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http://dx.doi.org/10.3795/KSME-A.2003.27.1.102

Method for Measuring Mechanical Behaviors of Thin Films at High Temperature  

Lim, Sang-Chai (전남대학교 대학원 기계시스템공학부)
Joo, Jae-Hwang (전남대학교 대학원 기계시스템공학부)
Kang, Ki-Ju (전남대학교 공과대학 기계시스템공학부)
Publication Information
Transactions of the Korean Society of Mechanical Engineers A / v.27, no.1, 2003 , pp. 102-108 More about this Journal
Abstract
Recently, the authors have developed a new material test system fur thin film at the high temperature. It is so compact and precise with sub micron resolution that it seems to be a useful tool fur research of the oxide film growth, its mechanical behavior and failure mechanism. To this end. in this paper three methologies are described for in-situ monitoring of the displacement & strain and the temperature, the oxide thickness. These are the Laser Speckle analysis with digital image correlation technique, the two-color infra-red thermometer and the laser reflection interferometry respectively. The calibration results and some issues which should be addressed for practical application are presented.
Keywords
Thin Film; Digital Image Correlation; Infra Red Thermometer; Emissivity; Laser Reflection Interferometry; Laser Speckle;
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