• 대한전기학회:학술대회논문집
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• 대한전기학회 1999년도 하계학술대회 논문집 D
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• pp.1541-1543
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• 1999

Screen printing에 의해 압전 후막을 제조하기 위하여 약 $0.6{\mu}m$의 평균 입자 크기를 갖는 PMN-PZT와 PAN-PZT 분말을 산화물 혼합법에 의해 제조하였다. 치밀한 후막의 제조를 위한 분말과 유기물의 비율은 분산이 가능한 범위에서 80:20 (분말:유기물)의 중량비를 나타내었다 사용된 기판과 하부전극은 각각 $SiO_2$/Si와 AgPd 였으며, 후막 제조시 박리 및 균열현상은 발생되지 않았다. 프린트된 후막은 건조온도와 무관한 미세구조를 나타내었으며, 보다 치밀한 구조를 갖는 후막의 제조를 이해 입자의 분산 및 열처리 조건 그리고 기판과의 매칭에 대해 연구가 계속되어야 할 것으로 생각된다.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.35-39
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• 2008

In this study, electromechanical properties of carbon nanotube (CNT) thin film on flexible substrates were measured using a micro-tensile machine with functionality of simultaneous measurements of displacement, load and electrical resistance. The CNT thin film of about 100 nm thick was deposited on flexible substrates, polyethylene terephthalate (PET) using spraying and ink-jetting techniques. To investigate the effect of process condition on the electromechanical properties of CNT thin film, sets of CNT samples were fabricated under various heat treatments and microwave process. The microstructures of the CNT thin film before and after tensile test were investigated using Scanning Electron Microscope (SEM), and the failure modes of the CNT thin films were identified to understand their electromechanical behaviors and interaction with the flexible substrates. Based on the experimental results, the use of CNT thin film as flexible electrodes and strain gages is discussed.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제55권8호
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• pp.387-391
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• 2006

The Ag photodoping effect in amorphous $As_{40}Ge_{10}Se_{15}S_{35}$ chalcogenide thin films for holographic recording has been investigated using a He-Ne laser (${\lambda}$=632.8 nm). The chalcogenide films thickness prepared in the present work were thinner in comparison with the penetration depth of recording light ($d_p=1.66{\mu}m$). It exhibits a tendency of the variation of the diffraction efficiency (${\eta}$) in amorphous chalcogende films, independently of the Ag photodoping. That is, ${\eta}$ increases rapidly at the beginning of the recording process and reaches the maximum (${\eta}_{max}$) and slowly decreases slowly with the exposed time. In addition, the value of ${\eta}_{max}$ depends strongly on chalcogenide film thickness(d) and its maximum peak among the films with d = 40, 80, 150, 300, and 633 nm is observed 0.083% at d = 150 nm (approximately 1/2 ${\Delta}n$), where ${\Delta}$n is the refractive index of chalcogenide thin film (${\Delta}n=2.0$). The ${\eta}$ is largely enhanced by Ag photodoping into the chakogenides. In particular, the value of ${\eta}_{max}$ in a bilayer of 10-nm-thick Ag/150-nm-thick $As_{40}Ge_{10}Se_{15}S_{35}$ film is about 1.6%, which corresponds to ${\sim}20$ times larger than that of the single-layer $As_{40}Ge_{10}Se_{15}S_{35}$ thin film (without Ag). And we obtained the diffraction pattern according to the formation of (P:P) polarization holographic grating using Mask pattern and SLM.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 추계학술대회 논문집 Vol.15
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• pp.342-345
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• 2002

As the size of chip components and module decreases, new patteming method for fine line and geometry is needed. So far, in LTCC(Low Temperature Cofired Ceramic) process, screen printing method has been used generally. But screen printing method has some disadvantages as follows. First, the geometry including line, vias, etc. smaller than $100{\mu}m$ can't be evaluated easily. Second, the patterned dimension is different from designed value, which makes distortion in charactersitics of not only chip components but also modules. Thick film lithography has advantages of thick film screen printing process, low cost and thin film process, fine line feasibility. Using this method, the line with $30{\mu}m$ width and the geometry with expected dimension can be evaluated. In this study, the fine line with $35{\mu}m$ line/space is formed and the embedded capacitor with very small tolerance is developed using thick film lithography.

