• Title/Summary/Keyword: Thermal thickness

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Prediction of Thermal conductivities of 3-D braided glass/epoxy composites using a thermal-electrical analogy (3차원 브레이드 유리섬유/에폭시 복합재료의 열전도도 예측에 관한 연구)

  • 정혁진;강태진;윤재륜
    • Proceedings of the Korean Society For Composite Materials Conference
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    • 2002.10a
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    • pp.52-55
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    • 2002
  • This paper examines the effective thermal conductivity of 3-D braided glass/epoxy composites. 3-D braided composites have a number of advantage over conventional laminate composites, including through-thickness reinforcement, and high damage tolerance and processability. The thermal properties of composites depend primarily on the microstructure of the braided preform and properties of constituent materials. A thermal resistance network model based on structure of the braided preform is proposed by using thermal-electrical analogy. In order to affirm the applicability theses solutions, thermal conductivities of 3-D braided glass/epoxy composites are measured

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Thermal post-buckling analysis of porous functionally graded pipes with initial geometric imperfection

  • Xu, Jia-Qin;She, Gui-Lin
    • Geomechanics and Engineering
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    • v.31 no.3
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    • pp.329-337
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    • 2022
  • In this paper, the thermal post-buckling characteristics of functionally graded (FG) pipes with initial geometric imperfection are studied. Considering the influence of initial geometric defects, temperature and geometric nonlinearity, Euler-Lagrange principle is used to derive the nonlinear governing equations of the FG pipes. Considering three different boundary conditions, the two-step perturbation method is used to solve the nonlinear governing equations, and the expressions of thermal post-buckling responses are also obtained. Finally, the correctness of this paper is verified by numerical analyses, and the effects of initial geometric defects, functional graded index, elastic foundation, porosity, thickness of pipe and boundary conditions on thermal post-buckling response are analyzed. It is found that, bifurcation buckling exists for the pipes without initial geometric imperfection. In contrast, there is no bifurcation buckling phenomenon for the pipes with initial geometric imperfection. Meanwhile, the elastic stiffness can significantly improve thermal post-buckling load and thermal post-buckling strength. The larger the porosity, the greater the thermal buckling load and the thermal buckling strength.

A Study on Bow of Silicon Solar Cell by Soldering Different Thickness of Ribbon (리본 두께에 따른 태양전지 Bowing현상 연구)

  • Yoon, Na-Ri;Jung, Tae-Hee;Shin, Jun-Oh;Kang, Ki-Hwan;Ahn, Hyeung-Ken;Han, Deuk-Young
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2010.06a
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    • pp.68-68
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    • 2010
  • To reduce PV manufacturing costs, the thickness of solar cell is getting thinner. Bow is shown after cooling down the temperature of solder cell. It happens because of different thermal expansion coefficients of different metals. Bowed cell can make micro crack while module processing and it can drop off efficiency of PV module. As thinner solar cell is produced, the thickness of ribbon should be concerned to prevent extra bow. In this paper we investigate the contrast of deflection when we solder different thickness of ribbons on same solar cell. This approach would help to find out the optical thickness of ribbon for particular thickness of solar cell later on.

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Thickness dependence of the piezoelectric characteristic for PZT films using by rf magnetron sputtering (RF 마그네트론 스퍼터링으로 증착한 두께에 따른 PZT 박막의 강유전 특성에 관한 연구)

  • Lee, Tae-Yong;Park, Young;Song, Joon-Tae
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.11a
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    • pp.313-316
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    • 2003
  • The lead zirconate titanate, $Pb(Zr_{0:52}Ti_{0:48})O_3$, films of $0.5\;{\mu}m,\;1\;{\mu}m$ and $2\;{\mu}m$ thickness were fabricated on $Pt/Ti/SiO_2/Si$ substrate by the rf magnetron sputtering method. The PZT films were annealed using by a rapid thermal annealing (RTA) method. The thickness dependence of the film structure, dielectric properties, Polarization-electric field hysteresis loops and capacitance-voltage characteristics were investigated over the thickness range of $0.5\;{\mu}m,\;1\;{\mu}m$ and $2\;{\mu}m$. According to the XRD patterns of the films, (110) peak intensity increases with film thickness increased. The increase of PZT films thickness leads to the decrease of the remanent polarization and the dielectric constant.

