• Title/Summary/Keyword: Thermo Electric Module

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구간 분할된 형상기억합금 와이어의 동특성에 관한 연구 (A Study of Dynamic Characteristics of Segmented Shape Memory Alloy Wire)

  • 정상화;김주환;김광호;이상희;신상문
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2006년도 춘계학술대회 논문집
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    • pp.329-330
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    • 2006
  • The research and development of an actuator are accelerating in the robotics industry. The electricity polymer and SMA actuator are designed simply and are produced a lot of forces per unit volume. Their motions are similar to human's motion, But the repeatability of the electricity polymer actuator is lower. The reaction velocity of the SMA actuator is slow and the travel is short. In this paper, the dynamic characteristic of the segmented SMA is studied. The SMA wire is divided by using the Thermo-electric module(TEM) to control each of segments independently. The MOSFET circuit is used to supply constant currents fer the Thermo-electric module(TEM). The hysteresis and displacement of the SMA wire according to load are measured.

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구간분할 제어를 이용한 로봇핸드의 동특성에 관한 연구 (A Study on the Dynamic Characteristics of Robot Hand based on Segmented Control)

  • 정상화;김현욱;최석봉;박준호;김광호
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2005년도 추계학술대회 논문집
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    • pp.310-313
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    • 2005
  • In recent years, as the robot technology is developed, the researches on the artificial muscle actuator that enable robot to move dexterously like biological organ become active. The widely used materials for artificial muscle are the shape memory alloy and the electro-active polymer. These actuators have the higher energy density than the electro-mechanical actuator such as motor. However, there are some drawbacks for actuator. SMA has the hysterical dynamic characteristics. In this paper, the simulation of anthropomophic robotic hand is performed using ADAMS and the segmented binary control for reducing the hysteresis of SMA is proposed. SMA is controlled by thermo-electric module. The relations between the force and the hysteresis are developed to verify the validity of the suggested method.

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A Thermo chemical Study of Arcjet Thruster Flow Field

  • J-R. Shin;S. Oh;Park, J-Y
    • 한국추진공학회:학술대회논문집
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    • 한국추진공학회 2004년도 제22회 춘계학술대회논문집
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    • pp.257-261
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    • 2004
  • Computational fluid dynamics analysis was carried out for thermo-chemical flow field in Arcjet thruster with mono-propellant Hydrazine ($N_2$H$_4$) as a working fluid. The theoretical formulation is based on the Reynolds Averaged Navier-Stokes equations for compressible flows with thermal radiation. The electric potential field governed by Maxwell equation is loosely coupled with the fluid dynamics equations through the Ohm heating and Lorentz force. Chemical reactions were assumed being infinitely fast due to the high temperature field inside the arcjet thruster. An equilibrium chemistry module for nitrogen-hydrogen mixture and a thermal radiation module for optically thin media were incorporated with the fluid dynamics code. Thermo-physical process inside the arcjet thruster was understood from the flow field results and the performance prediction shows that the thrust force is increased by amount of 3 times with 0.6KW arc heating.

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전기자동차 파워모듈용 질화규소 기판의 열기계적 특성 및 열응력 해석에 대한 연구 (A Study of Thermo-Mechanical Behavior and Its Simulation of Silicon Nitride Substrate on EV (Electronic Vehicle)'s Power Module)

  • 서원;정청하;고재웅;김구성
    • 반도체디스플레이기술학회지
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    • 제18권4호
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    • pp.149-153
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    • 2019
  • The technology of electronic packaging among semiconductor technologies is evolving as an axis of the market in its own field beyond the simple assembly process of the past. In the field of electronic packaging technology, the packaging of power modules plays an important role for green electric vehicles. In this power module packaging, the thermal reliability is an important factor, and silicon nitride plays an important part of package substrates, Silicon nitride is a compound that is not found in nature and is made by chemical reaction between silicon and nitrogen. In this study, this core material, silicon nitride, was fabricated by reaction bonded silicon nitride. The fabricated silicon nitride was studied for thermo-mechanical properties, and through this, the structure of power module packaging was made using reaction bonded silicon nitride. And the characteristics of stress were evaluated using finite element analysis conditions. Through this, it was confirmed that reaction bonded silicon nitride could replace the silicon nitride as a package substrate.

