• Title/Summary/Keyword: Thermal stresses

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Gene Structure and Altered mRNA Expression of Metallothionein in Response to Metal Exposure and Thermal Stress in Miho Spine Loach Cobitis choii (Cobitidae; Cypriniformes) (미호종개 metallothionein 유전자의 구조 및 중금속 노출과 고온 자극에 대한 MT mRNA의 발현 특징 분석)

  • Lee, Sang-Yoon;Nam, Yoon-Kwon
    • Korean Journal of Ichthyology
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    • v.23 no.1
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    • pp.61-69
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    • 2011
  • Gene and promoter structures of metallothionein(MT) from Miho spine loach (Cobitis choii; Cypriniformes) were characterized, and the transcriptional responses to experimental exposures to heavy metals and heat stress were examined. The C. choii metallothionein displayed well-conserved features of teleostean metallothioneins at gDNA, mRNA and amino acid levels. Bioinformatic analysis predicted that the C. choii MT regulatory region potentially possessed various motifs or elements targeted by various transcription factors associated with metal-coordinating regulation (e.g., metal transcription factor-1), immune responses (e.g., nuclear factor kappa B), and thermal modulations (e.g., heat shock factor). Acute heavy-metal exposures to 0.5 or $1.0\;{\mu}M$ of cadmium (Cd), copper (Cu), manganese (Mn), nickel (Ni) or zinc (Zn) showed that MT transcription was significantly stimulated by Cd (9.6-fold relative to non-exposed control) and Cu (10.4-fold), only moderately by Mn (2.4-fold), but hardly by Ni and Zn. Elevation of water temperature from $25^{\circ}C$ to $31^{\circ}C$ caused a rapid modulation of MT mRNAs toward upregulation to 9.5-fold; however, afterward the elevated mRNA level slightly decreased during further incubation at $31^{\circ}C$ for 6 h. Results from this study suggest that MT-based expression assay could be a useful basis for better understanding the metal- and/or heat-caused stresses in this endangered fish species.

Numerical analysis for deformation characteristics under the freezing and bursting of Al pipe (알루미늄 관의 동파 거동특성에 관한 수치적 연구)

  • Choi, Seung-Hyun;Lee, Dong-Won;Ko, Young-Bae
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.15 no.8
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    • pp.4763-4768
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    • 2014
  • Recently, aluminum pipes have been used instead of steel pipes for open and shut machines in vinyl housing because of its corrosion-resistance and light weight. In particular, the light weight is very useful for fitting and removal by human resources. On the other hand, an aluminum pipe is weak in winter because aluminum has a larger thermal expansion coefficient than steel. This study examined the freezing and bursting of aluminum pipes by numerical analysis. The mechanical-thermal deformation characteristics were analyzed under the condition of ice volumetric expansion in aluminum pipes reaching 50%. From numerical analysis, large stresses above the yield stress occurred in aluminum pipe after ice expanded in the net diameter immediately. In addition, the freezing and bursting of aluminum pipes was predicted around an ice volumetric expansion of 6 - 7% because the thickness of the aluminum pipe reached an aluminum elongation ratio of 17%. Therefore, it is recommended that aluminum pipes be sealed perfectly to prevent water flow in the pipe. These results suggest that it is very difficult to prevent freezing and bursting of aluminum pipes by water freezing in the pipe.

DEVELOPMENT OF THE MECHANICAL STRUCTURE OF THE MIRIS SOC (MIRIS 우주관측카메라의 기계부 개발)

  • Moon, B.K.;Jeong, W.S.;Cha, S.M.;Ree, C.H.;Park, S.J.;Lee, D.H.;Yuk, I.S.;Park, Y.S.;Park, J.H.;Nam, U.W.;Matsumoto, Toshio;Yoshida, Seiji;Yang, S.C.;Lee, S.H.;Rhee, S.W.;Han, W.
    • Publications of The Korean Astronomical Society
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    • v.24 no.1
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    • pp.53-64
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    • 2009
  • MIRIS is the main payload of the STSAT-3 (Science and Technology Satellite 3) and the first infrared space telescope for astronomical observation in Korea. MIRIS space observation camera (SOC) covers the observation wavelength from $0.9{\mu}m$ to $2.0{\mu}m$ with a wide field of view $3.67^{\circ}\times3.67^{\circ}$. The PICNIC HgCdTe detector in a cold box is cooled down below 100K by a micro Stirling cooler of which cooling capacity is 220mW at 77K. MIRIS SOC adopts passive cooling technique to chill the telescope below 200 K by pointing to the deep space (3K). The cooling mechanism employs a radiator, a Winston cone baffle, a thermal shield, MLI (Multi Layer Insulation) of 30 layers, and GFRP (Glass Fiber Reinforced Plastic) pipe support in the system. Optomechanical analysis was made in order to estimate and compensate possible stresses from the thermal contraction of mounting parts at cryogenic temperatures. Finite Element Analysis (FEA) of mechanical structure was also conducted to ensure safety and stability in launching environments and in orbit. MIRIS SOC will mainly perform Galactic plane survey with narrow band filters (Pa $\alpha$ and Pa $\alpha$ continuum) and CIB (Cosmic Infrared Background) observation with wide band filters (I and H) driven by a cryogenic stepping motor.

