• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.1 s.34
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• pp.9-16
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• 2005

This paper presents the development of new anisotropic conductive adhesives with enhanced thermal conductivity for the wide use of adhesive flip chip technology with improved reliability under high current density condition. The continuing downscaling of structural profiles and increase in inter-connection density in flip chip packaging using ACAs has given rise to reliability problem under high current density. In detail, as the bump size is reduced, the current density through bump is also increased. This increased current density also causes new failure mechanism such as interface degradation due to inter-metallic compound formation and adhesive swelling due to high current stressing, especially in high current density interconnection, in which high junction temperature enhances such failure mechanism. Therefore, it is necessary for the ACA to become thermal transfer medium to improve the lifetime of ACA flip chip joint under high current stressing condition. We developed thermally conductive ACA of 0.63 W/m$\cdot$K thermal conductivity using the formulation incorporating $5 {\mu}m$ Ni and $0.2{\mu}m$ SiC-filled epoxy-bated binder system to achieve acceptable viscosity, curing property, and other thermo-mechanical properties such as low CTE and high modulus. The current carrying capability of ACA flip chip joints was improved up to 6.7 A by use of thermally conductive ACA compared to conventional ACA. Electrical reliability of thermally conductive ACA flip chip joint under current stressing condition was also improved showing stable electrical conductivity of flip chip joints. The high current carrying capability and improved electrical reliability of thermally conductive ACA flip chip joint under current stressing test is mainly due to the effective heat dissipation by thermally conductive adhesive around Au stud bumps/ACA/PCB pads structure.

• Transactions of the Korean Society of Automotive Engineers
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• v.20 no.5
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• pp.95-101
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• 2012

An electric water pump for engine cooling system has an advantage which particularly in the cold start, the use of the electric water pump saves fuel and leads to a corresponding reduction in emissions. The canned type electric water pump without mechanical sealing elements was selected to meet the requirements for operational reliability and life. However, the electric water pump for internal combustion engine generates much more heat loss than for hybrid electric vehicle since it is operated by the electric power of high current and low voltage. In this study, the fluid flow and thermal characteristics of the canned type electric water pump as an inverter integrated water pump has been investigated under the effects of heat generation. The analysis conditions such as outdoor air temperature of $125^{\circ}C$, water pump speed of 6000 rpm, coolant temperature of $106^{\circ}C$ and coolant flow rate of 120 L/min was used as a standard condition. Therefore, flow fields and temperature distribution inside the water pump were obtained. Also, we checked the feasibility of the canned type for the electric water pump in comparison with the mechanical seal type.

• Journal of Power Electronics
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• v.9 no.4
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• pp.544-552
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• 2009

This paper presents a novel spring pressure contact interconnect technique for medium power integrated power electronics modules (IPEMs). The key technology of this interconnection is a spring which is made from Be-Cu alloy. By means of the string pressure contact, sufficient press-contact force and good electrical interconnection can be achieved. Another important advantage is that the spring exhibits excellent performance in enduring thermo-mechanical stress. In terms of manufacture procedure, it is also comparatively simple. A 4 kW half-bridge power inverter module is fabricated to demonstrate the performance of the proposed pressure contact technique. Electrical, thermal and mechanical test results of the packaged device are reported. The results of both the simulation and experiment have proven that a good performance can be achieved by the proposed pressure contact technique for the medium power IPEMs.

