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http://dx.doi.org/10.4313/JKEM.2018.31.4.249

Research for Solder Paste in Metallic Glass System for Thermoelectric Modules  

Seo, Seung-Ho (School of Energy, Materials and Chemical Engineering, Korea University of Technology and Education)
Son, Geun Sik (School of Energy, Materials and Chemical Engineering, Korea University of Technology and Education)
Seo, Kang Hyun (School of Energy, Materials and Chemical Engineering, Korea University of Technology and Education)
Choi, Soon-Mok (School of Energy, Materials and Chemical Engineering, Korea University of Technology and Education)
Publication Information
Journal of the Korean Institute of Electrical and Electronic Material Engineers / v.31, no.4, 2018 , pp. 249-254 More about this Journal
Abstract
We researched about a bulk metallic glass system as an additive to an Ag paste for high temperature thermoelectric modules. Bulk metallic glass (BMG) ribbons were produced by using a rapid solidification process (RSP) under a cooling rate condition higher than $10^{\circ}C/sec$. We investigated BMG characteristics of the ribbons by means of x-ray diffraction (XRD) and differential scanning calorimetry (DSC) in order to evaluate the glass transition temperature ($T_g$) and the recrystallization temperature ($T_x$) lower than $400^{\circ}C$. A milling process was also developed to apply the BMG ribbons to a commercial Al paste as an additive for lower sintering temperature.
Keywords
Metallic glass; Ag paste; Thermoelectric modules; Brazing materials;
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