• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.1
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• pp.43-49
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• 2015

In recent years, the amount of heat generated inside of the computer has more increased because of high performance, multi-function, miniaturization and light weight. It is necessary to control the effective heat generation to improve performance and life extension of the computer. In this study, thermoelectric cooling system was manufactured using thermoelectric module and was attached to computer in order to control the heat generated inside computer. And the temperature distributions inside computer were experimentally measured and compared with and without thermoelectric cooling system to investigate the effect of cooling system. Also, to estimate the new cooling system which can substitute for the existing computer cooling system, temperature distributions inside computer were calculated by numerical analysis when there was no cooling system and was applied only cooling system to computer.

• Proceedings of the KAIS Fall Conference
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• 2008.05a
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• pp.163-166
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• 2008

This study developed matt used by thermoelectric device to use both cooling and heating. To develop this system, heating system used sheath heater and cooling system used thermoelectric device. A Flow of water controlled by a capillary tube system made by polymethyl. Results by this system very lowered spending of energy.

• The Journal of the Korea institute of electronic communication sciences
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• v.9 no.12
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• pp.1435-1440
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• 2014

This paper was designed to analyze thermal properties using thermoelectric element for air-cooling heat dissipation of 13.2W-class COB LED. For comparative analysis with generally used air cooling methods, the heat sink was designed and produced, and this experiment was conducted to measure the temperature distribution using a contact thermometer while the COB LED was operating for 100 minutes. One result was about $75^{\circ}C$ for the general cooling method, and the other was $57^{\circ}C$ while the thermoelectric element was operating with applying the current of 0.8A to the thermoelectric element. This results confirmed that the method of applying thermoelectric element was much better in the dissipation of thermal condense on the COB LED than that of the general air cooling one. The temperature on the contact points of COB LED using thermoelectric element was decreased about 31% compared with the air cooling method from $75^{\circ}C$ to $57^{\circ}C$.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.18 no.2
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• pp.108-113
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• 2019

Due to the special structure of the car seat, the heating and cooling module must be installed in a limited area resulting in difficulty in regards to achieving optimal cooling and heating efficiency. In order to solve these problems, this paper establishes a new structure for heating and cooling modules, verifies the structural feasibility of the thermoelectric module for cooling and heating the seat through fluid simulations, and verifies the proper design of the mechanical components of the thermoelectric module.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.430-431
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• 2006

Thermoelectric thick film was fabricated by screen printing process with using p-type Bi-Te-Sb powders. The powder was synthesized by melting, milling and sintering process and hydrogen reduced to enhance the thermoelectric property. The thick film of Bi-Te-Sb powder was fabricated by screen printing method and baked at the optimized conditions. The thermal conductivity, the electrical resistivity and Seeback coefficient of thick film were measured and the thermoelectric performance was analyzed in terms of film characteristics and its microstructure. Finally, the feasibility of thermoelectric thick film into micro cooling device on CPU chip was discussed in this study.

• Tribology and Lubricants
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• v.29 no.5
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• pp.310-317
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• 2013

To reduce vehicle fuel consumption due to not only driving but also air conditioning, battery-operated non-starting conditioning systems with thermoelectric modules and without mechanical elements like compressors are being manufactured for use by hybrid heavy trucks in the near future. In this study, the voltage and current consumed by a thermoelectric module were measured to determine the required battery power, and the performance of the conditioning system with air temperature, and humidity of the inlet/outlet modules and inside/outside the cabin for a truck, was evaluated using experimental apparatus under actual conditions. The results showed that, the thermoelectric module can be continously operated for about 1.5 h using existing 24 V batteries. The coefficent of performance(COP) of the cooling and heating modes was calculated to be an average 0.8-1.32. As expected, the heating performance was 30% more efficient than the cooling performance, which is general characteristic of thermoelectric modules.

• Proceedings of the KIPE Conference
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• 1998.10a
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• pp.564-568
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• 1998

All elements and systems of electronics have optimum temperature conditions. A using of the thermoelectric method of cooling is the most approach for the thermal management of power electronics. An analysis of using the thermoelectric cooling and the temperature control is given as an efficient method of ensuring a work of power electronic devices in conditions of micro-miniaturization.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.11a
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• pp.551-552
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• 2010

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.18 no.3
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• pp.211-217
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• 2006

The three-dimensional numerical analysis has been carried out to figure out the effect of the thermoelectric element thickness on the thermal performance of the thermo-electric micro-cooler. The small-size and column-type thermoelectric cooler is considered. It is known that tellurium compounds currently have the highest cooling performance around the room temperature. Thus, in the present study, $Bi_{2}Te_{3}$ and $Sb_{2}Te_{3}$ are selected as the n- and p-type thermoelectric materials, respectively. The thermoelectric leg considered is less than $20{\mu}m$ thick. The thickness of the leg may affect the thermal and electrical transport through the interfaces between the leg and metal conductors. The effect of the thermoelectric element thickness on the thermal performance of the cooler has been investigated with parameters such as the temperature difference, the current, and the cooling power.

• The Journal of the Korea institute of electronic communication sciences
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• v.9 no.11
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• pp.1291-1296
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• 2014

The thermoelectric cooler is receiving great interest because of advantages such as the precise temperature control capability, the compact and lightweight cooler, and the mechanical vibrationless structure which enhances the reliability compared with the existing vapor compression cooler. However, it is not easy to design the optimal thermoelectric cooler which appropriate to the application because the thermal analysis should be necessary required. Accordingly, this paper studies the methodology of the modelling, sizing and thermal analysis of the thermoelectric cooler using SINDA/FLUINT analysis tool.