• Solar Energy
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• v.20 no.1
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• pp.97-108
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• 2000

The purpose of this study is to minimize the heat transfer surface area and cold fluid exit temperature of heat exchanger which applied to the refrigeration and air-conditioning system by utilizing the thermoelectric principle. Both uniform and non-uniform current distribution methods which applied to the analysis of the TE elements that incorporates heat exchanger were investigated. The non-uniform current distribution method had the better coefficient of performance and had the lower cold fluid exit temperature of the TE cooling system than the uniform current distribution method. It was found that if a TE cooling system incorporates a heat exchanger, a non-uniform current distribution should guarantee to the lowest cold fluid exit temperature. Also, the hybrid method (combination of the uniform and non-uniform current distribution method) is investigated to achieve the best results by combining the uniform and non-uniform current distributions. The results show that it can lower the cold fluid exit temperature and reduce the heat transfer surface area for the parallel flow arrangement if we apply the constant current in some entry region and the non-uniform increasing current in the direction of the cold fluid flow afterwards.

• Journal of the Korean Solar Energy Society
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• v.39 no.1
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• pp.21-32
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• 2019

Solar hot water system produces hot water using solar energy. If it is not used effectively, overheating occurs during the summer. Therefore, a lot of research is being done to solve this. This study develops thermoelectric power module applicable to solar hot water system. A thermoelectric material can directly convert thermal energy into electrical energy without additional power generation devices. If there is a temperature difference between high and low temperature, it generate power by Seebeck effect. The thermoelectric module generates electricity using temperature differences through the heat exchange of hot and cold water. The water used for cooling is heated and stored as hot water as it passes through the module. It can prevent overheating of Solar hot water system while producing power. The thermoelectric module consists of one absorption and two radiation part. There path is designed in the form of a water jacket. As a result, a temperature of the absorption part was $134.2^{\circ}C$ and the radiation part was $48.6^{\circ}C$. The temperature difference between the absorption and radiation was $85.6^{\circ}C$. Also, The Thermoelectric module produced about 122 W of irradiation at $708W/m^2$. At this time, power generation efficiency was 2.62% and hot water conversion efficiency was 62.46%.

• Journal of Power System Engineering
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• v.10 no.4
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• pp.65-70
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• 2006

This study is to experimentally evaluate the cooling performance of the Bonding type and Injection type of heat sink using three different kinds of industrial Peltier module by digital LabViewTM measurement. Injection type of heat sink could be more efficient for the heat transfer than Bonding type, even with 30% more radiating surface area. In addition, the experimental results revealed that the sufficient power supplied was able to show the better cooling performance of Peltier module. In order to verify the optimal cooling performance of the cooling device, two Peltier module, HMN 6040 and HMN 1550 with Bonding and Injection type of heat sink were used. The cooling performance with injection type of heat sink was 2.11% and 6.24% better than that with bonding type of heat sink under the HMN 6040 and HMN 1550, respectively.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.16 no.8
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• pp.741-747
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• 2004

The purpose of this study was to develop a cooler/heater using a thermoelectric module combined with a parallel flow type oscillating heat pipe with R-142b as a work ing fluid. The experiment was performed for 16 thermoelectric modules (6 A/15 V, size: 40${\times}$40${\times}$4 mm), varying design parameters of the heat pipe (inclination angle, working fluid charging ratio, etc) . Experimental results indicate that the optimum charging ratio and the inclination angle of the parallel flow type oscillating heat pipe were 30% by volume and 30%, respectively. The maximum cooler/heater capacity were 479W (COP : 0.47) and 630W (COP : 0.9), respectively.

• Proceedings of the KSME Conference
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• 2000.04b
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• pp.108-112
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• 2000

This paper presents a mathematical model and simulation of the micro-actuator based on thermally induced liquid-vapor phase-change in a partially-filled closed cavity. The volume expansion by liquid-vapor Phase change can generate considerable forces and displacement $({\sim}50{\mu}m)$ required for commercial use. For optimum operation involving many cycles within the closed chamber, active(thermoelectric) heating and cooling is used. The optimization of the system is conducted according to the parameters such as input power and response time. The optimized performance of micro-actuator is reasonable compared to other actuators.

