• The Transactions of the Korean Institute of Electrical Engineers C
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• v.50 no.11
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• pp.555-561
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• 2001

In this paper, the low power (1.5 W) solenoid-type magnetic thin-film transformers utilizing a $Ni_{81}Fe_{19)$ core material were designed and fabricated for 5 MHz-drive DC-DC converter application. The $20\mum$ thick copper films were used as the coils. The transformers fabricated in this work have the sizes of $3.08 mm\times25.5 mm\; and\; 6.15 mm\times12.75 mm.$ The optimum design of solenoid-type magnetic thin film transformers was performed utilizing the conventional equations, a Maxwell computer simulator (Ansoft HFSS V7.0 for PC), and parameters obtained from the magnetic properties of NiFe magnetic core materials. frequency characteristics of inductance, dc resistance (R), coupling factor (k) and gain of developed transformers were measured using HP4194A impedance and gain-phase analyzer. The fabricated transformers with the size of $6.15 mm\time12.75 mm$ exhibit the inductance of $0.83 \muH$, the dc resistance of $2.3\Omega$$\Omega$, the k of 0.91 and the gain of -1 dB at 5 MHz, which show the comparable results to those reported in the recent literatures. The measured high-frequency characteristics for the fabricated transformers agreed well with those obtained by theoretical calculations .

• Journal of the Korean institute of surface engineering
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• v.51 no.1
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• pp.1-10
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• 2018

Anodic oxidation treatment of metals is one of typical surface finishing methods which has been used for improving surface appearance, bioactivity, adhesion with paints and the resistances to corrosion and/or abrasion. This article provides fundamental principle, type and characteristics of the anodic oxidation treatment methods, including anodizing method and plasma electrolytic oxidation (PEO) method. The anodic oxidation can form thick oxide films on the metal surface by electrochemical reactions under the application of electric current and voltage between the working electrode and auxiliary electrode. The anodic oxide films are classified into two types of barrier type and porous type. The porous anodic oxide films include a porous anodizing film containing regular pores, nanotubes and PEO films containing irregular pores with different sizes and shapes. Thickness and defect density of the anodic oxide films are important factors which affect the corrosion resistance of metals. The anodic oxide film thickness is limited by how fast ions can migrate through the anodic oxide film. Defect density in the anodic oxide film is dependent upon alloying elements and second-phase particles in the alloys. In this article, the principle and mechanisms of formation and growth of anodic oxide films on metals are described.

• Journal of Powder Materials
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• v.28 no.4
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• pp.325-330
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• 2021

In this study, a ZnS film of 8-mm thickness was prepared on graphite using a hot-wall-type CVD technique. The ZnS thick film was then hot isostatically pressed under different pressures (125-205 MPa) in an argon atmosphere. The effects of pressure were systematically studied in terms of crystallographic orientation, grain size, density, and transmittance during the HIP process. X-ray diffraction pattern analysis revealed that the preferred (111) orientation was well developed after a pressure of 80 MPa was applied during the HIP process. A high transmittance of 61.8% in HIP-ZnS was obtained under the optimal conditions (1010℃, 205 MPa, 6 h) as compared with a range of approximately 10% for the CVD-ZnS thick film under a 550-nm wavelength. In addition, the main cause of the improvement in transmittance was determined to be the disappearance of the scattering factor due to grain growth and the increase in density.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.50 no.6
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• pp.303-306
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• 2001

STFR were fabricated on the floating membrane which was formed by SOI-micromachining process. The floating membranes having a thickness range of $3{\sim}15{\mu}m$ could be simply formed by micromachining the directly-bonded and thinned SOI substrate. The STFR device fabricated on the $15{\mu}m$-thick membrane showed resonance frequency of fr = 1.65 GHz, coupling coefficient of Keff2 = 2.4 %, and series and parallel quality factors of Qs = 91.7 and Qp = 87.7, respectively.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.21-27
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• 2001

Epoxy/BaTiO$_3$composite film type capacitors with excellent stability at room temperature, uniform thickness, and electrical properties over a large area were successfully fabricated. We fabricated composite capacitor films with good film formation capability and easy process ability, from ACF-resin as a matrix and two kinds of BaTiO$_3$powders as fillers to increase the dielectric constant of the composite film. The crystal structure of the powders and its effects on dielectric constant of the films were investigated by X-ray diffraction. DSC and dielectric properties tests were conducted to decide the right curing temperature and the optimum amount of the curing agent. As a result, the capacitors of $7{\mu}{\textrm}{m}$ thick film with 10nF/cm2 and low leakage current were successfully demonstrated.