Evaluation on the External Restraint Stress in Mass Concrete (매스콘크리트의 외부구속응력에 관한 검토)

  • 강석화;정한중;박칠림
    • Magazine of the Korea Concrete Institute
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    • v.8 no.5
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    • pp.111-122
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    • 1996
  • The effects of external restraint on the thermal stresses i n mass concrete are investigated through a series of parametric study. Two major factors affecting the degree of external restraint such as the ratio of length to height of the placed structure (L/H) and the elastic modulus of base structure ($E_r$) are employed as the parameters in a condition which a placing height H is 1.0m. Various conditions of I,/H and E, are analysed by a FEM program and the relationship between these two parameters is examined. The shape of stress distribution due to the external restraint is shown as linearity on the height direction of the section, and is influenced by L/H, $E_r$, and strength development of placed concrete. The external restraint can be devided by two part. One is an axial restraint and the other is a flexural restraint. When the level of external restraint is low, the structure behavior is mainly governed by flexural restraint, otherwise it is dependent on axial restraint. Comparing the calculated stress by the method of the ACI 207 committee with a finite element analysis, the fbrmer overestimates the external restraint stress when the degree of external restraint is weak, and underestimates when it is strong.

The effect of initial stress induced during the steel manufacturing process on the welding residual stress in multi-pass butt welding

  • Park, Jeong-ung;An, Gyubaek;Woo, Wanchuck
    • International Journal of Naval Architecture and Ocean Engineering
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    • v.10 no.2
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    • pp.129-140
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    • 2018
  • A residual stress generated in the steel structure is broadly categorized into initial residual stress during manufacturing steel material, welding residual stress caused by welding, and heat treatment residual stress by heat treatment. Initial residual stresses induced during the manufacturing process is combined with welding residual stress or heat treatment residual stress, and remained as a final residual stress. Because such final residual stress affects the safety and strength of the structure, it is of utmost importance to measure or predict the magnitude of residual stress, and to apply this point on the design of the structure. In this study, the initial residual stress of steel structures having thicknesses of 25 mm and 70 mm during manufacturing was measured in order to investigate initial residual stress (hereinafter, referred to as initial stress). In addition, thermal elastic plastic FEM analysis was performed with this initial condition, and the effect of initial stress on the welding residual stress was investigated. Further, the reliability of the FE analysis result, considering the initial stress and welding residual stress for the steel structures having two thicknesses, was validated by comparing it with the measured results. In the vicinity of the weld joint, the initial stress is released and finally controlled by the weld residual stress. On the other hand, the farther away from the weld joint, the greater the influence of the initial stress. The range in which the initial stress affects the weld residual stress was not changed by the initial stress. However, in the region where the initial stress occurs in the compressive stress, the magnitude of the weld residual compressive stress varies with the compression or tension of the initial stress. The effect of initial stress on the maximum compression residual stress was far larger when initial stress was considered in case of a thickness of 25 mm with a value of 180 MPa, while in case of thickness at 70 mm, it was 200 MPa. The increase in compressive residual stress is almost the same as the initial stress. However, if initial stress was tensile, there was no significant change in the maximum compression residual stress.

Grain-Based Distinct Element Modelling of the Mechanical Behavior of a Single Fracture Embedded in Rock: DECOVALEX-2023 Task G (Benchmark Simulation) (입자기반 개별요소모델을 통한 결정질 암석 내 균열의 역학적 거동 모델링: 국제공동연구 DECOVALEX-2023 Task G(Benchmark Simulation))

