• 제목/요약/키워드: Thin Film Adhesion

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Formation of a Buffer Layer on Mica Substrate for Application to Flexible Thin Film Transistors (운모 기판을 플렉시블 다결정 실리콘 박막 트랜지스터에 적용하기 위한 버퍼층 형성 연구)

  • Oh, Joon-Seok;Lee, Seung-Ryul;Lee, Jin-Ho;Ahn, Byung-Tae
    • Korean Journal of Materials Research
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    • v.17 no.2
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    • pp.115-120
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    • 2007
  • Polycrystalline silicon (poly-Si) thin film transistors (TFTs) might be fabricated on the mica substrate and transferred to a flexible plastic substrate because mica can be easily cleaved into a thin layer. To overcome the adhesion and stress problem between poly-Si film and mica substrate, a buffer layer consisting of $SiO_x/Ta/Ti$ three layers has been developed. The $SiO_x$ layer is for electrical isolation, the Ti layer is for adhesion of $SiO_{x}$ and mica. and Ta is for stress relief between $SiO_x$ and Ti. A TFT was fabricated on the mica substrate by a conventional Si process and was successfully transferred to a plastic substrate.

Characteristics Evaluation of Thin Films Formed on Mg-Al Alloy in Various Chemical Conversion Solution Conditions (다양한 화성처리 용액 조건에서 마그네슘-알루미늄 합금위에 형성된 박막의 특성 평가)

  • Jang Seok-Ki;Kim Seong-Jong;Kim Jeong-Il
    • Journal of Advanced Marine Engineering and Technology
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    • v.29 no.1
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    • pp.98-106
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    • 2005
  • The chemical conversion film formed on magnesium alloy was investigated by using the colloidal silica with some parameters such as solution pH. temperature, solution conditions, and treatment time. Moreover. the solutions consisted of colloidal silica titanium sulfate, and cobalt ions were used for the colloidal silica film to having a good corrosion resistance and adhesion properties. It was thought that the film at 298K was made with combination of Si-O. The quantity of film formed at high temperature such as 333K and 353K is smaller than dissolved quantity during chemical conversion treatment. Adding $CoSO_4$ to the colloidal silica solution enhanced the adhesion force between the silica film and magnesium substrate, The optimum conditions for the chemical conversion treatment solution were PH 2.90 s treatment, and 298K.

Fabrication of $PbTiO_3$ Thin Film by Chemical Vapor Deposition Technique (화학증착법에 의한 $PbTiO_3$ 박막의 재료)

  • 윤순길;김호기
    • Journal of the Korean Ceramic Society
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    • v.23 no.6
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    • pp.33-36
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    • 1986
  • The $PbTiO_3$is well known materials having remarkable ferroelectric piezoelectric and pyro-electric properties. Thin films of the lead titanite has been successfully fabricated by Chemical Vapor Deposition on the borosilicate glass and titanium substrate. The $PbTiO_3$ thin film deposited on the borosilicate glass using the $PbCl_2$, $TiCl_4$ dry oxygen and wet oxygen at different temperatures (50$0^{\circ}C$-$700^{\circ}C$) grows along the (001) preferred orientation. On the other hand the $PbTiO_3$ thin film deposited on the titanium substrate using the PbO grows along the (101) preferred orientation. Growth orientation of deposited $PbTiO_3$ depends on the reaction species irrespective of substrate materials. Maximum dielectic constant and loss tangent of the $PbTiO_3$ thin film deposited on the titanium substrate are about 90 and 0.02 respectively, . Deposition rates of $PbTiO_3$ deposited on the borosilicate glass and titanium substrate are 10-15 ${\mu}{\textrm}{m}$/hr. Titanium dioxide interlayer formed be-tween $PbTiO_3$ film and titanium substrate material, It improved the adhesion of the film.

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The effect of mechanical properties of carbon-based thin film on plasma nitrided injection mold steel (플라즈마 질화처리한 사출금형소재의 비정질 탄소계 박막 증착에 따른 기계적 특성 향상 효과)

  • Hye-Min Kim;Dae-Wook Kim
    • Journal of Surface Science and Engineering
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    • v.56 no.5
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    • pp.328-334
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    • 2023
  • The carbon-based films have various properties, which have been widely applied in industrial application. However, it has critical drawback for poor adhesion between films and metal substrate. In the present work, we have deposited carbon-based films on injection mold steel by plasma assisted chemical vapor deposition (PACVD). In order to improve adhesion, prior to film deposition, the substrate was nitriding-treated using PACVD. And its effect on the adhesion was investigated. Due to the pre-nitriding, the amorphous carbon nitride (a-CN:H) films presented 10 times higher adhesion (34.9 N) than that of un-nitirided. In addition, a friction coefficient was decreased from 0.29 to 0.15 for the amorphous carbon (a-C:H) due to improved adhesion. The obtained results demonstrated that pre-nitriding considerably improved the adhesion, and the relationship among adhesion, hardness, and surface roughness was discussed in detail.

