Browse > Article
http://dx.doi.org/10.4313/JKEM.2016.29.8.476

Characteristics of PMN-PZ-PT Thick Film Ceramic by Low-Temperature Sintering Aids  

Jung, Myungwon (Optic & Display Materials Center, Korea Institute of Ceramic Engineering & Technology)
Jeon, Dae-Woo (Optic & Display Materials Center, Korea Institute of Ceramic Engineering & Technology)
Kim, Jin-Ho (Optic & Display Materials Center, Korea Institute of Ceramic Engineering & Technology)
Lee, Youngjin (Optic & Display Materials Center, Korea Institute of Ceramic Engineering & Technology)
Publication Information
Journal of the Korean Institute of Electrical and Electronic Material Engineers / v.29, no.8, 2016 , pp. 476-482 More about this Journal
Abstract
Convectional PZT based piezoelectric ceramics have to sinter at high temperature about $1,200^{\circ}C$ for their suitable electrical properties. However, some issues: low temperature sintering piezoelectric ceramic composition and reliable internal electrode, have recently attracted a great deal of interest as a highly efficient multi-layered piezoelectric ceramics. In order to optimize low temperature sintering conditions of thick-film PMN-PZ-PT ceramic, it was investigated sintering and piezoelectric properties according to the change of $LiBiO_2$ contents. Thus, the superior piezoelectric properties were found at the pallet type PMN-PZ-PT optimized with low sintering processing at $925^{\circ}C$ including 7 wt% $LiBiO_2$ sintering aid. Consequentially, we successfully manufactured thick-film PMN-PZ-PT ceramics, which had superior piezoelectric and dielectric properties, with 5 wt% of $LiBiO_2$ sintering aid at temperature of $900^{\circ}C$.
Keywords
PMN-PZ-PT; Low temperature sintering; Thick film; Tape casting;
Citations & Related Records
연도 인용수 순위
  • Reference
1 J. Hu, Y. Fuda, M. Katsuno, and T. Yoshida, Jpn. J. Appl. Phys., 38, 3208 (1999). [DOI: http://dx.doi.org/10.1143/JJAP.38.3208]   DOI
2 F. S. Essam, W. M. Robert, and J. H. Lawrence, J. Sound Vib., 292, 854 (2006).   DOI
3 S. D. Park, H. G. Kang, Y. H. Park, and J. D. Mun, J. Microelectronic & Packaging Soc., 6, 25 (1999).
4 H. T. Sawhill, Ceram. Tram., 26, 307 (1987).
5 W. H. Jung, J. H. Sohn, Y. Inaguma and M. Itoh, J. Kor. Ceram. Soc., 2, 111 (1996).
6 C. Y. Chen and H. L. Lin, Ceramic. Inst., 30, 2075 (2004). [DOI: http://dx.doi.org/10.1016/j.ceramint.2003.11.010]   DOI
7 D. Dong, K. Murakami, S. Kaneko, and M. Xiong, J. Ceramic Society. Jpn., 101, 1090 (1993). [DOI: http://dx.doi.org/10.2109/jcersj.101.1090   DOI
8 J. S. Lee. M. S. Choi, H. S. Han, Y. M. Kong, S. J. Kim, I. W. Kim, M. S. Kim, and S. J. Jeong, Sens. Actuuators A. Phys., 154, 97 (2009).   DOI
9 K. Murakami, D. Mabuchi, T. Kurita, Y. Niwa, and S. Kaneko, Jpn. J. Appl. Phys., 35, 5188 (1996). [DOI: http://dx.doi.org/10.1143/JJAP.35.5188]   DOI
10 G. Feng, H. Rongzi, L. Jiaji, L. Zhen, and T. C. Sheng, Ceramic. Inst., 35, 1863 (2009). [DOI: http://dx.doi.org/10.1016/j.ceramint.2008.10.029]   DOI
11 T. Hayashi, T. Hasegawa, and Y. Akiyama, Jpn. J. Appl. Phys., 43, 6683 (2004). [DOI: http://dx.doi.org/10.1143/JJAP.43.6683]   DOI
12 G. Jeremy, C. J. Fabien, C. P. Jean, and L. Mickael, Sens. Actuuators A. Phys., 211, 1 (2014).   DOI
13 J. K. Hong, J. S. Lee, H. I. Chee, M. S. Yoon, and S. H. Jeong, J. Korean Inst. Electr. Electron. Mater. Eng., 14, 455 (2001).
14 S. Priya and D. J. Inman, Energy Harvesting Technologies (Springer, New York, 2009). [DOI: http://dx.doi.org/10.1007/978-0-387-76464-1]
15 E. R. Leite, A. M. Scotch, A. Khan, T. Li, H. M. Chan, M. P. Harmer, S. F. Liu, and S. E. park, J. Am. Chem. Soc., 85, 3018 (2002).
16 V. R. Cooper, I. Grinberg, N. R. Martin, and A. M. Rappe, Fundamental Physics of Ferroelectrics (eds. R. E. Cohen) American Institute of Phvsics, 26 (2002).
17 J. A. Perez, M. R. Soares, P. Q. Mantas, and A.M.R. Senos, J. Eur Ceram. Soc., 25, 2207 (2005). [DOI: http://dx.doi.org/10.1016/j.jeurceramsoc.2005.03.031]   DOI
18 J. F. Tressler, S. Alkoy, and R. E. Newnham, Journal of Electroceramics, 2:4, 257-272 (1998). [DOI: http://dx.doi.org/10.1023/A:1009926623551]   DOI
19 C. I. Cheon and J. S. Park, Journal of Materials Science Letters, 16, 2043 (1997). [DOI: http://dx.doi.org/10.1023/A:1018560717278]   DOI