  • Park, Jung-Wook;Park, Chan-Hee;Yoon, Jeoung Seok;Lee, Changsoo
    • Tunnel and Underground Space
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    • v.30 no.6
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    • pp.573-590
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    • 2020
  • This study presents the current status of DECOVALEX-2023 project Task G and our research results so far. Task G, named 'Safety ImplicAtions of Fluid Flow, Shear, Thermal and Reaction Processes within Crystalline Rock Fracture NETworks (SAFENET)' aims at developing a numerical method to simulate the fracture creation and propagation, and the coupled thermohydro-mechanical processes in fracture in crystalline rocks. The first research step of Task G is a benchmark simulation, which is designed for research teams to make their modelling codes more robust and verify whether the models can represent an analytical solution for displacements of a single rock fracture. We reproduced the mechanical behavior of rock and embedded single fracture using a three-dimensional grain-based distinct element model for the simulations. In this method, the structure of the rock was represented by an assembly of rigid tetrahedral grains moving independently of each other, and the mechanical interactions at the grains and their contacts were calculated using 3DEC. The simulation results revealed that the stresses induced along the embedded fracture in the model were relatively low compared to those calculated by stress analysis due to stress redistribution and constrained fracture displacements. The fracture normal and shear displacements of the numerical model showed good agreement with the analytical solutions. The numerical model will be enhanced by continuing collaboration and interaction with other research teams of DECOVALEX-2023 Task G and validated using various experiments in a further study.

Identification of Novel Salt Stress-responsive Genes Using the Activation Tagging System in Arabidopsis (애기장대에서 activation tagging system을 이용한 새로운 고염 스트레스 반응 유전자의 동정)

  • Seok, Hye-Yeon;Nguyen, Linh Vu;Bae, Hyoungjoon;Ha, Jimin;Kim, Ha Yeon;Lee, Sun-Young;Moon, Yong-Hwan
    • Journal of Life Science
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    • v.28 no.9
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    • pp.1030-1041
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    • 2018
  • Abiotic stresses limit the growth and productivity of plants. Cellular adaptation to abiotic stresses requires coordinated regulation in gene expression directed by complex mechanisms. This study used the activation tagging system to identify novel salt stress-responsive genes. The study selected 9 activation tagging lines that showed salt stress-tolerant phenotypes during their germination stages. Thermal asymmetric interlaced-PCR (TAIL-PCR) was used to identify the T-DNA tagging sites on the Arabidopsis genome in selected activation tagging lines, including AT7508, AT7512, AT7527, AT7544, AT7548, and AT7556. RT-PCR analysis showed that ClpC2/HSP93-III (At3g48870), plant thionin family (At2g20605), anti-muellerian hormone type-2 receptor (At3g50685), vacuolar iron transporter family protein (At4g27870), and microtubule-associated protein (At5g16730) were activated in AT7508, AT7512, AT7527, AT7544, and AT7556, respectively. Interestingly, in AT7548, both the genes adjacent to the T-DNA insertion site were activated: Arabinogalactan protein 13 (AGP13) (At4g26320) and F-box/RNI-like/FBD-like domains-containing protein (At4g26340). All of the seven genes were newly identified as salt stress-responsive genes from this study. Among them, the expression of ClpC2/HSP93-III, AGP13, F-box/RNI-like/FBD-like domains-containing protein gene, and microtubule-associated protein gene were increased under salt-stress condition. In addition, AT7508, AT7527, and AT7544 were more tolerant to salt stress than wild type at seedling development stage, functionally validating the screening results of the activation tagging lines. Taken together, our results demonstrate that the activation tagging system is useful for identifying novel stress-responsive genes.

Development on New Laser Tabbing Process for Modulation of Thin Solar Cell (박형 태양 전지 모듈화를 위한 레이져 태빙 자동화 공정(장비) 개발)

  • No, Donghun;Choi, Chul-June;Cho, Hyun Young;Yu, Jae Min;Kim, JungKeun
    • 한국신재생에너지학회:학술대회논문집
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    • 2010.06a
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    • pp.58.1-58.1
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    • 2010
  • In solar cell module manufacturing, single solar cells has to be joined electrically to strings. Copper stripes coated with tin-silver-copper alloy are joined on screen printed silver of solar cells which is called busbar. The bus bar collects the electrons generated in solar cell and it is connected to the next cell in the conventional module manufacturing by a metal stringer using conventional hot air or infrared lamp soldering systems. For thin solar cells, both soldering methods have disadvantages, which heats up the whole cell to high temperatures. Because of the different thermal expansion coefficient, mechanical stresses are induced in the solar cell. Recently, the trend of solar cell is toward thinner thickness below 180um and thus the risk of breakage of solar cells is increasing. This has led to the demand for new joining processes with high productivity and reduced error rates. In our project, we have developed a new method to solder solar cells with a laser heating source. The soldering process using diode laser with wavelength of 980nm was examined. The diode laser used has a maximum power of 60W and a scanner system is used to solder dimension of 6" solar cell and the beam travel speed is optimized. For clamping copper stripe to solar cell, zirconia(ZrO)coated iron pin-spring system is used to clamp both joining parts during a scanner system is traveled. The hot plate temperature that solar cell is positioned during lasersoldering process is optimized. Also, conventional solder joints after $180^{\circ}C$ peel tests are compared to the laser soldering methods. Microstructures in welded zone shows that the diffusion zone between solar cell and metal stripes is better formed than inIR soldering method. It is analyzed that the laser solder joints show no damages to the silicon wafer and no cracks beneath the contact. Peel strength between 4N and 5N are measured, with much shorter joining time than IR solder joints and it is shown that the use of laser soldering reduced the degree of bending of solar cell much less than IR soldering.

