• 한국안전학회지
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• 제34권4호
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• pp.1-5
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• 2019

In the field of combined cycle power generation, thermal barrier coating(TBC) protects the super-heat-resistant alloy, which forms the core component of the gas turbine, from high temperature exposure. As the turbine inlet temperature(TIT) increases, TBC is more important and durability performance is also important when considering maintenance cost and safety. Therefore, studies have been made on the fabrication method of TBC and super-heat-resistant alloy in order to improve the performance of the TBC. In recent years, due to excellent properties such as high temperature creep resistance and high temperature strength, turbine blade material have been replaced by a single crystal superalloy, however there is a lack of research on TBC applied to single crystal superalloy. In this study, to understand the isothermal degradation performance of the TBC applied to the single crystal superalloy, isothermal exposure test was conducted at various temperature to derive the delamination life. The growth curve of thermally grown oxide(TGO) layer was predicted to evaluate the isothermal degradation performance. Also, microstructural analysis was performed by scanning electron microscope(SEM) and energy dispersive X-ray spectroscopy (EDS) to determine the effect of mixed oxide formation on the delamination life.

• Korean Chemical Engineering Research
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• 제46권2호
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• pp.408-413
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• 2008

본 연구에서는 5nm 이하의 실리콘 산화박막 성장을 위하여 저압급속열산화법과 플라즈마확산산화법을 사용하여, 실리콘 산화박막의 성장특성을 분석하였다. 저압급속열산화법으로 기판의 온도와 산소기체의 유량 변화에 따른 실리콘 산화박막의 성장은 공정시간 5분이 경과 할 때 까지 급격한 증가를 보이다 성장 속도가 포화되는 특성을 나타내었다. 또한 $900^{\circ}C$에서 5 nm의 최대 두께를 가진 산화박막을 얻을 수 있었다. 플라즈마확산산화법은 기판의 온도와 압력은 $500^{\circ}C$, 200 mTorr으로 고정했을 때, 플라즈마 세기와 산소기체의 유량이 증가할수록 산화박막의 성장속도는 증가하였다. 보통 4분이 경과한 후 성장속도가 포화영역에 도달하여 산화막의 두께가 거의 일정하게 되는 것을 알 수 있었다. 저압급속열산화법에 의해 성장된 산화박막은 일반열산화법에 의해 제조된 산화박막의 특성과 거의 같았다.

• 한국재료학회지
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• 제20권7호
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• pp.356-363
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• 2010

For this paper, we investigated the area specific resistance (ASR) of commercially available ferritic stainless steels with different chemical compositions for use as solid oxide fuel cells (SOFC) interconnect. After 430h of oxidation, the STS446M alloy demonstrated excellent oxidation resistance and low ASR, of approximately 40 $m{\Omega}cm^2$, of the thermally grown oxide scale, compared to those of other stainless steels. The reason for the low ASR is that the contact resistance between the Pt paste and the oxide scale is reduced due to the plate-like shape of the $Cr_2O_3$(s). However, the acceptable ASR level is considered to be below 100 $m{\Omega}cm^2$ after 40,000 h of use. To further improve the electrical conductivity of the thermally grown oxide on stainless steels, the Co layer was deposited on the stainless steel by means of an electroless deposition method; it was then thermally oxidized to obtain the $Co_3O_4$ layer, which is a highly conductive layer. With the increase of the Co coating thickness, the ASR value decreased. For Co deposited STS444 with 2 ${\mu}m$hickness, the measured ASR at $800^{\circ}$ after 300 h oxidation is around 10 $m{\Omega}cm^2$, which is lower than that of the STS446M, which alloy has a lower ASR value than that of the non-coated STS. The reason for this improved high temperature conductivity seems to be that the Mn is efficiently diffused into the coating layer, which diffusion formed the highly conductive (Mn,Co)$_3O_4$ spinel phases and the thickness of the $Cr_2O_3$(S), which is the rate controlling layer of the electrical conductivity in the SOFC environment and is very thin

• 한국정보통신학회:학술대회논문집
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• 한국해양정보통신학회 1998년도 추계종합학술대회
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• pp.165-168
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• 1998

Re-oxidized nitrided oxides which have been investigated as alternative gate oxide for Metal- Oxide -Semiconductor field effect devices were grown by conventional furnace process using pure NH$_3$ and dry $O_2$ gas, and were characterized via a Fowler-Nordheim Tunneling electron injection technique. We studied Ig-Vg characteristics, leakage current, $\Delta$Vg under constant current stress from electrical characteristics point of view and TDDB from reliability point of view of MOS capacitors with SiO$_2$, NO, ONO dielectrics. Also, we studied the effect of stress temperature (25, 50, 75, 100, and 1$25^{\circ}C$). Overall, our results indicate that optimized re-oxidized nitrided oxide shows improved Ig-Vg characteristics, leakage current over the nitrided oxide and SiO$_2$. It has also been shown that re-oxidized nitrided oxide have better TDDB performance than SiO$_2$ while maintaining a similar temperature and electric field dependence. Especially, the Qbd is increased by about 1.5 times.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1989년도 하계종합학술대회 논문집
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• pp.359-363
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• 1989

