• Smart Structures and Systems
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• v.24 no.1
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• pp.111-125
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• 2019

Metallic shape memory alloys present fascinating physical properties such as their super-elastic behavior in austenite phase, which can be exploited for providing a structure with both a self-centering capability and an increased ductility. More or less accurate numerical models have been introduced to model their behavior along the last 25 years. This is the reason for which the literature is rich of suggestions/proposals on how to implement this material in devices for passive and semi-active control. Nevertheless, the thermo-mechanical coupling characterizing the first-order martensite phase transformation process results in several macroscopic features affecting the alloy performance. In particular, the effects of day-night and winter-summer temperature excursions require special attention. This aspect might imply that the deployment of some devices should be restricted to indoor solutions. A further aspect is the dependence of the behavior from the geometry one adopts. Two fundamental lacks of symmetry should also be carefully considered when implementing a SMA-based application: the behavior in tension is different from that in compression, and the heating is easy and fast whereas the cooling is not. This manuscript focuses on the passive devices recently proposed in the literature for civil engineering applications. Based on the challenges above identified, their actual feasibility is investigated in detail and their long term performance is discussed with reference to their fatigue life. A few available semi-active solutions are also considered.

• Computers and Concrete
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• v.23 no.5
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• pp.321-327
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• 2019

Experimental isotherm compressive tests show that concrete behaviour is dependent on temperature. The aim of such tests is to reproduce how concrete will behave under environmental changes within a moderate range of temperature. In this paper, a novel constitutive elastic damage behaviour law is proposed based on a free energy with an apparent damage depending on temperature. The proposed constitutive behaviour leads to classical theory of thermo-elasticity at small strains. Fixed elastic mechanical characteristics and fixed evolution law of damage independent of temperature and the material volume element size are considered. This approach is applied to compressive tests. The model predicts compressive strength and secant modulus of elasticity decrease as temperature increases. A power scaling law is assumed for specific entropy as function of the specimen size which leads to a volume size effect on the stress-strain compressive behaviour. The proposed model reproduces theoretical and experimental results from literature for tempertaures ranging between $20^{\circ}C$ and $70^{\circ}C$. The effect of the difference in the coefficient of thermal expansion between the mortar and coarse aggregates is also considered which gives a better agreement with FIB recommendations. It is shown that this effect is of a second order in the considered moderate range of temperature.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.14 no.2
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• pp.592-597
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• 2013

The heat generated at the motor and inverter inside the electric compressor of inverter built-in type is mainly cooled by refrigerant and generally, there is not a thermal problem. However, the close relation of heat transfer from the motor and inverter parts to the compression part affects on compressor efficiency. Also, according to the surrounding environment and system operation condition, the increased temperature of the motor and inverter can affect the power density of the motor system, and especially, the inverter may be prevented to operate by the temperature limits. In this study, we performed thermo-flow analysis of electric compressor motor system, and investigated the heat dissipation enhancement of the motor and inverter. The motor part in the operation region of the electric compressor was generally maintained at low temperature and the inverter part at high compressor speed was lower temperature than the temperature limit of $85^{\circ}C$. However, the case of the inverter at low speed harsh condition was in excess of $10^{\circ}C$. Therefore, in order to solve the thermal problem, the heat reduction technology of the motor and inverter is essential as well as the improvement of flow path in the compressor.

• Journal of Korean Tunnelling and Underground Space Association
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• v.17 no.3
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• pp.319-332
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• 2015

The pressure wave formed by the piston effects of the train proceeds within the tunnel when a train enters the tunnel with a high speed. Depending on the condition of tunnel exit, the compression waves reflect at a open end, change to the expansion waves, transfer to tunnel entrance back. Due to interference in the pressure waves and running train, passengers experience severe pressure fluctuations. And these pressure waves result in energy loss, noise, vibration, as well as in the passengers' ears. In this study, we performed comparison between numerical analysis and field experiments about the characteristics of the pressure waves transport in tunnel that appears when the train enter a tunnel and the variation of pressure penetrating into the train staterooms according to blockage ratio of train. In addition, a comparative study was carried out with the ThermoTun program to examine the applicability of the compressible 1-D model(based on the Method of Characteristics). Furthermore examination for the adequacy of the governing equations analysis based on compressible 1-D numerical model by Baron was examined.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.2 s.31
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• pp.23-28
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• 2004

We utilized Ag capping layer for fluxless bonding. To investigate the effect of Ag capping layer, two sets of sample were used. One set was bare In and Sn solders. The other set was In and Sn solders with Ag capping layer. In ($10{\mu}m$) and Sn ($10{\mu}m$) solders were deposited on Cu/Ti/Si substrate using thermal-evaporation, and Ag ($0.1{\mu}m$) capping layers were deposited on In and Sn solders. Solder joints were made by joining two In and Sn deposited specimens at $130^{\circ}C$ for 30 s under 0.8, 1.6, 3.2 MPa using thermal compression bonder. The contact resistance was measured using four-point probe method. The shear strength of the solder joints was measured by the shear test of cross-bar sample in the direction. The microstructure of the solder joints was characterized with SEM and EDS. In and Sn solders without Ag capping layers were only bonded at $130^{\circ}C$ under high bonding pressure. Also the shear strength of the In-Sn solder joints under was lower than that of the Ag/In-Ag/Sn solder joints. The resistance of the solder joints was $2-4\;m{\Omega}$ The solder joints consisted of In-rich phase and Sn-rich phase and the intermixed compounds were found at the interface. As bonding pressure increased, the intermixed compounds formed more.

