
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2001.07a
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    • pp.100-103
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    • 2001
  • In this study, the adhesion and thermal property of the electroless-deposited Cu thin film were investigated. The multilayered structure of Cu/TaN/Si was fabricated by electroless-depositing the Cu thin layer on the TaN diffusion barrier which was deposited by MOCVD on the Si substrate. The thermal stability was investigated by measuring the resistivity as post-annealing temperature far the multilayered Cu/TaN/Si specimen which was annealed at Ar gas. The adhesion property of Cu 171ms was evaluated by the scratch test. The adhesion of the electroless-deposited Cu film was compared with other deposition methods of thermal evaporation and sputtering. The scratch test showed that the adhesion of electroless plated Cu film on TaN was better than those of sputtered Cu film and evaporated Cu film.

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Role of Liquid Vaporization in Liquid-Assisted Laser Cleaning (액막 보조 레이저 세척에서 액체 기화의 역할)

  • Lee, Joo-Chul;Jang, Deok-Suk;Kim, Dong-Sik
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.27 no.2
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    • pp.188-196
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    • 2003
  • Liquid-assisted cleaning technology utilizing a nanosecond laser pulse is effective for removing submicron particulates from a variety of solid substrates. In the technique, saturated vapor is condensed on a solid surface to form a thin liquid film and the film is evaporated explosively by laser heating. The present work studies the role of liquid-film evaporation in the cleaning process. First, optical interferometry is employed for in-situ monitoring the displacement of the laser-irradiated sample in the cleaning process. The experiments are performed for estimating the recoil force exerted on the target with and without liquid deposition. Secondly, time-resolved visualization and optical reflectance probing are also conducted for monitoring the phase-change kinetics and plume dynamics in vaporization of thin liquid layers. Discussions are made on the effect of liquid-film thickness and dynamics of plume and acoustic wave. The results confirm that cleaning force is generated when the bubble nuclei initially grow in the strongly superheated liquid.

An Experimental Study on the Effects of Porous Layer Treatment on Evaporative Cooling of an Inclined Surface (다공물질 표면처리가 경사판의 증발냉각에 미치는 영향에 관한 실험적 연구)

  • Lee Dae Young;Lee Jae Wan;Kang Byung Ha
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.17 no.1
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    • pp.25-32
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    • 2005
  • Falling film heat transfer has been widely used in many applications in which heat and mass transfer occur simultaneously, such as evaporative coolers, cooling towers, absorption chillers, etc. In such cases, it is desirable that the falling film spreads widely on the surface forming thin liquid film to enlarge contact surface and to reduce the thermal resistance across the film and/or the flow resistance to the vapor stream over the film. In this work, the surface is treated to have thin porous layer on the surface. With this treatment, the liquid can be spread widely on the surface by the capillary force resulting from the porous structure. In addition to this, the liquid can be held within the porous structure to improve surface wettedness regardless of the surface inclination. The experiment on the evaporative cooling of an inclined surface has been conducted to verify the effectiveness of the surface treatment. It is measured that the evaporative heat transfer increases about $50\%$ by the porous layer treatment as compared with that from orignal bare surfaces.

Flow and Heat Transfer Characteristics of the Evaporating Extended Meniscus in a Micro Parallel Plate (마이크로 평판내 증발에 의한 확장초승달영역의 열/유동특성)

  • Park, Kyong-Woo;Noh, Kwan-Joong;Lee, Kwan-Soo
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.27 no.4
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    • pp.476-483
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    • 2003
  • A mathematical model is presented to predict the two-phase flow and heat transfer phenomena of the evaporating extended meniscus region in a micro-channel. The pressure difference at the liquid-vapor interface can be obtained by the augmented Laplace-Young equation. The correlative equations for film thickness, pressure, and velocity in the meniscus region are derived by applying the mass, momentum, and energy equations into the control volume. The results show that increasing the heat flux and the liquid inlet velocity cause the length and liquid film thickness of the extended meniscus region to decrease. The variation, however, of the heat flux and liquid inlet velocity has no effect on the profile of film thickness. The majority of heat is transferred through the thin film region that is a very small region in the extended meniscus region. It is also found that the vapor velocity increases gradually in the meniscus region. However, it increases sharply at the junction of the meniscus and thin film regions.

Comparative Study on Interfacial Traps in Organic Thin-Film Transistors According to Deposition Methods of Organic Semiconductors

  • Park, Jae-Hoon;Bae, Jin-Hyuk
    • Journal of the Korean Applied Science and Technology
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    • v.30 no.2
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    • pp.290-296
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    • 2013
  • We analysed interfacial traps in organic thin-film transistors (TFTs) in which pentacene and 6,13-bis(triisopropylsilylethynyl)-pentacene (TIPS-pentacene) organic semiconductors were deposited by means of vacuum-thermal evaporation and drop-coating methods, respectively. The thermally-deposited pentacene film consists of dentritic grains with the average grain size of around 1 m, while plate-like crystals over a few hundred microns are observed in the solution-processed TIPS-pentacene film. From the transfer characteristics of both TFTs, lower subthreshold slope of 1.02 V/decade was obtained in the TIPS-pentacene TFT, compared to that (2.63 V/decade) of the pentacene transistor. The interfacial trap density values calculated from the subthreshold slope are about $3.4{\times}10^{12}/cm^2$ and $9.4{\times}10^{12}/cm^2$ for the TIPS-pentacene and pentacene TFTs, respectively. Herein, lower subthreshold slope and less interfacial traps in TIPS-pentacene TFTs are attributed to less domain boundaries in the solution-processed TIPS-pentacene film.

Chemical Degradation of Tungsten Oxide Thin Films (텅스텐 산화물 박막의 화학적 퇴화)

  • Lee, Kil-Dong
    • Solar Energy
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    • v.15 no.3
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    • pp.141-149
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    • 1995
  • The tungsten oxide thin films were prepared on $s_i$ wafer by using an electron-beam evaporation technique. Thickness and structure of tungsten oxide film degraded in various electrolytes were analyzed by Rutherford backscattering spectroscopy, Raman spectroscopy, X-ray photoelectron spectroscopy and scanning electron microscope. Thickness of $WO_3$ film was the most dissolved in 1M $H_2SO_4$ electrolytye. We have confirmed that the degradation of this films was accelerated by $H_2O$ in electrolytes. But the electronic structure of film degraded by electrolyte contained of glycerol was not changed as comparision with as-deposited film. The degradation may be attributed to a change of thickness and the surface morphology of the film.

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MEVVA ion Source And Filtered Thin-Film Deposition System

  • Liu, A.D.;Zhang, H.X.;Zhang, T.H.;Zhang, X.Y.;Wu, X.Y.;Zhang, S.J.;Li, Q.
    • Journal of Korean Vacuum Science & Technology
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    • v.6 no.2
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    • pp.55-57
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    • 2002
  • Metal-vapor-vacuum-arc ion source is an ideal source for both high current metal ion implanter and high current plasma thin-film deposition systems. It uses the direct evaporation of metal from surface of cathode by vacuum arc to produce a very high flux of ion plasmas. The MEVVA ion source, the high-current metal-ion implanter and high-current magnetic-field-filtered plasma thin-film deposition systems developed in Beijing Normal University are introduced in this paper.

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