• 마이크로전자및패키징학회지
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• 제10권3호
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• pp.9-17
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• 2003

In this paper, thermo-mechanical and rheological properties of NCPs (Non-Conductive Pastes) depending on silica filler contents and diluent contents were investigated. And then, thermal cycling (T/C) reliability of flip chip assembly using selected NCPs was verified. As the silica filler content increased, thermo-mechanical properties of NCPs were changed. The higher the silica filler content was added, glass transition temperature ($T_g$) and storage modulus at room temperature became higher. While, coefficient of thermal expansion (CTE) decreased. On the other hand, rheological properties of NCPs were significantly affected by diluent content. As the diluent content increased, viscosity of NCP decreased and thixotropic index increased. However, the addition of diluent deteriorated thermo-mechanical properties such as modulus, CTE, and $T_g$. Based on these results, three candidates of NCPs with various silica filler and diluent contents were selected as adhesives for reliability test of flip chip assemblies. T/C reliability test was performed by measuring changes of NCP bump connection resistance. Results showed that flip chip assembly using NCP with lower CTE and higher modulus exhibited better T/C reliability behavior because of reduced shear strain in NCP adhesive layer.

• Journal of Welding and Joining
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• 제31권6호
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• pp.44-49
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• 2013

The influence of thermo-mechanical cycling on the microstructure and strength in the weld coarse-grained heat affected zone (CGHAZ) of Ti-Nb added low carbon HSLA steel was explored through Vickers hardness tests, nanoindentation experiments, scanning electron microscopy (SEM) and transmission electron microscopy (TEM) analysis. Undeformed and deformed CGHAZs were simulated using Gleeble simulator with different heat inputs of 30kJ/cm and 300kJ/cm. At high heat input of 300kJ/cm, the CGHAZ consisted of ferrite and pearlite and then their grain sizes were not affected by deformation. At low heat input of 30kJ/cm, the CGHAZ consisted of lath martensite and then the sizes of prior austenite grain, packet and lath width decreased with deformation. In addition, the fraction of particle increased with deformation and this is because the precipitation kinetics was accelerated by deformation. Meanwhile, the Vickers and nanoindentation hardness of deformed CGHAZ with 30kJ/cm heat input were higher than those of undeformed CGHAZ, which are due to the effect of grain refinement and precipitation strengthening.

• Composites Research
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• 제17권6호
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• pp.52-57
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• 2004

본 연구에서는 환경 챔버를 이용한 극저온 환경에서, 열.하중 사이클에 따른 탄소섬유강화 복합재의 인장 물성 변화를 고찰하였다. Graphite/epoxy 일방향 복합재 시편에 대하여 시편 상온파손하중의 절반을 가한 상태에서, 상온에서 $-50^{\circ}C$, $-100^{\circ}C$, 그리고 $-150^{\circ}C$ 까지 각각 3회, 6회, 그리고 10회의 열-하중 사이클을 수행한 후 복합재의 인장 강도와 강성을 측정하였다. 그 결과, 온도가 낮아질수록 복합재의 인장 강성은 증가한 반면, 인장 강도는 감소함을 보였다. 그러나 복합재의 인장 강성은 저온 사이클 횟수에 거의 영향을 받지 않았으며 인장 강도는 사이클을 수행하지 않았을 때 보다 오히려 저온 사이클 수행 후 증가함을 확인할 수 있었다. 따라서 실험결과의 고찰을 위해 저온에서 복합재 시편의 열팽창계수를 측정하였고, 주사 전자 현미경 사진을 통해 섬유와 모재의 계면을 분석하였다.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2000년도 춘계학술대회논문집A
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• pp.188-193
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• 2000

A more accurate life prediction for gas turbine blade takes into account the material behavior under the complex thermo-mechanical fatigue(TMF) cycles normally encountered in turbine operation. An experimental program has been carried out to address the thermo-mechanical fatigue life of the IN738LC nickel-base superalloy. In the first phase of the study, out-of-phase and in-phase TMF experiments have been performed on uncoated and coated materials. In the temperature range investigated. the deposition of NiCrAlY air plasma sprayed coating did not affect the fatigue resistance. In the second phase of the study, a physically-base life prediction model that takes into account of the contribution of different damage mechanisms has been applied. This model was able to reflect the temperature and strain rate dependences of isothermal cycling fatigue lives, and the strain-temperature history effect on the thermo-mechanical fatigue lives.

