• Title/Summary/Keyword: Thickness of line

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Patterning and Characterization of Co/Ni Composite Silicide using EIB (FIB를 이용한 CoNi 복합실리사이드 나노배선의 패턴가공과 형상 분석)

  • Song Oh-Sung;Kim Sang-Yeob;Jung Yoon-Ki
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.7 no.3
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    • pp.332-337
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    • 2006
  • We prepared 100 nm-thick CoNi composite silicide on a 70 nm-thick polysilicon substrate. Composite silicide laye.s were formed by rapid thermal annealing(RTA) at the temperatures of $700^{\circ}C,\;900^{\circ}C,\;1000^{\circ}C$ for 40 seconds. A Focused ion beam (FIB) was used to make nano-patterns with the operation range of 30 kV and $1{\sim}100$ pA. We investigated the change of thickness, line width, and the slope angle of the silicide patterns by FIB. More easily made with the FIB process than with the conventional polycide process. We successfully fabricated sub-100nm etched patterns with FIB condition of 30kv-30pA. Our result implies that we may integrate nano patterns with our newly proposed CoNi composite silicides.

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Imaging of self-assembled monolayers by surface plasmon microscope (표면 플라즈몬 현미경을 이용한 자기조립 단분자막의 이미징)

  • 표현봉;신용범;윤현철;양해식;김윤태
    • Korean Journal of Optics and Photonics
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    • v.14 no.1
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    • pp.97-102
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    • 2003
  • Multi-channel images of 11-MUA(11-Mercaptoundecanoic acid) and 11-MUOH(11-Mercaptoundecanol) self-assembled monolayers were obtained by using two-dimensional surface plasmon resonance (SPR) absorption. The patterning process was simplified by exploiting direct photo-oxidation of thiol bonding (photolysis) instead of conventional photolithography. Sharper images were resolved by using a white light source in combination with a narrow bandpass filter in the visible region, minimizing the diffraction patterns on the images. The line profile calibration of the image contrast caused by different resonance conditions at each point on the sensor surface (at a fixed incident angle) enables us to discriminate the monolayer thickness in nanometer scale. Furthermore, there is no signal degradation such as photo bleaching or quenching, which are common in the detection methods based on fluorescence.

Synthesis of Photoresist Using Environmental-benign Supercritical $CO_2$ Processes (환경친화적인 초임계 이산화 탄소 공정을 이용한 포토레지스트의 합성)

  • 허완수;이상원;박혜진;김장엽;홍유석;유기풍
    • Polymer(Korea)
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    • v.28 no.6
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    • pp.445-454
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    • 2004
  • The requirement for a much finer line width circuits on semiconductors needs new developers such as supercritical fluid to prevent the collapse of the photoresist micro-patterns. The copolymers contain t-butyl methacrylate having an acid-cleavable t-butyl group and supercritical fluid $CO_2$ soluble perfluorinated decyl methacrylate segments. The supercritical fluid $CO_2$-philic properties of the photoresist changed to supercritical fluid $CO_2$-phobic properties after the deprotection reaction by exposure, which made the exposed resist insoluble in the supercritical fluid $CO_2$ developer. The synthesized copolymers containing more than 30% of perfluorinated decyl methacrylate were found to be soluble in supercritical fluid $CO_2$. The variation of film thickness before and after exposure was largest when the mole ratio of perfluorinated decyl methacrylate in the copolymer was 30%.

P- and S-wave seismic studies in the Ulsan fault zone near Nongso-Eup (농소읍 부근 울산단층대에서의 P파 및 S파 탄성파 조사 연구)

  • Lee, Chang-Min;Kim, Ki-Young
    • 한국지구물리탐사학회:학술대회논문집
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    • 2006.06a
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    • pp.95-100
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    • 2006
  • To reveal subsurface structures of the Ulsan fault, seismic data were recorded along a 750-m long line near Nongso-Eup in Ulsan. P and S waves were generated simultaneously by impacting a 5 kg sledgehammer on a tilted plate. The data were received by 16 10-Hz 3-component geophones at 3 m intervals. Refracted P waves were inverted using the tomography method. Dip moveout and migration were applied to reflection data processed following a general sequence. Four layers were identified based on P-wave velocities and P- and S-wave stacked image. From top to bottom, the P-wave velocity of each layer ranges in $300{\sim}1100\;m/s$, $1100{\sim}1700\;m/s$, $1700{\sim}2700\;m/s$, and greater than 2700 m/s. The corresponding thickness of the top three layers averages 3.9 m, 5.9 m, 4.4 m, respectively. The S-wave stack section is effective to define subsurface structures shallower than 10 m.