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Heat Dissipation Analysis of 12kV Diode by the Packaging Structure (12kV급 다이오드의 패키징 구조에 따른 방열 특성 연구)

  • Kim, Nam-Kyun;Kim, Sang-Cheol;Bahng, Wook;Song, Geun-Ho;Kim, Eun-Dong
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.07a
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    • pp.1092-1095
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    • 2001
  • Steady state thermal analysis has been done by a finite element method in a diode of 12kV blocking voltage. The diode was fabricated by soldering ten pieces of 1200V diodes in series, capping a dummy wafer at the far end of diode series, and finally wire bonded for building anode and cathode terminal. In order to achieve high voltage and reliability, the edge of each diode was beveled and passivated by resin with a thickness of 25${\mu}$m. It was assumed that the generated heat which is mainly by the on-state voltage drop, 9V for 12kV diode, is dissipated by way of the conduction through diodes layers to bonding wire and of the convection at the surface of passivating resin. It was predicted by the thermal analysis that the temperature rise of a pn junction of the 12kV diode can reach at the range of 16∼34$^{\circ}C$ under the given boundary conditions. The thickness and thermal conductivity(0.3∼3W/m-K) of the passivating resin did little effect to lower thermal resistance of the diode. As the length of the bonding wire increased, which means the distance of heat conduction path became longer, the thermal resistance increased considerably. The thermal analysis results imply that the generated heat of the diode is dissipated mainly by the conduction through the route of diode-dummy wafer-bonding wire, which suggests to minimize the length of the wire for the lowest thermal resistance.

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On the Thermal Boundary Conditions at the Interface Between the Porous Medium and the Impermeable Wall (다공성 매질과 비투과성 벽면 사이의 경계면에 대한 열적 경계 조건)

  • Kim, Deok-Jong;Kim, Seong-Jin
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.24 no.12
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    • pp.1635-1643
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    • 2000
  • The present work investigates a heat transfer phenomenon at the interface between a porous medium and an impermeable wall. In an effort to appropriately describe the heat transfer phenomenon at the interface, the heat transfer at the interface between the microchannel heat sink, which is an ideally organized porous medium, and the finite-thickness substrate is examined. From the examination, it is clarified that the he heat flux distribution at the interface is not uniform for the impermeable wall with finite thickness. On the other hand, the first approach, based on the energy balance for the representative elementary volume in the porous medium, is physically reason able. When the first approach is applied to the thermal boundary condition, and additional boundary condition based on the local thermal equilibrium assumption at the interface is used. This additional boundary condition is applicable except for the very th in impermeable wall. Hence, for practical situations, the first approach in combination with the local thermal equilibrium assumption at the interface is suggested as an appropriate thermal boundary condition. In order to confirm our suggestion, convective flows both in a microchannel heat sink and in a sintered porous channel subject to a constant heat flux condition are analyzed. The analytically obtained thermal resistance of the microchannel heat sink and the numerically obtained overall Nusselt number for the sintered porous channel are shown to be in close agreement with available experimental results when our suggestion for the thermal boundary conditions is applied.

