• 제목/요약/키워드: Thick film technology

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Thick Film Paste제조 기술 분석 (Analysis of Fabrication Technology for Thick film Paste)

  • 김수용;정원채
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2002년도 추계학술대회 논문집 Vol.15
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    • pp.354-357
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    • 2002
  • 박막과 후막을 구분하고 현재에는 막의 형성 구분에 따라 박막에는 진공증착 후막에는 Screen Printing, Dipping, Brashing, Rolling으로 구분한다. 기술에는 여러 가져가 있는데, 금속 분말 제조기술, 유리분말제조기술, 유기바인더제조기술, 첨가제배합기술, 전자측정기술, 분체제어기술이 있다. 본 연구의 목표는 용도에 알맞은 최적화된 새로운 제조기술을 제시하고자 한다.

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Characteristics of $\alpha$-$Fe_2O_3$ Thick Film Fabricated by Screen Printing Method

  • Kim, Byung-Soo;Chung, Yong-Sun;Auh, Keun-Ho
    • 한국결정성장학회:학술대회논문집
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    • 한국결정성장학회 1998년도 PROCEEDINGS OF THE 15TH KACG TECHNICAL MEETING-PACIFIC RIM 3 SATELLITE SYMPOSIUM SESSION 4, HOTEL HYUNDAI, KYONGJU, SEPTEMBER 20-23, 1998
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    • pp.65-70
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    • 1998
  • Fine powders of $\alpha$-Fe2O3 were prepared by precipitation method using iron (III) nitrate in ethanol solvent and the thick film using this powder was made by the screen printing technology. Effects of the reaction temperature and concentration of the iron (III) nitrate on the particle size and specific surface area were studied. Also, the relationship between the powder size and properties of the thick film was discussed.

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전기자동차의 난방용 면상 후막히터의 제조방법과 성능에 관한 실험적 연구 (An Experimental Study on the Manufacturing Method and Performance of Planar Thick Film Heaters for Electric Vehicle Heating)

  • 이채열;임종한;이재욱;박상희
    • 한국산업융합학회 논문집
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    • 제27권3호
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    • pp.685-692
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    • 2024
  • Currently used heating elements are metal and non-metal heating elements, including various types of heaters, and resistance line heating elements have a problem of decreasing thermal efficiency over time, so to solve this problem, a planar heating element using high-purity carbon materials and oxidation-resistant inorganic compounds was applied. Through the manufacture of planar heating elements using CNT, ruthenium composite materials, and ruthenium oxide, physicochemical performance and capacity were increased, and instantaneous responsiveness was increased. Through thick film technology applicable to various base bodies, fine patterns were formed by the screening method in consideration of the fact that the performance of the heat source depends on the viscosity and pattern shape. The heating element was manufactured by thick film printing technology by mixing ruthenium oxide, CNT, Ag, etc. The characteristics of each paste were analyzed through viscosity measurement, and STS 430 was used as a base. Surface temperature and efficiency were measured by testing heaters manufactured for small wind tunnels and real-vehicle experiments. The surface temperature decreased as the air volume increased, and the optimal system boundary was found to be about 200 mm. Among the currently used heating elements, this paper manufactured a planar heating element using thick film technology to find out the relationship between air volume and temperature, and to study the surface temperature.

저온 소결 조제에 따른 PMN-PZ-PT 후막 세라믹 특성 (Characteristics of PMN-PZ-PT Thick Film Ceramic by Low-Temperature Sintering Aids)

  • 정명원;전대우;김진호;이영진
    • 한국전기전자재료학회논문지
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    • 제29권8호
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    • pp.476-482
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    • 2016
  • Convectional PZT based piezoelectric ceramics have to sinter at high temperature about $1,200^{\circ}C$ for their suitable electrical properties. However, some issues: low temperature sintering piezoelectric ceramic composition and reliable internal electrode, have recently attracted a great deal of interest as a highly efficient multi-layered piezoelectric ceramics. In order to optimize low temperature sintering conditions of thick-film PMN-PZ-PT ceramic, it was investigated sintering and piezoelectric properties according to the change of $LiBiO_2$ contents. Thus, the superior piezoelectric properties were found at the pallet type PMN-PZ-PT optimized with low sintering processing at $925^{\circ}C$ including 7 wt% $LiBiO_2$ sintering aid. Consequentially, we successfully manufactured thick-film PMN-PZ-PT ceramics, which had superior piezoelectric and dielectric properties, with 5 wt% of $LiBiO_2$ sintering aid at temperature of $900^{\circ}C$.

내장형 수동소자의 제조를 위한 포토 이미징 후막리소그라피 기술 (Photo-imageable Thick-Film Lithography Technology for Embedded Passives Fabrication)

  • 임종우;김효태;김종희
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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    • pp.303-303
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    • 2007
  • Photo-imageable thick-film lithography technology was developed for the fabrication of embedded passives such as inductors and capacitors. In this study, photo-imageable dielectric and conductor pastes have apoted a negative type. Sodalime glass wafer, alumina substrate and zero-shrinkage LTCC green tapes were used as substrates. In result, The lithographic patterns were designed as lines and spaces for conductor material, or via-holes for ceramic, LTCC, materials. The scattering and reflection of UV-beam on the substrate had negative effects on fine patterning. The patterning performance was varied with the exposing and developing process conditions, and also varied with the substrate materials. Fine resolution of less then $50/50{\mu}m$ in line and space was obtained, which is difficult in screen printing method.