PWM 전류제어와 펠티어 소자를 이용한 알루미늄 판의 온도 제어 (Temperature Control of the Aluminum Plate with Pottier Module by PWM Current Control)

  • 방두열;권대규;이성철
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2005년도 추계학술대회 논문집
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    • pp.897-900
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    • 2005
  • This paper presents temperature control of aluminum plate using Peltier module. As one of the thermoelectric effect, Peltier effect is heat pumping phenomena by electric energy. So if current is charged to Peltier module, it absorbs heat from low temperature side and emits heat to high temperature side. In this experiment, Peltier module is used to control the temperature of small aluminum plate with heating and cooling ability of Peltier module with current control and fan On/OFF control. And current control of Peltier module was accomplished by PWM method. As a results of experiments, it takes about 125sec to control temperature of aluminium plate between $30^{\circ}C\;and\;70^{\circ}C$ and about 70sec between $40^{\circ}C\;and\;60^{\circ}C$, in ambient temperature $29^{\circ}C$ while operating cooling fan only while cooling duration. Future aim is to realize more rapid temperature control and develop SMHA(special metal hydride actuator) by using Peltier module as a heating and cooling source.

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펠티어 소자를 이용한 냉방모듈 성능해석 (Performance Analysis of Cooling Module using Peltier Elements)

  • 한철희
    • 융복합기술연구소 논문집
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    • 제1권1호
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    • pp.5-8
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    • 2011
  • Thermal analysis of a cooling module using Peltier elements are performed using a commercial software, CFD-ACE+. A standard k-e two-equation turbulent model is applied in order to represent the turbulent shear stress. Computed values are compared with the theoretical values for the validation. The effect of mass flow rates and transferred heat amounts on the temperature distributions inside the cooling system is analyzed. It was found that the increase in the mass flow rates causes the exit temperature rise. The increase in the absorbed heat amount diminished the overall temperature on the fin surfaces. In the present analysis, the material characteristics of the Peltier element itself are not considered. In the future, the effect of the turbulence models and material characteristics will be studied in detail.

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비냉각 검출기를 이용한 소화기용 저전력 열상모듈 설계 (Low Power IR Module Design for Small Arms Using Un-cooled Type Detector)

  • 성기열;곽동민;곽기호;김도종;유준
    • 한국군사과학기술학회지
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    • 제10권4호
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    • pp.138-144
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    • 2007
  • This paper introduces the design techniques of an IR module using the 2-D array un-cooled type infrared detector which is applied to the individual combat weapon. Considering the size and weight of the hand carried weapon system, we used a very small-sized detector and applied an adaptive temperature control algorithm so that the operation consumed with low power can be possible. We applied the AR(Auto Regressive) filter to improve the signal-to-noise ratio in a thermal image processing step. We also applied the plateau equalization and boundary enhancement techniques to improve the visibility for human visual system.

Numerical Prediction of Solder Fatigue Life in a High Power IGBT Module Using Ribbon Bonding

  • Suh, Il-Woong;Jung, Hoon-Sun;Lee, Young-Ho;Choa, Sung-Hoon
    • Journal of Power Electronics
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    • 제16권5호
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    • pp.1843-1850
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    • 2016
  • This study focused on predicting the fatigue life of an insulated gate bipolar transistor (IGBT) power module for electric locomotives. The effects of different wiring technologies, including aluminum wires, copper wires, aluminum ribbons, and copper ribbons, on solder fatigue life were investigated to meet the high power requirement of the IGBT module. The module's temperature distribution and solder fatigue behavior were investigated through coupled electro-thermo-mechanical analysis based on the finite element method. The ribbons attained a chip junction temperature that was 30℃ lower than that attained with conventional round wires. The ribbons also exhibited a lower plastic strain in comparison with the wires. However, the difference in plastic strain and junction temperature among the different ribbon materials was relatively small. The ribbons also exhibited different crack propagation behaviors relative to the wires. For the wires, the cracks initiated at the outmost edge of the solder, whereas for the ribbons, the cracks grew in the solder layer beneath the ribbons. Comparison of fatigue failure areas indicated that ribbon bonding technology could substantially enhance the fatigue life of IGBT modules and be a potential candidate for high power modules.

한국형 달 탐사용 원자력전지의 열제어 구조 연구 (Study on the Thermal Design of Nuclear Battery for Lunar Mission)

  • 홍진태;손광재;김종범;박종한;안동규;양동열
    • 한국정밀공학회지
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    • 제33권4호
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    • pp.271-277
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    • 2016
  • For a stable electric power supply in the space, nuclear batteries have been used as the main power source in a spacecraft owing to their long lifetime and high reliability. In accordance with the plan for lunar mission in Korea, nuclear batteries will supply electricity to the rover that needs to be developed. According to the information about the estimated payload, Korea Atomic Energy Research Institute started with the conceptual design based on the previous studies in USA and Russia. Because a nuclear battery converts the decay heat of the radioisotope into electricity, thermal design, radiation shield, and shock protection need to be considered. In this study, two types of nuclear batteries, radial type and axial type, were designed according to the alignment of the thermoelectric module. Heat transfer analyses were performed to compare their thermoelectric efficiency, and test mockups were fabricated to evaluate their performances.