• Journal of the Korean Vacuum Society
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• v.6 no.S1
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• pp.141-153
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• 1997

The paraelectric cubic-to-ferroelectric tetragonal phase transition of the thin Pb(Zr, Ti)$O_3$ (PZT) films grown on MgO(001) substrate was investigated in a series of synchrotron x-ray scattering experiments. As the thickness of the film decreases the transition temperature and the amount of the tetragonal distortion were decreased continuously Different from only the c-domains were existent in the thinnest 25nm thick film. Based on this we propose a model for the domain structure of the tetragonal PZT/MgO(100) film that is very different from the ones suggested in literature. We attribute the suppression of the transition to the substrate field that prefers the c-type domains near the interface and suppresses the tetragonal distortion to minimize the film-substrate lattice mismatch.

• Journal of the Korean institute of surface engineering
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• v.25 no.4
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• pp.189-206
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• 1992

The effect of activation and electroless nickel plating conditions on contact properties was investi-gated for selective electroless nickel plating of Si wafers in order to obtain an optimum condition of con-tact hole filling. According to RCA prosess, p-type silicon (100) surface was cleaned out and activated. The effects of temperature, DMAB concentration, time, and strirring were investigated for activation of p-type Si(100) surface. The optimal activation condition was 0.2M HF, 1mM PdCl2, 2mM EDTA,$ 70^{\circ}C$, and 90sec under ultrasonic vibration. In electroless nickel plating, the effect of temperature, DMAB concentra-tion, pH, and plating time were studied. The optimal plating condition found was 0.10M NiSO4.H2O, 0.11M Citrate, pH 6.8, $60^{\circ}C$, 30minutes. The contact resistance of films was comparatively low. It took 30minutes to obtain 1$\mu\textrm{m}$ thick film with 8mM DMAB concentration. The film surface roughness was improved with decreasing temperature and decreasing pH of the plating solution. The best quality of the film was obtained at the condition of temperature $60^{\circ}C$ and pH 6.0. The micro-vickers hardness of film was about 800Hv. Plating rate of nickel on the hole pattern was slower than that of nickel on the line pattern.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.6
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• pp.507-511
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• 2006

We investigated accelerated soft error rate (ASER) in static random access memory (SRAM) cells of thin film transistor (TFT) type. The effects on ASER by cell density, buried nwell structure, operational voltage, and polysilicon-2 layer thickness were examined. The increase in the operational voltage, and the decrease in the density of SRAM cells, respectively, resulted in the decrease of ASER values. The SRAM chips with buried nwell showed lower ASER than those with normal well structure did. The ASER decreased as the test distance from alpha source to the sample increased from $7{\mu}m\;to\;15{\mu}m$. As the polysilicon-2 thickness increased up to $1000\;{\AA}$, the ASER decreased exponentially. In conclusion, the best condition for low soft error rate, which is essential to obtain highly reliable SRAM device, is to apply the buried nwell structure scheme and to fabricate thin film transistors with the thick polysilicon-2 layer

• Korean Journal of Digital Imaging in Medicine
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• v.12 no.2
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• pp.145-150
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• 2010

Thick films of carbon fiber were prepared by a heating element of plan shape made in Darin co., We have investigated surface morphology of the specimen depending on heat-treatment temperatures. Scanning electron microscope(SEM) image of carbon fiber thick films of the specimen heat treated shows a grain growth at $1200^{\circ}C$ and becomes a poly-crystallization at $1350^{\circ}C$. The variation of resistivity at the thermally annealed specimen above $600^{\circ}C$ depends on type of the substrates. It may be due to a variation of film thickness and a difference of interfacial phenomena. A heating element of features was affected significantly by skin blood and quantity of heat of the body physiological function. After radiation of farinfrared for plate heating element, the function of biometric physiological is considered of skin blood flow and calorie which greatly affects on individuals. Electromagnetic wave was not influence on the body.

• Fashion & Textile Research Journal
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• v.14 no.4
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• pp.641-647
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• 2012

This study investigates the sound properties of fabric frictional sound (SPL, ${\Delta}L$, ${\Delta}f$) according to the film type of PTFE laminated vapor-permeable water-repellent fabrics in order to understand the relationship between SPL and the basic properties of fabrics such as layer, yarn type, and thickness of fiber. This study accesses their mechanical properties and determines how to control them to minimize SPL. Eight PTFE laminated water-repellent fabrics, composed of four different film types (A, B, C, D) and with two different fabrics, were used as test specimens. Frictional sounds generated at 1.21m/s were recorded by using a fabric sound generator and SPLs were analyzed through Fast Fourier Transformation (FFT). The mechanical properties of fabrics were measured by KES-FB. The SPL value was lowest at 74.4dB in film type A and highest as 85.5dB in type D. Based on ANOVA and post-hoc test, specimens were classified into less Loud Group (A, B) and Loud Group (C, D). It was shown that SPL was lower when 2 layer (instead of 3 layer), filament yarn than staple, and thin fiber than thick were used. In Group I, shearing properties (G, 2HG5), geometrical roughness (SMD), compressional properties (LC, RC) and weight (W) showed high correlation with SPL however, elongation (EM) and shear stiffness (G) did with SPL in Group II.