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Stability of the growth process at pulling large alkali halide single crystals

  • V.I. Goriletsky;S.K. Bondarenko;M.M. Smirnov;V.I. Sumin;K.V. Shakhova;V.S. Suzdal;V.A. Kuznetzov
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.13 no.1
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    • pp.5-14
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    • 2003
  • Principles of a novel pulse growing method are described. The method realized in the crystal growing on a seed from melts under raw melt feeding provided a more reliable control of the crystallization process when producing large alkali halide crystals. The slow natural convection of the melt in the crucible at a constant melt level is intensified by rotating the crucible, while the crystal rotation favors a more symmetrical distribution of thermal stresses over the crystal cross-section. Optimum rotation parameters for the crucible and crystal have been determined. The spatial position oi the solid/liquid phase interface relatively to the melt surface, heaters and the crucible elements are considered. Basing on that consideration, a novel criterion is stated, that is, the immersion extent of the crystallization front (CF) convex toward the melt. When the crystal grows at a <> CF immersion, the raised CF may tear off from the melt partially or completely due to its weight. This results in avoid formation in the crystal. Experimental data on the radial crystal growth speed are discussed. This speed defines the formation of a gas phase layer at the crystal surface. The layer thickness il a function of time a temperature at specific values of pressure in the furnace and the free melt surface dimensions in the gap between the crystal and crucible wall. Analytical expressions have been derived for the impurity component mass transfer at the steady-state growth stage describing two independent processes, the impurity mass transfer along the <> path and its transit along the <> one. The heater (and thus the melt) temperature variation is inherent in any control system. It has been shown that when random temperature changes occur causing its lowering at a rate exceeding $0.5^{\circ}C/min$, a kind of the CF decoration by foreign impurities or by gas bubbles takes place. Short-term temperature changes at one heater or both result in local (i.e., at the front) redistribution of the preset axial growth speed.

Residual Stress Behavior of PMDA/6FDA-PDA Copolyimide Thin Films (PMDA/6FDA-PDA 공중합 폴리이미드의 잔류응력 거동)

  • Jang, Won Bong;Chung, Hyun Soo;Joe, Yungil;Han, Haksoo
    • Applied Chemistry for Engineering
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    • v.10 no.7
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    • pp.1014-1019
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    • 1999
  • Copolyamic acid PMDA/6FDA-PDA(PAA) and homopolyamic acids PMDA-PDA(PAA) and 6FDA-PDA(PAA) were synthesized from 1,2,4,5-benzenetetracarboxylic dianhydride(PMDA) and 2,2'-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride(6FDA) as the dianhydride and 1,4-phenylenediamine (PDA) as the diamine. Residual stresses were detected in-situ during thermal imidization of the co- and homopolyimide precursors as a function of processing temperature over the range of $25{\sim}400^{\circ}C$ using thin film stress analyzer(TFSA), and morphological structures were investigated by WAXD. In comparison, the resultant residual stress of polyimide films composed of different compositions decreased with the increasing content of PMDA unit in the chain and was about 5 Mpa in compression mode for PMDA-PDA. In this study, the synthesis of random PMDA/6FDA-PDA copolyimide could be completed and compensate for the difficulty of process due to high $T_g$ of PMDA-PDA and relatively higher stress of 6FDA-PDA. It showed that we can make a low level stress copolyimied having excellent mechanical properties by incorporating appropriate rod-like rigid structure PMDA-PDA unit into 6FDA-PDA polyimide backbone which generally shows higher stress due to rotational hinges such as bulky di(trifluoromethyl). Specially, PMDA/6FDA-PDA(0.9:0.1:1.0) satisfied excellent mechanical property and low level stress as an inter layer showing low dielectric constant.

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