• The Korean Nurse
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• s.6
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• pp.97-100
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• 1963

• Korean Journal of Psychosomatic Medicine
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• v.25 no.1
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• pp.56-62
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• 2017

Objectives : The objective of this study was to investigate the relationship between psychological distress and pain in cancer patients. Methods : 249 patients with cancer who visited National Health Insurance Service Ilsan Hospital between April 2013 and March 2014 were evaluated with National Cancer Center Psychological Symptom Inventory(NCC-PSI) which consisted of Modified Distress Thermometer(MDT) and Modified Impact Thermometer(MIT). Each scale was divided into 3 subscales targeting separate symptoms: insomnia, anxiety, and depression. Psychological distress was defined as positive for those who scored above the cutoff values in at least one of all six subscales. The Numeric Rating Scale for Pain(NRS-Pain) was used to assess the subjective severity of pain. Logistic regression was performed to investigate the association between psychological distress and pain. Results : Univariate logistic regression analysis showed that pain, gender, compliance, and two subscale scores of Hospital Anxiety and Depression Scale(HADS) were significantly associated with psychological distress. Multivariate logistic regression analysis showed that pain and HADS anxiety subscale score maintained a statistically significant association with psychological distress adjusted for variables including age, gender, years of education, Eastern Cooperative Oncology Group performance status, cancer stage, Charlson Comorbidity Index, compliance, and HADS depression subscale score. One point increase in pain was 1.31 times more likely to cause psychological distress. In secondary analysis, pain was significantly associated with all subscales of NCC-PSI, except MIT-anxiety subscale. Conclusions : This study suggests that NCC-PSI, a screening tool for psychological distress, reflects pain. We recommend that physicians who treat cancer patients consider the examination of psychological distress which provides comprehensive evaluation of various factors regarding quality of life.

• Journal of Biomedical Engineering Research
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• v.31 no.2
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• pp.123-128
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• 2010

The thermometers is widely used in diagnostic medical devices, and the safety and accurate performance of these devices are important in the diagnosis and monitoring of personal health. Especially, the accuracy of infra-red thermometer is highly emphasized. Here two typical thermometers are utilized for this purpose: the electronic thermometers measure body temperature by contacting to subject while infra-red thermometers measure by no contacting to subject. Therefore, the evaluating items of each thermometer are different, and the standard for each temperature is highly needed. But, there have been no international standards of each thermometer such as IEC. In this paper, we developed the standards of electronic and infra-red thermometer based on national standards such as KS, ASTM, EN, JIS and FDA guidance. The new standards focused on the safety and suitable performance for health care. This standards were applied to enact and revise the electronic medical device standards. So it can be applied to evaluate the safety and performance on technical file review. We predict that this standard will improve the quality of diagnostic medical devices (thermometers) and increase the international competitive power of domestic product.

• Journal of Sensor Science and Technology
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• v.13 no.6
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• pp.411-416
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• 2004

In the international temperature scale of 1990 (ITS-90), standard platinum resistance thermometer (SPRT) is a defining standard thermometer used in the temperature range from 13.8033 K to $961^{\circ}C$. Uncertainty of SPRT is about several mK and uncertainty of defining fixed points of the ITS-90 which is used for calibrating SPRT is about several tenth of mK. Above $0^{\circ}C$. the defining fixed points are gallium melting point and indium, tin, zinc, aluminium and silver freezing points which are all realized using an electric furnace or a liquid bath. To realize freezing point of tin ($231.928^{\circ}C$) and zinc ($419.527^{\cir}C$), two 3-zone furnaces which have 3 electric heaters were manufactured. Temperature gradient of the constructed furnaces were tested. Uncertainty caused by temperature gradient of furnace and immersion effect of SPRT in the sealed-type freezing point cells were evaluated 0.038 mK for tin freezing point and 0.036 mK for zinc freezing point.