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Comparison of Grain Quality of Bacterial Blight Resistant Near-isogenic Lines of Rice under Different Fertilization Levels

  • Shin Mun-Sik;Kim Ki-Young;Choi Yun-Hi;Shin Seo-Ho;Ko Jae-Kwon;Lee Jae-Kil
    • KOREAN JOURNAL OF CROP SCIENCE
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    • v.51 no.4
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    • pp.318-321
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    • 2006
  • This study was conducted in 2002 and 2003 to investigate variation on rice quality associated with cooking, and eating qualities under the three different fertilizer levels, none fertilizer level($N-P_2O_{5-}K_2O=0-0-0kg/ha$), ordinary fertilizer level($N-P_2O_{5-}K_2O=1l0-45-57kg/ha$), and heavy fertilizer level($N-P_2O_{5-}K_2O=180-90-110kg/ha$). The eight resistant near-isogenic lines(NILs) for bacterial blight in rice were examined for grain appearances, several physicochemical properties, and palatability value measured by Toyo taste meter. Significant variations in NILs(V), Years(Y), and VxY interaction were recognized in grain length and palatability value under the none fertilizer cultivation, in grain width under the heavy fertilizer cultivation, and in white belly ratio under the three different fertilizer cultivations, respectively. According to increase the fertilizer application rate, variation in grain length and grain width were not significant, but grain thickness was thinner under the ordinary and heavy fertilizer cultivations than under the none fertilizer cultivation. On the other hand, white belly ratio, protein content and Mg/K ratio increased, while amylose content and palatability value lowered. Alkali spreading value lowed under the heavy fertilizer cultivation than under the none and ordinary fertilizer cultivations. Palatability value was significantly low in the line carrying XalJ than in the other lines under the ordinary fertilizer cultivations.

Linear Tapered Slot Rectifying Antenna for Portable UHF-Band RFID System (휴대용 UHF대역 RFID 시스템을 위한 선형 테이퍼드 슬롯 정류 안테나)

  • Pyo, Seongmin
    • Journal of IKEEE
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    • v.24 no.1
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    • pp.368-371
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    • 2020
  • In this paper, we propose a linear tapered slot rectifying antenna for a portable UHF-band RFID system. Since the proposed rectifying antenna does not use a dielectric substrate, the planar antenna is implemented with a thin metal thickness. The rectifier circuit converts input RF power into output DC voltage using a voltage doubler circuit based on two anti-parallel schottky diodes. The rectifying antenna is integrated by the voltage doubler circuit into a linear tapered slot antenna. For conjugate impedance matching of the rectifying circuit and the linear tapered slot antenna, the source-pull method was utilized by adjusting the angle of the tapered slot and the length of the antenna feed line. The proposed antenna prototype has been verified with the electrical and radiation characteristics through RF-DC conversion and far-field radiation test in open space measurement environment. Finally, the proposed antenna is realized to 0.23-wavelength (75 mm) and 0.18-wavelength (60 mm) at 915 MHz center frequency.

The Design of a Wideband 3 dB Quadrature Coupler using N-Section Parallel-Coupled Lines (N단 평행 결합 선로를 이용한 90° 광대역 3 dB 결합기 설계)

  • 조정훈;윤상원
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.13 no.1
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    • pp.94-100
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    • 2002
  • In this paper, we proposed a 3 dB coupler using N-section parallel-coupled lines and designed a very compact one based on the analysis results. The coupled line has been analyzed by spectral domain method. After we obtain the s-parameters of N-section parallel-coupled lines by using port reduction method 4-port s-parameters are derived. The 3 dB couplers, which were fabricated, are not necessary to implement high impedance lines and tight coupling gaps as Lange Couplers because loose coupling is used. To realize a minimum section, we used the PCB that has high a dielectric constant and a thickness. The experimental results show that it has wide bandwidth of about 42 %(0.5 dB unbalance) from 3.6 GHz to 5.5 GHz and phase difference within 1 degree. Also, The isolation characteristics about 15 dB at its pass-band are obtained.