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경화 온도와 인쇄 공정 및 기판에 따른 폴리머 후막 저항체의 특성 변화에 대한 연구 (Study on variation of electrical properties of polymer thick film resistor regarding curing temperature, printing process and substrate)

  • 유명재;이상명;박성대;이우성;강남기
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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    • pp.311-312
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    • 2005
  • Applying a designed test coupon pattern for fabricating resistors various resistors were formed using PTF(polymer thick film) pastes. Aspect ratio from 0.25 to 4 were selected for fabricating resistors. Formed resistors were cured at $170^{\circ}C$ and $240^{\circ}C$. Electrical properties of fabricated resistors were measured and their values analyzed in relation to cure temperature and formed geometry via printing. Also effects of substrates used for fabricating resistors were observed.

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내장형 저항 기판의 신뢰성과 TCR 개선을 위한 후막 저항 페이스트에 관한 연구 (Thick Film Resistance Paste for Improving Reliability and TCR Properties of Embedded Resistor Board)

  • 이상명;유명재;박성대;강남기;남산
    • 마이크로전자및패키징학회지
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    • 제15권1호
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    • pp.27-31
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    • 2008
  • 전자 부품의 소형화 요구에 따라서 기존 기판의 상부에 실장 되는 저항 소자를 감소하기 위한 방안으로 후막 저항 페이스트를 인쇄하여 저항체를 형성 한 후에 내장하는 수동소자 내장기술이 활발히 연구되고 있다. 본 연구에서는 카본 블랙과 에폭시 수지를 혼합하여 $0.35{\sim}4k{\Omega}/sq$으로 넓은 저항 범위를 가지는 저온 열경화형 후막 저항 페이스트를 제작하였으며, Ni-Cr alloy와 $SiO_2$ 분말을 첨가하여 온도에 따른 저항 변화인 TCR(Temperature Coefficient Resistivity) 값을 $100ppm/^{\circ}C$으로 개선하였다. 최종적으로 제작된 저항 페이스트를 이용하여 내장 저항 기판을 제작하였으며 온도에 변화에 따른 안정적인 저항 특성과 신뢰성을 확보 할 수 있었다.

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Effect of the Oxide Glass on the Metal Sintering Behavior in Silver Thick-Film System

  • ;김호기
    • 한국세라믹학회:학술대회논문집
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    • 한국세라믹학회 1986년도 Priceedings Of The Third Korea-Japan Seminar On New Ceramics
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    • pp.259-267
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    • 1986
  • The sintering behavior of silver-oxide glass composite thick-film has been studied with varing glass content. It is shown that during heat treatment glass became liquid phase to deeply affect the microstructure development of the silver particles and to control the physical properties of the thick-films. As glass content increased, the initial repacking of silver particles took place rapidly but the homogeneities of the microstructure showed different features. When the glass content was over some range, the silver particles exuded glass to decrease net energy and glass formed liquid pools separated from the solid skeletons. Finally the relations between the microstructures and electrical properties of the thick-film were discussed.

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P(VDF/TrFE) 필름의 두께에 따른 인체 감지형 초전형 PIR 적외선 센서의 특성 (Effect of P(VDF/TrFE) Film Thickness on the Characteristics of Pyroelectric Passive Infrared Ray Sensor for Human Body Detection)

  • 권성열
    • 센서학회지
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    • 제20권2호
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    • pp.114-117
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    • 2011
  • A thick 25 ${\mu}m$ thickness poled P(VDF/TrFE) film pyroelectric infrared ray sensor has been fabricated and then thin 1.6 ${\mu}m$ thickness P(VDF/TrFE) film pyroelectric infrared ray sensor has been fabricated also. These thick and thin P(VDF/TrFE) film pyroelectric infrared ray sensor was mounted in TO-5 housing to detect infrared light of 5.5 ~ 14 ${\mu}m$ wavelength for human body detecting with each other. The noise output voltage of the thick P(VDF/TrFE) film pyroelectric infrared ray sensor were 380 mV and NEP(noise equivalent power) is $3.95{\times}10^{-7}$ W which is the similar value with the commercial pyroelectric infrared ray sensor using ceramic materials as a sensing material. The NEP and specific detectivity $D^*$ of the thin P(VDF/TrFE) film pyroelectric infrared ray sensor were $2.13{\times}10^{-8}$ W and $9.37{\times}106$ cm/W under emission energy of 13 ${\mu}W/cm^2$ respectively. These result caused by lower thermal diffusion coefficient of a thin 1.6 ${\mu}m$ thickness PVDF/TrFE film than the thick 25 ${\mu}m$ thickness poled P(VDF/TrFE) film pyroelectric infrared ray sensor.

Electrical Conduction Characteristics of a Thick-film Form Multiwalled Carbon Nanotubes for Field Electron Emitter

  • Lee, Yun-Hi;Kim, Hoon;Ju, Byeong-Kwon;Yu, Jae-Eun;Oh, Myung-Hwan
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2000년도 제1회 학술대회 논문집
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    • pp.53-54
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    • 2000
  • Measurements of the direct current resistivity, on multiwalled carbon nanotubes(MWNT) for field electron emitter source that had been screen printed in a thick film form were made as a function of temperature T in the range of 1.7K-390K. In this measuring temperature range, the electrical resistivity for the MWNT show that the main contribution to the conductivity comes form carries that hop directly between localized states executing variable range hopping processes. This thick-film form system for large area display showed a high bright light emission as well as very low turn-on field as like an individual MWNT system at room temperature. Furthermore, the electron emission characteristics followed well typical Fowler-Nordheim conduction under the vacuum.

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