• Restorative Dentistry and Endodontics
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• 제39권1호
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• pp.24-31
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• 2014

Objectives: The purpose of present study was to evaluate the internal adaptation of composite restorations using different adhesive systems. Materials and Methods: Typical class I cavities were prepared in 32 human third molars. The teeth were divided into the following four groups: 3-step etch-and-rinse, 2-step etch-and-rinse, 2-step self-etch and 1-step self-etch system were used. After the dentin adhesives were applied, composite resins were filled and light-cured in two layers. Then, silver nitrate solution was infiltrated, and all of the samples were scanned by micro-CT before and after thermo-mechanical load cycling. For each image, the length to which silver nitrate infiltrated, as a percentage of the whole pulpal floor length, was calculated (%SP). To evaluate the internal adaptation using conventional method, the samples were cut into 3 pieces by two sectioning at an interval of 1 mm in the middle of the cavity and they were dyed with Rhodamine-B. The cross sections of the specimens were examined by stereomicroscope. The lengths of the parts where actual leakage was shown were measured and calculated as a percentage of real leakage (%RP). The values for %SP and %RP were compared. Results: After thermo-mechanical loading, all specimens showed significantly increased %SP compared to before thermo-mechanical loading and 1-step self-etch system had the highest %SP (p < 0.05). There was a tendency for %SP and %RP to show similar microleakage percentage depending on its sectioning. Conclusions: After thermo-mechanical load cycling, there were differences in internal adaptation among the groups using different adhesive systems.

• 대한기계학회논문집A
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• 제34권9호
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• pp.1227-1233
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• 2010

가스터빈엔진 내의 블레이드에서는 표면에 외부의 찬 공기를 흘려주는 작은 냉각 홀들을 가공하고 열 차단 코팅시스템을 코팅하는 방법으로 기지금속을 고온에서 보호한다. 열 차단 코팅은 열피로 과정에서 산화막의 성장 및 접합층과 산화막의 열팽창계수의 불일치로 산화막내부에 잔류응력이 발생하며 궁극적으로 코팅층의 분리를 유발한다. 본 연구에서는 내열합금 시편 표면에 작은 홀을 가공하여 여러 가지 고온 유지 조건에서 열 및 기계적 피로 시험을 수행하여 홀 주위의 산화막의 변형을 관찰하였다. 실험결과 기계적 피로가 홀 주위의 산화막의 변형에 중요한 영향을 미치며, 동일한 산화막 두께에서 고온 유지 시간이 짧을수록 변형이 쉽게 발생 하였다. 또한 본 연구에서는 홀 주위 산화막의 응력해석을 위한 이론적인 연구도 시도되었다.

• Journal of Welding and Joining
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• 제29권1호
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• pp.46-51
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• 2011

TSV technology raises several reliability concerns particularly caused by thermally induced stress. In traditional package, the thermo-mechanical failure mostly occurs as a result of the damage in the solder joint. In TSV technology, however, the driving failure may be TSV interconnects. In this study, the thermomechanical reliability of TSV technology is investigated using finite element method. Thermal stress and thermal fatigue phenomenon caused by repetitive temperature cycling are analyzed, and possible failure locations are discussed. In particular, the effects of via size, via pitch and bonding pad on thermo-mechanical reliability are investigated. The plastic strain generally increases with via size increases. Therefore, expected thermal fatigue life also increase as the via size decreases. However, the small via shows the higher von Mises stress. This means that smaller vias are not always safe despite their longer life expectancy. Therefore careful design consideration of via size and pitch is required for reliability improvement. Also the bonding pad design is important for enhancing the reliability of TSV structure.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회A
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• pp.11-16
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• 2007

The existence of grooves on the surface of bond coat has significant effect on the instability of thermal barrier system. In this work, the thermal-mechanical fatigue experiments were performed under various thermal and mechanical loads for FeCralloy specimens with and without yttrium dopant to observe the deformation of surface grooves. The effect of temperature, fatigue load and the ratio of curvature on the deformation of grooves were investigated. As the results, it has been found that the higher load level and the higher curvature ratio induces the larger deformation near the grooves. However, the addition of yittrium dopant induces the adverse results.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.9-15
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt. %). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in tile content of filler brought about the increase of Tg$^{DSC}$ and Tg$^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significant affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.ers.

• 마이크로전자및패키징학회지
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• 제7권1호
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• pp.41-49
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.