• Journal of Power Electronics
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• v.9 no.4
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• pp.544-552
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• 2009

This paper presents a novel spring pressure contact interconnect technique for medium power integrated power electronics modules (IPEMs). The key technology of this interconnection is a spring which is made from Be-Cu alloy. By means of the string pressure contact, sufficient press-contact force and good electrical interconnection can be achieved. Another important advantage is that the spring exhibits excellent performance in enduring thermo-mechanical stress. In terms of manufacture procedure, it is also comparatively simple. A 4 kW half-bridge power inverter module is fabricated to demonstrate the performance of the proposed pressure contact technique. Electrical, thermal and mechanical test results of the packaged device are reported. The results of both the simulation and experiment have proven that a good performance can be achieved by the proposed pressure contact technique for the medium power IPEMs.

• The Transactions of the Korean Institute of Electrical Engineers P
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• v.58 no.1
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• pp.67-71
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• 2009

This research is a new structure of the semiconductor substrate heating apparatus in which the assembly and expansion are possible. The fast thermo-responsive according to the direct heating structure of the heating plate layer adhering closely to the floor side of a substrate and the fast heat loss minimization can be accomplished. Moreover, the contact area of the sheath heater, which is the heating plate layer built-in heating apparatus, is increased, so that it has more heating valid area. There is no problem with the deformation interpreted in the state where it assembles the block of a several of the simulation result structure, the safety, and the stress. In addition, it is confirmed that building a large-size heating block is possible since the temperature deflection of the manufactured plate is lower than the standard value.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.2
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• pp.43-50
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• 2009

Although thin PCBs(Printed Circuit Boards) have recently been required for high density interconnection, high electrical performance, and low manufacturing cost, the utilization of thin PCBs is severely limited by warpage and reliability issues. Warpage of the thin PCB leads to failure in solder-joints and chip. The $B^2it$(Buried Bump Interconnection Technology) for PCB has been developed to achieve a competitive manufacturing price. In this study, chip temperature, package warpage, chip stress and solder-joints stress characteristics of the PCB prepared with $B^2it$ process have been calculated using thermo-mechanical coupled analysis by the FEM(Finite Element Method). FEM computation was carried out with the variations in bump shapes and kinds of materials under 1.5W power of chip and constant convection heat transfer. The results show that chip temperature distribution reached more quickly steady-state status with PCB prepared with $B^2it$ process than PCB prepared with conventional via interconnection structure. Although $B^2it$ structures are effective on low package warpage and chip stress, with high strength bump materials arc disadvantage for low stress of solder-joints. Therefore, it is recommended that optimized bump shapes and materials in PCB design should be considered in terms of reliability characteristics in the packaging level.

• Structural Engineering and Mechanics
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• v.58 no.5
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• pp.931-947
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• 2016

The effects of nanotechnology and smartness on the buckling reduction of pipes are the main contributions of present work. For this ends, the pipe is simulated with classical piezoelectric polymeric cylindrical shell reinforced by armchair double walled boron nitride nanotubes (DWBNNTs), The structure is subjected to combined electro-thermo-mechanical loads. The surrounding elastic foundation is modeled with a novel model namely as orthotropic nonhomogeneous Pasternak medium. Using representative volume element (RVE) based on micromechanical modeling, mechanical, electrical and thermal characteristics of the equivalent composite are determined. Employing nonlinear strains-displacements and stress-strain relations as well as the charge equation for coupling of electrical and mechanical fields, the governing equations are derived based on Hamilton's principal. Based on differential quadrature method (DQM), the buckling load of pipe is calculated. The influences of electrical and thermal loads, geometrical parameters of shell, elastic foundation, orientation angle and volume percent of DWBNNTs in polymer are investigated on the buckling of pipe. Results showed that the generated ${\Phi}$ improved sensor and actuator applications in several process industries, because it increases the stability of structure. Furthermore, using nanotechnology in reinforcing the pipe, the buckling load of structure increases.

• Proceedings of the KIEE Conference
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• 2003.07c
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• pp.1436-1438
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• 2003

In this paper thermal and mechanical properties of elastic epoxy for applying high voltage products were investigated. Glass transition temperature(Tg) of elastic epoxies can't find form room temperature to $200^{\circ}$ by DSC. It occurred weight reduce on $285^{\circ}$ and $451^{\circ}$ by thermo-gravimeter. The first temperature was effected on addictives and the other was epoxy's character. Max, tensile strain showed $28.3kgf/cm^2$ at 20% of mechanical stress in addictives 35phr. SEM micrograph of the fracture surface observed in void and tearing of elastic epoxy at addictives 35phr. The other side, SEM micrograph of rigid epoxy showed the trace which broke.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.361-361
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• 2009

KEPCO High Temperature Superconducting (HTS) cable system rated with $3\Phi$, 22.9kV, 1250A was laid in 2006, and the long term test is in progress. The HTS cable system with the cooling system has been operated below cryogenic temperature. That environment exposes the system to the thermo-mechanical stress due to the significant temperature difference, and the cooling system has moving parts for the forced circulation of the coolant. Therefore the HTS cable system experiences thermal fatigue and moving part such as liquid nitrogen pump need a regular replacement every 5000 hours Building the assessment criterion, the maintenance procedure was established and regular preventive maintenance was done; improvement of the termination structure and the replacement of the bearing of liquid nitrogen pump. Following the proper process, the reliability assessment test including He leakage detection and the stability of flow rate was performed. This paper describes the process and result of the first regular maintenance of KEPCO HTS cable system

• Steel and Composite Structures
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• v.33 no.1
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• pp.93-109
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• 2019

In the present study, vibration analysis of double bonded micro sandwich cylindrical shells with saturated porous core and carbon/boron nitride nanotubes (CNT/BNNT) reinforced composite face sheets under multi-physical loadings based on Cooper-Naghdi theory is investigated. The material properties of the micro structure are assumed to be temperature dependent, and each of the micro-tubes is placed on the Pasternak elastic foundations, and mechanical, moisture, thermal, electrical, and magnetic forces are effective on the structural behavior. The distributions of porous materials in three distributions such as non-linear non-symmetric, nonlinear-symmetric, and uniform are considered. The relationship including electro-magneto-hydro-thermo-mechanical loadings based on modified couple stress theory is obtained and moreover the governing equations of motion using the energy method and the Hamilton's principle are derived. Also, Navier's type solution is also used to solve the governing equations of motion. The effects of various parameters such as material length scale parameter, temperature change, various distributions of nanotube, volume fraction of nanotubes, porosity and Skempton coefficients, and geometric parameters on the natural frequency of double bonded micro sandwich cylindrical shells are investigated. Increasing the porosity and the Skempton coefficients of the core in micro sandwich cylindrical shell lead to increase the natural frequency of the structure. Cylindrical shells and porous materials in the industry of filters and separators, heat exchangers and coolers are widely used and are generally accepted today.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.