• Transactions of the KSME C: Technology and Education
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• v.3 no.4
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• pp.265-271
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• 2015

The bonding process should be achieved in vacuum environment to avoid air bubble. In this study, we studied about pressure uniformity that became an issue in thermo compression bonding usually. Uniform press is realized by the method that use air spring and metal form spring. The concept of uniform press using air spring is removed except pressing direction in the press processing so angle between the vector of pressure surface and the pressure axis is parallel automatically. Air spring compensate the errors of machining and assembly. Metal form compensate the thermal deformation and flatness error.

• Polymer(Korea)
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• v.36 no.6
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• pp.761-767
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• 2012

The polycarbonate (PC)-based optical diffusers for direct-lit LED backlight unit were prepared by using extrusion compounding followed by compression molding process. The application of inorganic porous silica particles as a diffusing agent in addition to conventional poly(methyl methacrylate) (PMMA) beads was attempted, and the optical, thermal, and mechanical properties of the prepared diffusers were investigated. The morphological observations revealed that the diffusing agents could be uniformly dispersed in the PC matrix without agglomeration by high shear stress generated during extrusion process. The incorporation of the porous silica particles mixed with PMMA beads remarkably enhanced the luminance uniformity with respect to both location and view angle for the diffuser, while minimizing the reduction in the absolute luminance, as compared with the diffuser containing only PMMA beads. In addition, thermal and mechanical properties of the diffusers were shown to be improved upon addition of the porous silica particles.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.61-66
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• 2010

Cu-Cu thermo-compression bonding process was successfully developed as functions of the deposited Cu thickness and $Ar+H_2$ forming gas annealing conditions before and after bonding step in order to find the low temperature bonding conditions of 3-D integrated technology where the interfacial toughness was measured by 4-point bending test. Pre-annealing with $Ar+H_2$ gas at $300^{\circ}C$ is effective to achieve enough interfacial adhesion energy irrespective of Cu film thickness. Successful Cu-Cu bonding process achieved in this study results in delamination at $Ta/SiO_2$ interface rather than Cu/Cu interface.

• Korea-Australia Rheology Journal
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• v.19 no.4
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• pp.183-190
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• 2007

Injection molding is one of the most common operations in polymer processing. Good quality products are usually obtained and major post-processing treatment is not required. However, residual stresses which exist in plastic parts affect the final shape and mechanical properties after ejection. Residual stresses are caused by polymer melt flow, pressure distribution, non-uniform temperature field, and density distribution. Residual stresses are predicted in this study by numerical methods using commercially available softwares, $Hypermesh^{TM},\;Moldflow^{TM}\;and\;ABAQUS^{TM}$. Cavity filling, packing, and cooling stages are simulated to predict residual stress field right after ejection by assuming an isotropic elastic solid. Thermo-viscoelastic stress analysis is carried out to predict deformation and residual stress distribution after annealing of the part. Residual stresses are measured by the hole drilling method because the automotive part selected in this study has a complex shape. Residual stress distribution predicted by the thermal stress analysis is compared with the measurement results obtained by the hole drilling method. The molded specimen has residual stress distribution in tension, compression, and tension from the surface to the center of the part. Viscoelastic deformation of the part is predicted during annealing and the deformed geometry is compared with that measured by a three dimensional scanner. The viscoelastic stress analysis with a thermal cycle will enable us to predict long term behavior of the injection molded polymeric parts.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.35-41
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• 2015

In this study, in order to improve the reliability of ACF interconnections, solder ACF joints were investigated interms of solder joint morphology and solder wetting areas, and evaluated the electrical properties of Flex-on-Board (FOB) interconncections. Solder ACF joints with the ultrasonic bonding method showed excellent solder wetting by broken solder oxide layers on solder surfaces compared with solder joints with remaining solder oxide layer bonded by the conventional thermo-compression (TC) bonding method. When higher target temperature was used, Sn58Bi solder joints showed concave shape due to lower degree of cure of resin at solder MP by higher heating rate. ACFs with epoxy resins and SAC305 solders showed lower degree of resin cure at solder MP due to the slow curing rate resulting in concave shaped solder joints. In terms of solder wetting area, solder ACFs with $25-32{\mu}m$ diameters and 30-40 wt% showed highest wetted solder areas. Solder ACF joints with the concave shape and the highest wetting area showed lower contact resistances and higher reliability in PCT results than conventional ACF joints. These results indicate that solder morphologies and wetting areas of solder ACF joints can be controlled by adjustment of bonding conditions and material properties of solder and polymer resin to improve reliability of ACF joints.