다채널 표면 플라즈몬 공명 영상장치를 이용한 자기조립 단분자막의 표면 분석

  • Pyo, Hyeon-Bong;Sin, Yong-Beom;Yun, Hyeon-Cheol
    • 한국생물공학회:학술대회논문집
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    • 2003.04a
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    • pp.74-78
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    • 2003
  • Multi-channel images of 11-MUA and 11-MUOH self-assembled monolayers were obtained by using two-dimensional surface plasmon resonance (SPR) absorption. Patterning process was simplified by exploiting direct photo-oxidation of thiol bonding (photolysis) instead of conventional photolithography. Sharper images were resolved by using a white light source in combination with a narrow bandpass filter in the visible region, minimizing the diffraction patterns on the images. The line profile calibration of the image contrast caused by different resonance conditions at each points on the sensor surface (at a fixed incident angle) enables us to discriminate the monolayer thickness in sub-nanometer scale. Furthermore, there is no signal degradation such as photo bleaching or quenching which are common in the detection methods based on the fluorescence.

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AUTOMATIC MULTITORCH WELDING SYSTEM WITH HIGH SPEED

  • Moon, H.S;Kim, J.S.;Jung, M.Y.;Kweon, H.J.;Kim, H.S.;Youn, J.G.
    • Proceedings of the KWS Conference
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    • 2002.10a
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    • pp.320-323
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    • 2002
  • This paper presents a new generation of system for pressure vessel and shipbuilding. Typical pressure vessel and ship building weld joint preparations are either traditional V, butt, fillet grooves or have narrow or semi narrow gap profiles. The fillet and U groove are prevalently used in heavy industries and shipbuilding to melt and join the parts. Since the wall thickness can be up to 6" or greater, welds must be made in many layers, each layer containing several passes. However, the welding time for the conventional processes such as SAW(Submerged Arc Welding) and FCAW(Flux Cored Arc Welding) can be many hours. Although SAW and FCAW are normally a mechanized process, pressure vessel and ship structures welding up to now have usually been controlled by a full time operator. The operator has typically been responsible for positioning each individual weld run, for setting weld process parameters, for maintaining flux and wire levels, for removing slag and so on. The aim of the system is to develop a high speed welding system with multitorch for increasing the production speed on the line and to remove the need for the operator so that the system can run automatically for the complete multi-torch multi-layer weld. To achieve this, a laser vision sensor, a rotating torch and an image processing algorithm have been made. Also, the multitorch welding system can be applicable for the fine grained steel because of the high welding speed and lower heat input compare to a conventional welding process.

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Effect of Protective layer on LTCC Substrate for Thin Metal Film Patterns (LTCC 보호층 형성에 따른 박막 전극패턴에 관한 연구)

  • Kim, Yong-Suk;Yoo, Won-Hee;Chang, Byeung-Gyu;Park, Jung-Hwan;Yoo, Je-Gwang;Oh, Yong-Soo
    • Korean Journal of Materials Research
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    • v.19 no.7
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    • pp.349-355
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    • 2009
  • Metal thin film patterns on a LTCC substrate, which was connected through inner via and metal paste for electrical signals, were formed by a screen printing process that used electric paste, such as silver and copper, in a conventional method. This method brought about many problems, such as non uniform thickness in printing, large line spaces, and non-clearance. As a result of these problems, it was very difficult to perform fine and high resolution for high frequency signals. In this study, the electric signal patterns were formed with the sputtered metal thin films (Ti, Cu) on an LTCC substrate that was coated with protective oxide layers, such as $TiO_2$ and $SiO_2$. These electric signal patterns' morphology, surface bonding strength, and effect on electro plating were also investigated. After putting a sold ball on the sputtered metal thin films, their adhesion strength on the LTCC substrate was also evaluated. The protective oxide layers were found to play important roles in creating a strong design for electric components and integrating circuit modules in high frequency ranges.