A Study on The Degradation Characteristics of MLCCs SAC305 Lead-Free Solder Joints and Growth IMCs by Thermal Shock Test (열충격 시험을 통한 MLCCs SAC305 무연 솔더 접합부의 IMCs 성장과 접합특성 저하에 관한 연구)
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- Journal of the Korean Institute of Electrical and Electronic Material Engineers
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- v.29 no.3
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- pp.152-158
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- 2016