Recently, it is reported that the behavior of thermal $SiO_2$ under high electric field and current condition has a major effect on MOS device degration. Furthermore, when thin oxide films are applied in practical device, the presence of oxide defects will be a serious problem. In this paper, because TDDB is the useful method to measure the effective density of defects, we stressed MOS structure that is 150 A of thermally grown $SiO_2$as a function of electric field (9-19 MV/cm), temperature ($22^{\circ}C$ - $150^{\circ}C$) and current. By examing TDDB under positive voltage, long-term oxide breakdown reliabiliy is described. From these data, breakdown wearout limitation for the oxide films can be characterized.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1988년도 추계학술대회 논문집 학회본부
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• pp.193-195
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• 1988

The native oxide films were thermally and anodically formed on the n-GaP substrates grown by SSD method and measured this oxide thickness and the chemical composition and the electrical properties with formation condition. The chemical composition of themally oxidized GaP film was composed of mostly $GaPO_4$ at temperature below $800^{\circ}C$ and mostly $\beta-Ga_{2}O_{3}$ above $800^{\circ}C$. But The chemical composition of anodically oxidized GaPfilm was composed of the mixture of $Ga_{2}O_{3}$ and $P_{2}O_{5}$. The barrier height of Al/oxide/n-Gap which was formed at $700^{\circ}C$ by thermal oxidation method were 1.10eV, 1.03eV in Current-Voltage measurement. Interface charge density were $4{\times}10^{12}q(C/cm^2)$ and $3{\times}10^{12}q(C/cm^2)$ in Capacitance-Voltage measurement respectively.

• 전자공학회논문지A
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• 제33A권7호
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• pp.149-155
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• 1996

A new technique wasdeveloped which obtains selectively the htick fully recessed oxidized porous silicon layer (OPSL) with good dielectric property. The porous silicon layer was ocnverted to thick fully recessed oxide (FRO) with 3-step (1${\mu}$m, 1.5${\mu}$m, 1.8${\mu}$m) by multi-step thermal oxidation (after 400$^{\circ}$C, 1 hour by dry oxidation, 700$^{\circ}$C, 1 hour and then 1100$^{\circ}$C, 1 hour by wet oxidation). The breakdwon field of the FRO was about 2.5MV/cm and the leakage current was several pA ~ 100 pA in the range of 0 of 90 pF. The progress of oxidation of a porous silicon layer was studied by examining the infrared abosrption spectra. The refractive index (1.51) of the fRO, which was measured by ellipsometer, was comparable to that of the thermally grown silicon dioxide (1.46). The etching rate (1600${\AA}$/min) of the FRO was also almost equal to that of the thermal oxide.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2004년도 추계학술대회 논문집
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• pp.1344-1347
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• 2004

Recently, Study on measuring property of a micro thin film(nm ～ hundreds of ) under Thermal Mechanical loading. In this work, We perform tensile test at high temperature(1200 ) to investigate mechanical properties of alumina TGO formed under Thermal Barrier Coating. We used Digital Image Correlation method for measuring displacement, and We presented a method of tensile test for thin film at high temperature.

• 한국정보통신학회논문지
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• 제6권1호
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• pp.99-102
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• 2002

다결정 실리콘층 아래의, 게이트 산화막이라고 불리는 높은 온도에서 형성된 산화막에서 핀홀이 관찰되었으며 그 메카니즘이 분석되었다. 다결정 실리콘층 아래의 산화막은 다른 다결정 실리콘층의 플라즈마 에칭 과정 동안에 파괴되어진다. 두 개의 다결정 실리콘층은 CVD증착에 의해 만들어진 0.8$\mu\textrm{m}$의 두꺼운 산화막에 의해 분리되어 있다. 파괴된 산화막들이 아크가 발생한 부분을 중심으로 흩어져 있으며 아크가 발생한 부분에서 생성된 극도로 강한 전계가 게이트 산화막을 파괴 시켰다고 가정된다. 아크가 발생한 부분은 Alignment key에서 관찰되었고 그리고 이것이 발견된 웨이퍼는 낮은 수율을 보여주었다. 아크가 발생한 부분이 칩의 내부가 아니더라도 게이트 산화막의 파괴에 의해 칩이 정상적으로 동작하지 않았다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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• pp.207.2-207.2
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• 2013

Oxide-based thin film transistors have been attempted as powerful candidates for driving circuits for active-matrix organic light-emitting diodes and transparent electronics. The oxide TFTs are based on the amorphous multi-component oxides involving zinc, indium, and/or tin elements as main cation sources. The current work employed RF sputtering in order to deposit zinc-tin oxide thin films applicable to transparent oxide thin film transistors. The deposited thin film was characterized and probed in terms of materials and devices. The physical/chemical characterizations were performed using X-ray diffraction, Atomic Force Microscopy, Spectroscopic Ellipsometry, and X-ray Photoelectron Spectroscopy. The thin film transistors were fabricated using a bottom-gated structure where thermally-grown silicon oxide layers were applied as gate-dielectric materials. The inherent properties of oxide thin films are combined with the corresponding device performances with the aim to fabricating the multi-component oxide thin films being optimized towards transparent electronics.