• Steel and Composite Structures
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• v.52 no.3
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• pp.377-390
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• 2024

Analyzing thermoelastic, elastoplastic, and residual stresses is pivotal for deepening our insights into material characteristics, particularly in the engineering of advanced materials like functionally graded materials (FGM). This research delves into these stress types within a thick-walled sphere composed of Al-SiC FGM, employing a detailed successive approximation method (SAM) to pinpoint stress distributions under varied loading scenarios. Our investigation centers on how the sphere's structure responds to different magnitudes of internal pressure. We discover that under various states-thermoelastic, elastoplastic, and residual-the radial stresses are adversely impacted, manifesting negative values due to the compressive nature induced by internal pressures. Notably, the occurrence of reverse yielding, observed at pressures above 410 MPa, merits attention due to its significant implications on the sphere's structural integrity and operational efficacy. Employing the SAM allows us to methodically explore the nuanced shifts in material properties across the sphere's thickness. This study not only highlights the critical behaviors of Al-SiC FGM spheres under stress but also emphasizes the need to consider reverse yielding phenomena to maintain safety and reliability in their application. We advocate for ongoing refinement of analytical techniques to further our understanding of stress behaviors in various FGM configurations, which could drive the optimized design and practical application of these innovative materials in diverse engineering fields.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.04a
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• pp.35-43
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• 2001

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers. Microwave model and high-frequency measurement of the ACF flip-chip interconnection was investigated using a microwave network analysis. ACF flip chip interconnection has only below 0.1nH, and very stable up to 13 GHz. Over the 13 GHz, there was significant loss because of epoxy capacitance of ACF. However, the addition of $SiO_2filler$ to the ACF lowered the dielectric constant of the ACF materials resulting in an increase of resonance frequency up to 15 GHz. Our results indicate that the electrical performance of ACF combined with electroless Wi/Au bump interconnection is comparable to that of solder joint.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.81-85
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• 2013

Wafer stacking technology becomes more important for the next generation IC technology. It requires new process development such as TSV, wafer bonding, and wafer thinning and also needs to resolve wafer warpage, power delivery, and thermo-mechanical reliability for high volume manufacturing. In this study, Cu CMP which is the key process for wafer bonding has been studied using Cu CMP and oxide CMP processes. Wafer samples were fabricated on 8" Si wafer using a damascene process. Cu dishing after Cu CMP and oxide CMP was $180{\AA}$ in average and the total height from wafer surface to bump surface was approximately $2000{\AA}$.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.37 no.12
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• pp.1567-1572
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• 2013

To supply electric power in certain extreme environments such as a spacecraft or in military applications, a radioisotope thermoelectric generator has been highlighted as a useful energy source owing to its high energy density, long lifetime, and high reliability. A radioisotope thermoelectric generator generates electric power by using the heat energy converted from the radioactive energy of a radioisotope. In this study, FE analyses such as radiation shield analysis, heat transfer analysis, and power recovery rate analysis have been carried out to achieve an optimal design for a radioisotope thermoelectric generator using $SrTiO_2$.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.90-95
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• 2005

To perform the finish outside-diameter grinding process of ferrules which are widely used as fiber optic connectors, a high-precision centerless grinding machine is necessary. In this study, the thermal characteristics of the high-precision centerless grinding machine such as the temperature distribution, temperature rise and thermal deformation, are estimated based on the virtual prototype of the grinding machine and the heat generation rates of heat sources related to the machine operation conditions. The reliability of the predicted results is demonstrated by the temperature characteristics measured from the physical prototype. Especially, the predicted and measured results show the fact that the high-precision centerless grinding machine consisted of the hydrostatic GW and RW spindle systems, hydrostatic RW feeding mechanism, RW swivel mechanism, on-machine GW and RW dressers, and concrete-filled steel bed, has very stable thermal characteristics.

• Journal of the Korean GEO-environmental Society
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• v.25 no.7
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• pp.29-34
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• 2024

Frost heave is one of the significant engineering characteristics of frozen ground and causes severe damages on geo-structures. Although thermo-hydro coupled analyses have been developed to predict frost heave behavior, these analyses involve excessive input parameters and have primarily been validated for frost heave in clayey soils. Frost heave mainly occurs in silty soils, which have relatively higher permeability compared to clayey soils, necessitating careful attention. This study introduces empirical models and verifies their reliability for silty soils. By using the validated model, the correlation of key input parameters is derived, which is expected to enhance the applicability of thermal-mechanical analysis for geo-structures on frozen ground in the future.