Journal of the Korean institute of surface engineering (한국표면공학회지)
- Volume 25 Issue 4
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- Pages.189-206
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- 1992
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- 1225-8024(pISSN)
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- 2288-8403(eISSN)
Selective Contact Hole Filling by electroless Ni Plating
무전해 Ni 도금에 의한 선택적 CONTACT HOLE 충전
Abstract
The effect of activation and electroless nickel plating conditions on contact properties was investi-gated for selective electroless nickel plating of Si wafers in order to obtain an optimum condition of con-tact hole filling. According to RCA prosess, p-type silicon (100) surface was cleaned out and activated. The effects of temperature, DMAB concentration, time, and strirring were investigated for activation of p-type Si(100) surface. The optimal activation condition was 0.2M HF, 1mM PdCl2, 2mM EDTA,
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