• 한국세라믹학회지
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• 제33권6호
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• pp.665-671
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• 1996

Ferroelectric Pb(Fe1/2Nb1/2)O3 thin films were successfully fabricated on ITO/Glass substrate by sol-gel proces-sing and characterized to determine the dielectric and electric properties. Viscosity of PEN sol measured to investigate rheological properties was 3.25 cP which was proper for coating. The sol also showed Newtonian behavior. RTA(Rapid Thermal Annealing) was used for the annealing of the thin film and 1200~1700$\AA$ thick PEN thin films were fabricated by repeating the intermediate and the final annealing. After the deposition of Pt as top electrode by vacuum evaporation dielectric and electric properties were measured. Dielectric properties of FFN thin film were enhanced by increasing the perovskite phase fraction with increasing the annealing temperature. Measured dielectric constant of 1700$\AA$ PFN thin film annealed at $650^{\circ}C$ was 890 at 1kHz Capacitatnce density and dielectric loss were 47 fF/${\mu}{\textrm}{m}$2 and 0.47 respectively. As a result of measuring Curie temperature PFN thin films had Curie point with a rang of 110~12$0^{\circ}C$ and showed broad dielectric peak at that point. Leakage current of the PFN thin films were increased with increasing the annealing tempera-ture.

• 전자공학회논문지D
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• 제34D권5호
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• pp.45-51
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• 1997

Low temperature activation of dopants which were doped using ion mass doping system in amorphous silicon(a-Si) thin films was investigated. With a 20.angs.-thick Ni film on top of the a-Si thin film, the activation temperature of dopants lowered to 500.deg. C. When the doping was performaed after the deposition of Ni thin film on the a-Si thin films (post-doping), the activation time was shorter than that of dopants mass, the activation time of the dopants doped by pre-doping method increased. It turned NiSi2 formation, while the decrease of activation time was mainly due to the enhancement of the NiSi2 formation by mixing of Ni and a-Si at the interface of Ni and a -Si thin during the ion doping process.

• 한국재료학회지
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• 제16권7호
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• pp.445-448
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• 2006

Highly c-axis oriented ZnO thin films were grown on Si(100)substrates with Zn buffer layers. Effects of the Zn buffer layer thickness on the structural and optical qualities of ZnO thin films were investigated using X-ray diffraction (XRD), photoluminescence (PL) and Atomic force microscopy (AFM) analysis techniques. It was confirmed that the quality of a ZnO thin film deposited by rf magnetron sputtering was substantially improved by using a Zn buffer layer. The highest ZnO film quality was obtained with a Zn buffer layer 110 nm thick. The surface roughness of the ZnO thin film increases as the Zn buffer layer thickness increases.

• 한국전기전자재료학회논문지
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• 제14권8호
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• pp.679-687
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• 2001

It is known that amorphous BaTiO$_3$ thin films have good insulating properties[1][2]. In this investigation, amorphous BaTiO$_3$ thin films were deposited by rf magnetron sputtering on thick BaTiO$_3$ films of AC powder EL devices which were fabricated by screen-printing. The electrical and optical properties of the EL devices were then investigated. Adding amorphous BaTiO$_3$ thin film, it showed that leakage current density was decreased. Especially, leakage current density was decreased more with he sample of 0.5-hour deposition than the sample of 4-hours deposition. This result led to the improvement of luminous efficiency by 11%. It could be concluded that proper amorphous BaTiO$_3$ thin film deposition improved the surface property of dielectric layer.

• Journal of Magnetics
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• 제6권1호
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• pp.9-12
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• 2001

The dependence of the magnetoimpedance effect (MI) on magnetic properties has been investigated in mumetal thin films prepared by rf magnetron sputtering. Coercivity of thin films prepared at 400 W was about 0.4 Oe, and the magnetic anisotropy field of films deposited under a uniaxial magnetic field decreased with increasing film thickness. The saturation magnetization of mumetal films increased with rising input power and thickness and was smaller than that of permalloy films. Transverse incremental Permeability (TPR) of films of 1$\mu m$ thick increased with increasing effective permeability. The magneto impedance ratio (MIR) was proportional to TPR in films 1$\mu m$ thick but in spite of lower effective permeability at higher thicknesses, MIR increased due to skin effect. The height of the double peaks in the MIR curves decreased with decreasing anisotropy and thickness. The maximum MIR value for a 4$\mu m$ thick 75% at 36.5 MHz.

• 한국표면공학회지
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• 제42권5호
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• pp.216-219
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• 2009

A surface acoustic wave (SAW) filter structure was fabricated employing $4{\mu}m$ thick nanocrystalline diamond (NCD) and $2.2{\mu}m$ thick ZnO films on Si wafer. The NCD film was deposited in an $Ar/CH_4$ gas mixture by microwave plasma chemical vapor deposition method. The ZnO film was formed over the NCD film in an RF magnetron sputter using ZnO target and $Ar/O_2$ gas. On the top of the two layers, copper film was deposited by the RF sputter and inter digital transducer (IDT) electrode pattern (line/space : $1.5/1.5{\mu}m$) was defined by the photolithography including a lift-off etching process. The fabricated SAW filter exhibited the center frequency of 1.66 GHz and the phase velocity of 9,960 m/s, which demonstrated that a giga Hertz SAW filter can be realized by utilizing the nanocrystalline diamond thin film.