• 한국세라믹학회지
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• 제38권10호
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• pp.942-947
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• 2001

MEMS 소자에의 응용을 위한 PZT(52/48) 박막을 diol을 용매로한 솔젤법에 의해 제조하였으며 미세구조에 따른 전기적 특성 및 압전 특성 관계를 고찰하였다. 0.5 mol 의 sol을 제작하여 1회 코팅시 $0.2{\mu}m$ 두께를 갖는 균열 없는 박막을 얻을 수 있었으며 $0.2{\mu}m$에서 $3.8{\mu}m$의 두께의 막을 증착하였다. 미세구조사진으로부터 층간 porous한 영역이 관찰되지 않음과 제2상의 성장이 없는 치밀한 columnar입자 성장을 확인 할 수 있었으며 균열없는 치밀화된 입자의 성장으로부터 우수한 이력곡선을 얻을 수 있었다. XRD분석으로부터 우선 배향성을 알아본 결과 (111)우선 배향성이 $1{\mu}m$ 영역까지 우세하다가 $1{\mu}m$이상의 두께에서 점차 random하게 바뀌는 것을 확인할 수 있었으며, 유전 특성 및 압전특성의 경향도 이와 유사하게 $1{\mu}m$ 영역까지 증가하다가 그 이상의 두께에서는 수렴하여 각각 1400, 300 pC/N 정도의 우수한 값을 가졌다.

• 한국해양공학회지
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• 제17권2호
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• pp.54-59
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• 2003

The characteristics of the parameters for the probability distribution of fatigue crack growth life, using the non-Gaussian random process simulation method is investigated. In this paper, the material resistance to fatigue crack growth is treated as a spatial random process, which varies randomly on the crack surface. Using the previous experimental data, the crack length equals the number of cycle curves that are simulated. The results are obtained for constant stress intensity factor range conditions with stress ratios of R=0.2, three specimen thickness of 6, 12 and 18mm, and the four stress intensity level. The probability distribution function of fatigue crack growth life seems to follow the 3-parameter Wiubull,, showing a slight dependence on specimen thickness and stress intensity level. The shape parameter, $\alpha$, does not show the dependency of thickness and stress intensity level, but the scale parameter, $\beta$, and location parameter, ${\gamma}$, are decreased by increasing the specimen thickness and stress intensity level. The slope for the stress intensity level is larger than the specimen thickness.

• 한국해양공학회:학술대회논문집
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• 한국해양공학회 2002년도 추계학술대회 논문집
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• pp.301-306
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• 2002

The characteristics of parameters for the probability distribution of fatigue crack growth lives by the non-Gaussian random process simulation method is investigated. In this paper, the material resistance to fatigue crack growth is treated as a spatial random process, which varies randomly on the crack surface. Using the previous experimental data, the crack length - the number of cycles curves are simulated. The results are obtained for constant stress intensity factor range conditions with stress ratio of R=0.2, three specimen thickness of 6, 12 and 18mm, and the four stress intensity level. The probability distribution function of fatigue crack growth lives seems to follow the 3-parameter Wiubull and shows a slight dependence on specimen thickness and stress intensity level. The shape parameter, ${\alpha}$, does not show the dependency of thickness and stress intensity level, but the scale parameter, ${\beta}$, and location parameter, ${\upsilon}$, are decreased by increasing the specimen thickness and stress intensity level. The slope for the stress intensity level is larger than the specimen thickness.

• Current Optics and Photonics
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• 제2권6호
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• pp.589-594
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• 2018

We have investigated the dimensional nature of center-of-mass exciton confinement states in a CdMnTe/CdTe/CdMnTe heterostructure, where the CdTe well is too wide (144 nm) to confine both electrons and holes but able to confine whole excitons in the center-of-mass coordinate. Fine multiple photoluminescence spectra with a few meV separation were observed at 6 K. From the thickness dependence of the transition rate, they were attributed to even numbered center-of-mass exciton confinement states (N = 2, 4, 6, ${\cdots}$, 18). Dimensionality of the center-of-mass exciton confinement states was also investigated in terms of temperature dependence of radiative decay time. At low temperatures (${\leq}12K$), we found that the ground state excitons are likely localized possibly due to the barrier interface fluctuation, resulting in a constant decay time (~350 ps). With increased temperature (${\geq}12K$), localized excitons are thermally released, giving rise to a linear temperature dependence of radiative decay time as an evidence of two-dimensional nature.

• 대한전자공학회논문지
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• 제27권4호
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• pp.563-570
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• 1990

A silicon pressure sensor made of a full bridge of diffused resistors was designed and fabricated using semiconductor integrated circuit process. Thin diaphragms with 30\ulcorner thickness were obtained using anisotropic wet chemical etching technique. Our device showed strong temperature dependence. Compensation networks are used to compensate for the temperature dependence of the pressure sensor. The bridge supply voltage having positive temperature coefficient by compensation networks was utilized against the negative temperature coefficient of bridge output voltage. The sensitivity fluctuation of pressure sensor before temperature compensation was -1700 ppm/\ulcorner, while it reduced to -710ppm\ulcorner with temperature compensation. Our result shows that the we could develop accurate and reliable pressure sensor over a wide temperature range(-20\ulcorner~50\ulcorner).