• Journal of Preventive Medicine and Public Health
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• v.6 no.1
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• pp.65-70
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• 1973

The study in the fild of medical instrument has been out of the interest by any of the life scientist in Korea. Especially, the recent developments in the medical electromics are remarkable one. Authors planned this study to ascertain the possibility of setting up the thermister thermometer with available accessories of demestic prouducts including some specific foreign assembly parts. By proper use of the thermister as one of the wheatstone bridge, we could detect tile resistance variations due to the environmental temperature variace. The intensive care for the bridge circuit and compensation scheme was required. The calibration procedure adopted here makes it possible to read the current as the temperature. The temperature range was determined by the examination and construction of the graph of the resistance-temperature variation. The determination of electric current, available ambient-temperature, the reduction of excessive current and self-heating of the thermister were made. Renovation in response-velocity was under taken too. This electronic thermometer was designed and assembled by the circuitry developed in accordance with the maximum availability of domestic products with some foreign-made parts. The result of our experiment showed very stable function and proved to be the most promissing item in the actual application as long as the thermistor thermister is concerned.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.37 no.1
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• pp.95-98
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• 2013

Plate thermometers are used for measuring the radiative heat flux in high-temperature surroundings. The heat flux is calculated from the temperature measured at the back surface of the stainless steel surface of the meter. Heat fluxes from a Schmidt-Boelter gauge are measured as reference heat fluxes. A combined conductive coefficient is introduced to consider the heat loss to insulation, conduction through the stainless plate depth, and conduction from the non-uniform temperature of the plate of the plate thermometer. This coefficient is obtained using the repulsive particle swarm optimization.

• Journal of the Korean Ceramic Society
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• v.35 no.11
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• pp.1203-1211
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• 1998

The microwave sintered BaTiO3 samples were obtained by using the microwave sintering device which can precisely control the sintering temperature and the sinter time by using IR optical thermometer and PID temperature controller. During microwave sintering the internal temperature of samples were mesur-ed by the optical fiber thermometer to compare the sintering behaviors between microwave- and con-ventionally sintered ones. The former showed the faster rate of grain growth with sintering time and the larger grain size than the latter. Also they showed the similar pattern of dielectric properties with tem-perature changes from 2$0^{\circ}C$ to 16$0^{\circ}C$.

• Journal of Sensor Science and Technology
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• v.21 no.2
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• pp.109-113
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• 2012

We propose an improved interpolating equation to express temperature-resistance characteristics for modern industrial platinum resistance thermometers (PRTs). Callendar-van Dusen equation which has been widely used for platinum resistance thermometer fails to fully describe temperature characteristics of high quality PRTs and leaves systematic residual when the calibration point include temperatures above $300^{\circ}C$. Expanding Callendar-van Dusen to higher-order polynomial drastically improves the uncertainty of the fitting even with reduced degrees of freedom of the fitting. We found that in the fourth-order polynomial fitting, the third-order and fourth-order coefficients have a strong correlation. Using the correlation, we suggest an improved interpolating equation in the form of fourth-order polynomial, but with three fitting parameters. Applying this interpolating equation reduced the uncertainty of the fitting to 32 % of that resulted from the traditional Callendar-van Dusen. This improvement was better than that from a simple third-order polynomial despite that the degrees of the freedom of the fitting was the same.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.27 no.1
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• pp.102-108
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• 2003

Recently, the authors have developed a new material test system fur thin film at the high temperature. It is so compact and precise with sub micron resolution that it seems to be a useful tool fur research of the oxide film growth, its mechanical behavior and failure mechanism. To this end. in this paper three methologies are described for in-situ monitoring of the displacement & strain and the temperature, the oxide thickness. These are the Laser Speckle analysis with digital image correlation technique, the two-color infra-red thermometer and the laser reflection interferometry respectively. The calibration results and some issues which should be addressed for practical application are presented.

• Proceedings of the Korea Society for Simulation Conference
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• 2001.10a
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• pp.387-390
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• 2001

Thermopile thermometer can measure the temperature of an object without attaching the object. It measures the temperature by receiving the radiation energy from objects. The idea of this is from the law of Stefan-Boltzmann. In the past it was not used well because the size was big and the cost was too expensive. But, In these days it can be used many field because the size become smaller and advantage of cost by using micro machine technology. However, The accuracy of measuring is not better than electric type. So we want to improve the accuracy of sensor by analyzing the heat transfer of the thermopile. To analyze temperature distribution in the thermopile sensor, we use the FEM software which is named ANSYS. The conduction and radiation heat transfer is considered to simulate the temperature distribution and time response inside of the sensor.