Thermal buckling analysis of embedded graphene-oxide powder-reinforced nanocomposite plates

  • Ebrahimi, Farzad;Nouraei, Mostafa;Dabbagh, Ali;Rabczuk, Timon
    • Advances in nano research
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    • v.7 no.5
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    • pp.293-310
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    • 2019
  • In this paper, thermal-buckling behavior of the functionally graded (FG) nanocomposite plates reinforced with graphene oxide powder (GOP) is studied under three types of thermal loading once the plate is supposed to be rested on a two-parameter elastic foundation. The effective material properties of the nanocomposite plate are considered to be graded continuously through the thickness according to the Halpin-Tsai micromechanical scheme. Four types of GOPs' distribution namely uniform (U), X, V and O, are considered in a comparative way in order to find out the most efficient model of GOPs' distribution for the purpose of improving the stability limit of the structure. The governing equations of the plate have been derived based on a refined higher-order shear deformation plate theory incorporated with Hamilton's principle and solved analytically via Navier's solution for a simply supported GOP reinforced (GOPR) nanocomposite plate. Some new results are obtained by applying different thermal loadings to the plate according to the GOPs' negative coefficient of thermal expansion and considering both Winkler-type and Pasternak-type foundation models. Besides, detailed parametric studies have been carried out to reveal the influences of the different types of thermal loading, weight fraction of GOP, aspect and length-to-thickness ratios, distribution type, elastic foundation constants and so on, on the critical buckling load of nanocomposite plates. Moreover, the effects of thermal loadings with various types of temperature rise are investigated comparatively according to the graphical results. It is explicitly shown that the buckling behavior of an FG nanocomposite plate is significantly influenced by these effects.

Thermal-fluid-structure coupling analysis on plate-type fuel assembly under irradiation. Part-II Mechanical deformation and thermal-hydraulic characteristics

  • Li, Yuanming;Ren, Quan-yao;Yuan, Pan;Su, Guanghui;Yu, Hongxing;Zheng, Meiyin;Wang, Haoyu;Wu, Yingwei;Ding, Shurong
    • Nuclear Engineering and Technology
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    • v.53 no.5
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    • pp.1556-1568
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    • 2021
  • The plate-type fuel assembly adopted in nuclear research reactor suffers from complicated effect induced by non-uniform irradiation, which might affect stress conditions, mechanical behaviors and thermal-hydraulic performance of the fuel assembly. This paper is the Part II work of a two-part study devoted to analyzing the complex unique mechanical deformation and thermal-hydraulic characteristics for the typical plate-type fuel assembly under irradiation effect, which is on the basis of developed and verified numerical thermal-fluid-structure coupling methodology under irradiation in Part I of this work. The mechanical deformation, thermal-hydraulic performance and Mises stress have been analyzed for the typical plate-type fuel assembly consisting of support plates under non-uniform irradiation. It was interesting to observe that: the plate-type fuel assembly including the fuel plates and support plates tended to bend towards the location with maximum fission rate; the hot spots in the fuel foil appeared at the location with maximum thickness increment; the maximum Mises stress of fuel foil was located at the adjacent location with the maximum plate thickness increment et al.

Subjective Hand and Physical Properties of Tricot based Artificial Suede according to Raising Finish (기모가공 조건에 따른 트리코 기포 인조 스웨이드의 태와 물성)

  • Roh, Eui Kyung;Oh, Kyung Wha
    • Fashion & Textile Research Journal
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    • v.16 no.1
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    • pp.153-159
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    • 2014
  • This study evaluates the changes of the subjective hand, preference, comfort and mechanical properties of tricot based artificial suede made from sea-island type micro fibers according to raising condition. The subjective hand and the preference of raised suede for jacket were rated by the 20's and 30's women experts according to raising cycles. Comfort properties were evaluated by air permeability, water vapor transmission, and thermal transmission. Mechanical properties were measured by the KES-FB system. The subjective hand of artificial suede was categorized into three hand factors: smoothness, warmness and thickness. Smoothness, warmness and thickness perception increased with raising cycles which affected hand preference and luxuriousness perception. The thickness and wale density of suede increased with the number of raising. Suede became more compact and less pliable and less stretchable due to increased fabric thickness; in addition, the surface of suede became smoother and compressive since the surface evenness of suede improved with smaller fiber fineness and an increased amount of naps covered the base fabric. Furthermore, water vapor transmission decreased and thermal insulation increased. The best raising conditions for artificial suede was four cycles in which artificial suede was preferred without changes in physical properties.