Fabrication of Pt Thin-film Type Microheater for Thermal Microsensors and Its Characteristics (열형 마이크로센서용 백금박막형 미세발열체의 제작과 그 특성)

  • 정귀상;홍석우
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.13 no.6
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    • pp.509-513
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    • 2000
  • The physical and electrical characteristics of MgO and Pt thin-films on it deposited by reactive sputtering and rf magnetron sputtering respectively were analyzed with annealing temperature and time by four point probe SEM and XRD. Under annealing conditions of 100$0^{\circ}C$ and 2 hr, MgO thin-film had the properties of improving Pt adhesion to SiO$_2$and insulation without chemical reaction to Pt thin-film and the sheet resistivity and the resistivity of Pt thin-film deposited on it were 0.1288 Ω/ and 12.88 $\mu$$\Omega$.cm respectively. We made Pt resistance pattern on SiO$_2$/Si substrate by life-off method and fabricated Pt thin-film type microheater for thermal microsensors by Pt-wire Pt-paste and SOG(spin-on-glass). In the temperature range of 25~40$0^{\circ}C$ we estimated TCR(temperature coefficient of resistance) and resistance ratio of thin-film type Pt-RTD(resistance thermometer device). We obtained TCR value of 3927 ppm/$^{\circ}C$ close to the bulk Pt value. Resistance values were varied linearly within the range of the measurement temperature. The thermal characteristics of fabricated thin-films type Pt micorheater were analyzed with Pt-RTD integrated on the same substrate. The heating temperature of Pt microheater could be up to 40$0^{\circ}C$ with 1.5 watts of the heating power.

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Properties of Sputter Deposited Cr Thin Film on Polymer Substrate by Glancing Angle Deposition (폴리머 기판에 스퍼터법으로 경사 증착한 Cr박막의 특성)

  • Bae, Kwang-Jin;Choi, In-Kyun;Jeong, Eun-Wook;Kim, Dong-Yong;Lee, Tae-Yong;Cho, Young-Rae
    • Korean Journal of Materials Research
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    • v.25 no.1
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    • pp.54-59
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    • 2015
  • Glancing angle deposition (GLAD) is a powerful technique to control the morphology and microstructure of thin film prepared by physical vapor deposition. Chromium (Cr) thin films were deposited on a polymer substrate by a sputtering technique using GLAD. The change in thickness and Vickers microhardness for the samples was observed with a change in the glancing angle. The adhesion properties of the critical load (Lc) by a scratch tester for the samples were also measured with varying the glancing angle. The critical load, thickness and Vickers microhardness for the samples decreased with an increase in the glancing angle. However, the thickness of the Cr thin film prepared at a $90^{\circ}$ glancing angle showed a relatively large value of 50 % compared to that of the sample prepared at $0^{\circ}$. The results of X-ray diffraction and scanning electron microscopy demonstrated that the effect of GLAD on the microstructure of samples prepared by sputter technique was not as remarkable as the samples prepared by evaporation technique. The relatively small change in thickness and microstructure of the Cr thin film is due to the superior step-coverage properties of the sputter technique.

Some Applications of Ion Beam Enhanved Deposition Techniques

  • Zhang, Fu-min
    • Journal of the Korean Vacuum Society
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    • v.6 no.S1
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    • pp.166-171
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    • 1997
  • IBED is a very promosing thin film deposition method because of its many advantages, such as excellent adhesion property of films to substrates, room temperature processing, ease of control over the composition and thickness of films, and so on, over the conventional techniques, It has been widely applied in the field of surface modification of materials in the last decade. In our laboratory, many kinds of thin films, such as wear-resistant hard coatings, corrosion and oxidation protective coatings, biomaterial films, buffer layer for high temperature superconductor films, and oxygen sensitive film, have been synthesized by IBED, and several industrial applications of the IBED films have been conducted.

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Characteristics of Diamondike Carbon thin Films by Low Discharging Frequency(450KHz) PECVD (저주파수(450 KHz) PECVD에 의한 Diamondlike Carbon박막의 특성)

  • Kim, Han-Ju;Ju, Seung-Gi
    • Korean Journal of Materials Research
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    • v.4 no.2
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    • pp.227-232
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    • 1994
  • Diamondlike carbon thin film has been fabricated with low discharging frequency, 450KHz by plasma enhanced chemical vapor deposition. Its physical properties such as optical band gap, microhardness and internal stress have been compared with 13.56MHz film. Optical band gap of 450KHz DLC thin film was less than 13.56MHz film and it was found that C-H bond concentration and total hydrogen contents in the film decreased greatly as the result of FT-IR and CHN analysis. Also, when DLC thin film was fabricated with low discharging frequency, it was expected that the adhesion of the film to the substrate was improved by the great decrease of internal stress without any considerable decrease of microhardness.

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Fabrication of Silver Nanowire-Graphene Oxide Hybrid Transparent Conductive Thin Film with Improved Mechanical Stability (기계적 안정성이 향상된 은나노와이어-그래핀옥사이드 하이브리드 투명 전도성 박막의 제작)

  • Kim, Ju-Tae;Woo, Ju Yeon;Han, Chang-Soo
    • Journal of the Korean Society for Precision Engineering
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    • v.32 no.10
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    • pp.903-909
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    • 2015
  • In this study, we used GO (graphene oxide) in order to enhance the adhesion between Ag NWs (nanowires) and substrates. By using a mixture solution of GO and Ag NW, a vacuum filtration process was used to fabricate a 50nm diameter thin film. Next, by using a light annealing process, the mechanical and electrical stability of Ag NW network was improved without any other treatment. The physical properties of the Ag NW - GO hybrid transparent conductive thin film was characterized in terms of a bending test, resistance and transmittance test, and nanoscale imaging using field-emission scanning electron microscopy.