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An Assemble and Expandable Substrate Heating Apparatus for the Semiconductor Manufacturing  

Jung, Soon-Won (ETRI 융합부품.소재연구부문)
Koo, Kyung-Wan (호서대학교 국방과학기술학과)
Publication Information
The Transactions of the Korean Institute of Electrical Engineers P / v.58, no.1, 2009 , pp. 67-71 More about this Journal
Abstract
This research is a new structure of the semiconductor substrate heating apparatus in which the assembly and expansion are possible. The fast thermo-responsive according to the direct heating structure of the heating plate layer adhering closely to the floor side of a substrate and the fast heat loss minimization can be accomplished. Moreover, the contact area of the sheath heater, which is the heating plate layer built-in heating apparatus, is increased, so that it has more heating valid area. There is no problem with the deformation interpreted in the state where it assembles the block of a several of the simulation result structure, the safety, and the stress. In addition, it is confirmed that building a large-size heating block is possible since the temperature deflection of the manufactured plate is lower than the standard value.
Keywords
Substrate Heating Apparatus; Direct Heating; Sheath Heater; Heating Plate;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
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