• 한국해양공학회지
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• 제25권3호
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• pp.28-33
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• 2011

The thermal shock properties of SiC materials were investigated for high temperature applications. In particular, the effect of thermal shock temperature on the flexural strength of SiC materials was evaluated, in conjunction with a detailed analysis of their microstructures. The efficiency of a nondestructive technique using ultrasonic waves was also examined for the characterization of SiC materials suffering from a cyclic thermal shock history. SiC materials were fabricated by a liquid phase sintering process (LPS) associated with hot pressing, using a commercial submicron SiC powder. In the materials, a complex mixture of $Al_2O_3$ and $Y_2O_3$ powders was used as a sintering additive for the densification of the microstructure. Both the microstructure and mechanical properties of the sintered SiC materials were investigated using SEM, XRD, and a three point bending test. The SiC materials had a high density of about 3.12 Mg/m3 and an excellent flexural strength of about 700 MPa, accompanying the creation of a secondary phase in the microstructure. The SiC materials exhibited a rapid propagation of cracks with an increase in the thermal shock temperature. The flexural strength of the SiC materials was greatly decreased at thermal shock temperatures higher than $700^{\circ}C$, due to the creation of microcracks and their propagation. In addition, the SiC materials had a clear tendency for a variation in the attenuation coefficient in ultrasonic waves with an increase in thermal shock cycles.

• Journal of Welding and Joining
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• 제31권3호
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• pp.4-10
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• 2013

In electronic industry, the trend of future electronics will be flexible, bendable, wearable electronics. Until now, there is few study on bonding technology and reliability of bonding joint between chip with micro solder bump and flexible substrate. In this study, we investigated joint properties of Si chip with eutectic Sn-58Bi solder bump on Cu pillar bump bonded on flexible substrate finished with ENIG by flip chip process. After flip chip bonding, we observed microstructure of bump joint by SEM and then evaluated properties of bump joint by die shear test, thermal shock test, and bending test. After thermal shock test, we observed that crack initiated between $Cu_6Sn_5IMC$ and Sn-Bi solder and then propagated within Sn-Bi solder and/or interface between IMC and solder. On the other hands, We observed that fracture propated at interface between Ni3Sn4 IMC and solder and/or in solder matrix after bending test.

• 한국신뢰성학회지:신뢰성응용연구
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• 제13권3호
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• pp.207-216
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• 2013

This paper, we classified LED failure mechanisms that occur due to the delamination and analyzed each of the mechanism that gives the LED PKGs the effect. Usually, the LED is composed of several materials which are LED chips, gold wire, phosphor, epoxy resin, adhesive, reflector and lead frame. These different materials are usually delaminated in trouble conditions which are huge temperature difference, hot and humid or mechanical shocked. When the components are delaminated, a luminance will be lost and moisture be absorbed easily, a thermal resistance be increased attendantly. In this paper, we experimented to investigate failure mechanism of the thermal resistance and failure mechanism of the decrease of luminance that occur due to the delamination. A thermal shock test was performed to reproduce this phenomena by subjecting samples to a cold-hot cyclling process between $-30^{\circ}C$(15min) and $110^{\circ}C$(15min). The samples were inspected at 200, 600 and 1,000 cycles. We measured feature of LED using the spatial analyzer, optical microscope, thermal resistance, photometer, scanning electron microscope (SEM). As a result, the progression of the crack and the thermal resistance and decrease in luminance are proportional to number of thermal shock.

• 마이크로전자및패키징학회지
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• 제18권3호
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• pp.45-52
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• 2011

Flip Chip Ball Grid Array (FCBGA) 패키지의 솔더조인트 신뢰성을 평가하기 위한 방법으로는 다이 충격법, 다이 전단법, 3점 굽힘법, 열충격법 등이 활용된다. 본 연구에서는 솔더 접합부의 주요 고장메카니즘인 취성파괴를 확인하기 위한 방법으로 리플로우 상태, $85^{\circ}C$/85%RH 처리, $150^{\circ}C$/10hr 에이징의 처리한 후, 4가지 평가법으로 평가를 진행하여 파단모드를 분석하였다. 본 연구결과에서는 다이 충격법과 다이 전단법의 Good joint rate (GJR, %)는 리플로우 상태와 $85^{\circ}C$/85%RH처리에서 각각 89~91%와 100% 였으며, $150^{\circ}C$/10hr 에이징에서는 66%와 90%를 나타내었다. 3점 굽힘법과 열충격법의 GJR(%)는 3종류 샘플에서 모두 100%를 나타내어 변별력이 없었다. C4 솔더접합부의 신뢰성 평가법에 따른 GJR(%)의 변별력을 확인할 수 있는 방법은 die shock 과 die shear test였다.

