• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2007.06a
• /
• pp.207-208
• /
• 2007

Recently, high performance microelectronic devices are designed in multi-layer structure in order to make dense wiring of metal conductors in compact size. Imprint lithography have received significant attention due to an alternative technology for photolithography on such devices. In this work, we synthesized dielectric composite materials based on epoxy resin, and investigated their thermal stabilities and dynamic mechanical properties for thermal imprint lithography. In order to enhance the mechanical properties and toughness of dielectric material, various modified polyetherimide(PEI) was applied in the resin system. Curing behaviours, thermal stabilities, and dynamic mechanical properties of the dielectric materials cured with various conditions were studied using dynamic differential scanning calorimetry (DSC), thermo gravimetric analysis (TGA), and Universal Test Method (INSTRON).

• Proceedings of the Korea Institute of Fire Science and Engineering Conference
• /
• 2002.05a
• /
• pp.10-14
• /
• 2002

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.30 no.4
• /
• pp.204-209
• /
• 2017

Thermal and structural stability in the glass transition region of chalcogenide glasses has been investigated in terms of thermodynamics for application to various optoelectronic devices. In this study, the compositions of $Ge_xSb_{20}Se_{80-x}$ (x = 10, 15, 20, 25, and 30) were selected to investigate the glass stability according to germanium ratios. The chalcogenide bulks were fabricated by using a traditional melt-quenching method. Thin films were deposited by a thermal evaporation system, maintaining the deposition ratio of $3{\sim}5{\AA}$ in order to have uniformity. The thermal and structural properties were measured by a differential scanning calorimeter (DSC) and X-ray diffraction (XRD). The DSC analysis provided thermal parameters and theoretical glass region stabilities. The XRD analysis supported the theoretical stabilities because of where the crystallization peak data occurred.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2002.07a
• /
• pp.109-114
• /
• 2002

Aging stabilities of the operating frequency of piezoelectric devices such as filter, oscillator and discriminator are very important. In this study it was studied aging stabilities of the length-extensional vibration mode of Pb(Zr$\_$y/Ti$\_$1-y/)O$_3$+x[wt%]Cr$_2$O$_3$ ceramics. PZT ceramics in Morphotropic phase boundary have higher aging rates of k$\_$31/ and resonant frequency than those in tetragonal phase or rhombohedral phase. Thermal aging moves the composition with maximum aging rate to Zr-rich side in Cr not added PZT system. Aging rate of resonant frequency of the ceramics with x=0.1, y=0.53 and x=0.3, y=0.53 increased by thermal aging.

• Proceedings of the Korean Society For Composite Materials Conference
• /
• 2003.04a
• /
• pp.180-183
• /
• 2003

In this work. a potential inexpensive epoxy resin. epoxidized soybean oil (ESO) was synthesized and applied as a toughening agent for 4.4'-tetradiglycidyl diaminodiphenyl methane (TGDDM). The chemical structure of ESO was characterized by FT-IR, $^1H NMR, and ^{13}C NMR$ spectroscopy. The curing behaviors. thermal stabilities. fracture toughness. and flexural strength of TGDDM/ESO blend systems were investigated by using the dynamic DSC. thermogravimetric analysis (TGA). and flexural tests. The thermal stabilities of TGDDM/ESO blend systems were decreased with increasing ESO contents. whereas the critical stress intensity factor ($K_{IC}$) and flexural strength ($\sigma_f$) were increased with ESO contents up to 10 wt% ESO.

• KSBB Journal
• /
• v.26 no.5
• /
• pp.381-385
• /
• 2011

Studies were made to improve the stability of astaxanthin which has application limitations caused by light and thermal stability problems in spite of its strong anti-oxidant property. Astaxanthin was extracted from Haematococcus pluvialis with supercritical carbon dioxide. Liposomal encapsulation of astaxanthin to improve the stability was made with high pressure homogenizer. The narrow size distribution was observed with astaxanthin liposomes. Tests on light and thermal stabilities resulted that the liposormal encapsulation improved the stability of astaxanthin for cosmeceutical purposes.

• Proceedings of the Korean Magnestics Society Conference
• /
• 1999.04a
• /
• pp.132-133
• /
• 1999

• Bulletin of the Korean Chemical Society
• /
• v.31 no.12
• /
• pp.3794-3796
• /
• 2010

• The Korean Journal of Rheology
• /
• v.11 no.2
• /
• pp.135-142
• /
• 1999

The effects of 1 wt.% N-benzylpyrazinium hexafluoroantimonate (BPH) as a thermal latent initiator and blend compositions composed of 0, 5, 10, 20 and 40 wt.% of phenol-novolac resin to epoxy resin were investigated in terms of cure kinetics, thermal stabilities and rheological properties. Thermal latent properties of BPH were measured from the conversion as a function of reaction temperature on a dynamic DSC. This cationic BPH system turned out to be an effective thermal latent initiator in the epoxy-phenol curing system. And the increase of phenol-novolac resin concentration led to the decrease in the latent temperature and to the increase of cure activation energy ($E_a$) of the blend system. The thermal stability and activation energy ($E_t$) for decomposition, gel-time and activation energy ($E_c$) for cross-linking from rheometer increased within the composition range of 20~40 wt.% of phenol-novolac resin. This implies that the three-dimensional cross-linking may take place among hydroxyl group within phenol resin, epoxide ring within epoxy resin and BPH.

• Journal of Life Science
• /
• v.12 no.2
• /
• pp.208-212
• /
• 2002

Human $\varepsilon$-globin DNA fragment was used to determine the thermal stabilities of base pairs at d(CXG) and d(GXC) by Temperature Gradient Gel Electrophoresis(TGGE). The base pair stability depends on the hydrogen bonding interaction and base stacking interaction of neighbor base sequence. The orders of base pair stabilities were T.AG.A = A.G>C.T>T.C>C.A>A.C for d(GXC).d(GYC).