• International Journal of Computer Science & Network Security
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• v.21 no.6
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• pp.252-257
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• 2021

The application of the principle of trigeneration allows to simultaneously provide electricity to power electronic devices, as well as heat and cold to create the necessary microclimate of the premises and increase efficiency compared to separate cooling and heating systems. The use of Peltier thermoelectric modules (TEM) as part of trigenerative systems allows for smooth and precise control of the temperature regime, high manufacturability and reliability due to the absence of moving parts, resistance to shock and vibration, and small weight and size parameters of the system. One of the promising areas of improvement of trigenerative systems is their modeling and optimization based on the automatic control theory. A block diagram and functional model of an energy-saving trigenerative climate control system based on Peltier modules are developed, and the transfer functions of an open and closed system are obtained. The simulation of the transient characteristics of the system with varying parameters of the components is performed. The directions for improving the quality of transients in the climate control system are determined, as well as the prospects of the proposed methodology for modeling and analyzing control systems operating in substantially nonlinear modes.

• 제어로봇시스템학회:학술대회논문집
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• 2005.06a
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• pp.139-144
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• 2005

A rigorous research is underway in our team, for the design and development of high figure of merits (ZT= 1.5${\sim}$2.0) micro-thermoelectric coolers. This paper discusses the fabrication process that we are using for developing the $Sb_2Te_3-Bi_2Te_3$ micro-thermoelectric cooling modules. It describes how to obtain the mechanical properties of the thin film TEC elements and reports the results of an equation-based multiphysics modeling of the micro-TEC modules. In this study the thermoelectric thin films were deposited on Si substrates using co-sputtering method. The physical mechanical properties of the prepared films were measured by nanoindentation testing method while the thermal and electrical properties required for modeling were obtained from existing literature. A finite element model was developed using an equation-based multiphysics modeling by the commercial finite element code FEMLAB. The model was solved for different operating conditions. The temperature and the stress distributions in the P and N elements of the TEC as well as in the metal connector were obtained. The temperature distributions of the system obtained from simulation results showed good agreement with the analytical results existing in literature. In addition, it was found that the maximum stress in the system occurs at the bonding part of the TEC i.e. between the metal connectors and TE elements of the module.

• Journal of Astronomy and Space Sciences
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• v.17 no.1
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• pp.53-66
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• 2000

We developed low light CCD imaging system using thermoelectric cooling method collaboration with a company to design a commercial model. It consists of Kodak KAF-0401E(768$\times$512 pixels) CCD chip, thermoelectric module manufactured by Thermotek. This TEC system can reach an operative temperature of $-25^{\circ}C$. We employed an Uniblitz VS25s shutter and it has capability a minimum exposure time 80ms. The system components are an interface card using a Korea Astronomy Observatory (hereafter KAO) ISA bus controller, image acquisition with AD9816 chip, that is 12bit video processor. The performance test with this imaging system showed good operation within the initial specification of our design. It shows a dark current less than 0.4e-/pixel/sec at a temperature of $-10^{\circ}C$, a linearity 99.9$\pm$0.1%, gain 4.24e-/adu, and system noise is 25.3e-(rms). For low temperature CCD operation, we designed a TEC, which uses a one-stage peltier module and forced air heat exchanger. This TEC imaging system enables accurate photometry($\pm$0.01mag) even though the CCD is not at 'conventional' cryogenic temperatures(140k). The system can be a useful instrument for any other imaging applications. Finally, with this system, we obtained several images of astronomical objects for system performance tests.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.31 no.4
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• pp.249-254
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• 2018

We researched about a bulk metallic glass system as an additive to an Ag paste for high temperature thermoelectric modules. Bulk metallic glass (BMG) ribbons were produced by using a rapid solidification process (RSP) under a cooling rate condition higher than $10^{\circ}C/sec$. We investigated BMG characteristics of the ribbons by means of x-ray diffraction (XRD) and differential scanning calorimetry (DSC) in order to evaluate the glass transition temperature ($T_g$) and the recrystallization temperature ($T_x$) lower than $400^{\circ}C$. A milling process was also developed to apply the BMG ribbons to a commercial Al paste as an additive for lower sintering temperature.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.2
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• pp.61-67
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• 2017

As transistor density increases rapidly, a heat flux from IC device rises at fast rate. Thermal issues raised by high heat flux cause IC's performance and reliability problems. To solve these thermal management problems, the conventional cooling methods of IC devices were reached their thermal limit. As a result, alternative cooling methods such as liquid heat pipe, thermoelectric cooler, thermal Si via and etc. are currently emerging. In this paper microchannel liquid cooling system with TSV was investigated. The effects of 2 coolants (DI water and ethylene glycol 70 wt%) and 3 metal bumps (Ag, Cu, Cr/Au/Cu) on cooling performance were studied, and the total heat flux of various coolant and bump cases were compared. Surface temperature of liquid cooling system was measured by infrared microscopy, and liquid flowing through microchannel was observed by fluorescence microscope. In the case of ethylene glycol 70 wt% at $200^{\circ}C$ heating temperature, the total heat flux was $2.42W/cm^2$ and most of total heat flux was from liquid cooling effect.