• 대한금속재료학회지
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• 제47권12호
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• pp.842-851
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• 2009

The long-term reliability of Sn-0.3wt%Ag-0.7wt%Cu solder joints was evaluated and compared with Sn-3.0wt%Ag-0.5wt%Cu under thermal shock conditions. Test vehicles were prepared to use Sn-0.3Ag-0.7Cu and Sn-3.0Ag-0.5Cu solder alloys. To compare the shear strength of the solder joints, 0603, 1005, 1608, 2012, 3216 and 4232 multi-layer ceramic chip capacitors were used. A reflow soldering process was utilized in the preparation of the test vehicles involving a FR-4 material-based printed circuit board (PCB). To compare the shear strength degradation following the thermal shock cycles, a thermal shock test was conducted up to 2,000 cycles at temperatures ranging from $-40^{\circ}C$ to $85^{\circ}C$, with a dwell time of 30 min at each temperature. The shear strength of the solder joints of the chip capacitors was measured at every 500 cycles in each case. The intermetallic compounds (IMCs) of the solder joint interfaces werealso analyzed by scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDS). The results showed that the reliability of Sn-0.3Ag-0.7Cu solder joints was very close to that of Sn-3.0Ag-0.5Cu. Consequently, it was confirmed that Sn-0.3Ag-0.7Cu solder alloy with a low silver content can be replaced with Sn-3.0Ag-0.5Cu.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2007년 추계학술발표대회 개요집
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• pp.254-256
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• 2007

In this paper, the effects of the reflow number in the mechanical reliability of flip chip solder joint was investigated by flip chip shear test and thermal shock test. For evaluation mechanical reliability of flip chip, We experiment that specimens were operated 3-times, 6-times, 9-times, 12-times under reflow Process. After shear test and thermal shock test, We measured max shear strength and coming first crack number of thermal cycle. And We observe fracture surface and cross section by using SEM(Scanning Electron Microscope) and optical scope. In the results, the more specimens were operated reflow process, the more decreased maximum shear strength and number of thermal cycle.

• The Korean Journal of Ceramics
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• 제3권3호
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• pp.195-198
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• 1997

Post-firing process of electronic ceramic, such as electroding and encapsultion with resin, often causes damage by thermal shock. The thermal shock behavior of $BaTiO_3$ ceramics was investigated by the down-quench test, where the relative strength retained is determined after the sample is quenched from an elevated temperature into a fixed temperature bath. The critical temperature drop, $\DeltaTc$, was evaluated for three kinds of sintered $BaTiO_3$ ceramics, which were formed by extrustioin, uniaxial pressing using granules, and uniaxial pressing using powders. A drastic loss in strength caused by microcracking was observed for the specimens quenched with $\DeltaT\geq150^{\circ}C$. This concentp can be adopted as a method of the quality control by monitoring the sudden drop of the strength of capacitor products after each exposure to heat.

• 한국생산제조학회지
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• 제18권5호
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• pp.449-454
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• 2009

This paper presents an experimental study on the failure characteristics of SnAgCu lead-free solder balls. To estimate the effect of Ag, three types of SnAgCu balls are first prepared by varying the weight percent of Ag(1.0, 3.0, 4.0 wt%) and then analyzed by reliability tests such as thermal shock, high speed ball shear, and drop tests. Thermal shock test reveals that the higher the weight percent of Ag is, the longer the fatigue lift becomes. To the contrary, high speed ball-shear test and drop test show that the shear strength and the fracture toughness of solder balls are inversely proportional to the weight percent of Ag, respectively, Reasons for these observations will be further investigated In the future work.

• 한국세라믹학회지
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• 제46권5호
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• pp.478-483
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• 2009

Thermal shock and hot corrosion resistance of silicon nitride ceramics are investigated in this study. Silicon nitrides are fabricated by nitride pressureless sintering (NPS) process, which process is the continuous process of nitridation reaction of Si metal combined with subsequent pressureless sintering. The results of thermal shock test show it sustains 400MPa of initial strength during test in the designated condition of ${\Delta}T=700{\sim}25^{\circ}C$ up to maximum 4,800 cycles. Hot corrosion tests also reveal that the strength degradation of NPS silicon nitride did not occur at $700^{\circ}C$ with an exposure in Ar, $H_2$, Na and K for 1,275 h.

• 대한기계학회논문집A
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• 제22권1호
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• pp.73-79
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• 1998

The development of a new material which should be continuously usable under severe environment of very high temperature has been urgently requested. The conventional thermal barrier coating(TBC) is a two layer coating, but a composition and a microstructure of functionally graded material(FGM) are varied continuously from place to place in ways designed to provide it with the maximum function of mitigating the induced thermal stress. The purpose of this study is to evaluate the heat-resistant characteristics by thermal shock of laser and furnace heating. The fracture behaviors of non-FGM(NFGM) and FGM were investigated based on acoustic emission(AE) technique during thermal shock test. Therefore, it can be concluded that FGM gives higher thermal resistance compared to NFGM by AE signal and fracture surface analysis.