• Steel and Composite Structures
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• 제11권4호
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• pp.341-358
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• 2011

This paper presents the effects of thermal environment and temperature-dependence of the material properties on axisymmetric bending of functionally graded (FG) circular and annular plates. The material properties are assumed to be temperature-dependent and graded in the thickness direction. In order to accurately evaluate the effect of thermal environment, the initial thermal stresses are obtained by solving the thermoelastic equilibrium equations. Governing equations and the related boundary conditions, which include the effects of initial thermal stresses, are derived using the virtual work principle based on the elasticity theory. The differential quadrature method (DQM) as an efficient and robust numerical tool is used to obtain the initial thermal stresses and response of the plate. Comparison studies with some available results for FG plates are performed. The influences of temperature rise, temperature-dependence of material properties, material graded index and different geometrical parameters are carried out.

• 전기의세계
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• 제28권9호
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• pp.43-50
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• 1979

Silicon nitride films were chemically deposited on silicon substrates by reacting SiCl$_{4}$ and NH$_{3}$ in a nitrogen atmosphere at 700~1100 .deg.C. The deposition rate increased rapidly with deposition temperature upto about 1000 .deg.C, and became less temperature dependent above this temperature. The etch rate of films in buffered HF solution decreased, with an increase of deposition temperature, and a heat treatment at a temperature higher than that of the deposition considerably reduced the etch rate. It indicates that the heat treatment resulted in a densification of the films. Surface charge density of 3~4 * 10$^{11}$ /cm$^{2}$ was determined from the C-V characteristics of MNS diode, and it was also found that surface charge density depended on deposition temperature, but not film thickness. The current-voltage characteristics displayed a logI-V$^{1}$2/ dependence in the temperature range of 300~500.deg.K. Measurement of the slope of this characteristics and its dependence on temperature and bias polarity suggest that conduction in sili con nitride films arises from the Poole-Frenkel mechanism.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2003년도 추계학술발표강연 및 논문개요집
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• pp.229-229
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• 2003

Enhancement of the exchange bias and optimization of the structure have been the focus that many researchers studied, recently [1]. In this report, magnetic properties of MTJs with structure of Si/Ta (5)/Cu (10)/ Ta (5)/ Ni$\sub$80/Fe$\sub$20/ Cu (5)/ Mn$\sub$75Ir$\sub$25/ (10)/ Co$\sub$70/Fe$\sub$30/ (2.5)/ Al-O (1.5)/ Co$\sub$70/Fe$\sub$30/ (2.5)/ Ni$\sub$80/Fe$\sub$20/ (t)/ Ta (5) (t=0,10, 30, 60 and 100 nm, respectively) were investigated. The relationship between the structure and magnetic parameters of interfacial exchange coupling and interlayer coupling in as-deposited and annealed junctions was studied. The temperature dependence of exchange coupling was considered.

• 한국초전도ㆍ저온공학회논문지
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• 제15권2호
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• pp.9-11
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• 2013

We have investigated the effect of thickness of the MgB2 film on the grain growth direction as well as on their superconducting properties. $MgB_2$ films of various thicknesses were fabricated on c-cut $Al_2O_3$ substrates at a temperature of $540^{\circ}C$ by using hybrid physical-chemical vapor deposition (HPCVD) technique. The superconducting transition temperature ($T_c$) was found to increase with increase in the thickness of the $MgB_2$ film. X-ray diffraction analysis revealed that the orientation of grains changed from c-axis to a-axis upon increasing the thickness of the $MgB_2$ film from 0.6 to 2.0 ${\mu}m$. $MgB_2$ grains of various orientations were observed in the microstructures of the films examined by scanning electron microscopy. It is observed that at high magnetic fields the 2.0-${\mu}m$-thick film exhibit considerably larger critical current density ($J_c$) as compared to 0.6-${\mu}m$-thick film. The results are discussed in terms of an intrinsic-pinning in $MgB_2$ similarly as intrinsic-pinning occurring in high-Tc cuprate superconductors with layered structure.

• 한국정보통신학회:학술대회논문집
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• 한국정보통신학회 2012년도 추계학술대회
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• pp.835-837
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• 2012

본 연구에서는 상단게이트와 하단게이트를 갖는 (Double gate ; DG) MOSFET 구조의 소자 파라미터에 따른 전도중심을 분석하였다. 분석학적 모델을 유도하기 위하여 포아송 방정식을 이용하였다. 본 연구에서 제시한 모델을 사용하여 DGMOSFET 설계시 중요한 채널길이, 채널두께, 그리고 게이트 산화막 두께 등의 요소 변화에 대한 전도중심의 변화를 관찰하였다. 또한 채널 도핑농도에 따른 전도중심의 변화를 고찰함으로써 DGMOSFET의 타당한 채널도핑농도를 결정하였다.