• 제목/요약/키워드: Thermal resistance

검색결과 2,910건 처리시간 0.029초

산질화 표면에서의 액적 증발 열전달 성능 분석 (Analysis of Heat Transfer Performance of Oxi-nitriding Surface during Droplet Evaporation)

  • 김대윤;이성혁
    • 한국분무공학회지
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    • 제24권4호
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    • pp.203-208
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    • 2019
  • In general, the oxi-nitriding method is well known as such a surface treatment way for substantial enhancement in corrosion resistance, even comparable to that of titanium. However, there are still lacks of information on thermal performance of the oxi-nitriding surface being of additional compound layers on the base substrate. Above all, the quantitative measurement of its thermal performance still was not evaluated yet. Thus, the present study experimentally measures the thermal resistance of the oxi-nitriding surface during droplet evaporation and then estimates heat transfer performance with the use of the onedimensional heat transfer model in vertical direction. From the experimental results, it is found that the total evaporation time slightly increased with the thermal resistance caused by the oxi-nitriding layer, showing a maximum difference of approximately 20% with that of the bare surface. Although the heat transfer performance of oxi-nitriding surface became slightly lower than that of the bare surface, the oxi-nitriding surface exhibits much better heat transfer performance compared to titanium.

착상조건하에서 평행 평판 열교환기의 열 및 물질전달 (Heat and Mass Transfer of Parallel Plate Heat Exchanger under Frosting Condition)

  • 이관수;이태희;김우승
    • 설비공학논문집
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    • 제6권2호
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    • pp.155-165
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    • 1994
  • In this study, the following factors are investigated from experiments for a vertical parallel plate heat exchanger under the frosting condition ; the growth of frost layer, the characteristics of heat and mass transfer, the change of mass flow rate of the air passing through the heat exchanger, and the pressure drop of the air in the heat exchanger. The amount of heat and mass flux of water vapor transferred from the air stream to the heat exchanger surface is large at the early stage of frosting and then decreases dramatically, and the extent of decreasing rate becomes moderate with time. The frost layer formed near the inlet of the heat exchanger is thicker and denser than that formed near the outlet. It is found that the gradient of the amount of frost along the flow direction increases with time. In the early period of frost formation, the thermal resistance between the air and the cooling plate increases dramatically and then the extent of change decreases with time. Initially the convective thermal resistance is dominant. Then, while the convective thermal resistance decreases with time, the conductive thermal resistance continues to increase with time and finally the conductive thermal resistance becomes dominant.

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내열성세균에 관한 연구 2 (제 2 ) 기성세균의 내열성에 관하여 (Studies on Thermal Resistance Bacteria (Part 2) On the Thermal Resistance of Anaerobic Bacteria.)

  • 이계호;장건형
    • 미생물학회지
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    • 제4권2호
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    • pp.15-18
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    • 1966
  • The purpose of this paper is to study on the thermal death time curve and F-values, and morphological and physiological characteristics observed for the identification. The three strains of thermal resistancing anaerobic bacteria isolated from unheated various cans and swelled cans and the different soils collected from the wide area in Korea. The results obtained in the light of the manual of Bergeg's for the identification of the anareobic bacteria have been shown that the three strains of anaerobic bacteria are pertained to Cl. sporogenes B-41 Cl. butyricum B-72 & Cl.. botulinum Type E B-163. The optimum temperature, pH and thermal resistance, thermal death point of the anaerobic have been measured.

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FR4 PCB의 Via-hole이 LED 패키지에 미치는 열적 특성 분석 (Analysis of Thermal Properties in LED Package by Via hole of FR4 PCB)

  • 이세일;이승민;박대희
    • 조명전기설비학회논문지
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    • 제24권12호
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    • pp.57-63
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    • 2010
  • The efficiency of LED package is increasing by applying the high power, and a existing lighting is changing as the LED lighting. However, many problems have appeared by heat. Therefore, in order to solve thermal problems, LED lighting is designing in several ways, but the advantages of LED lighting is fading due to increase the prices and volumes. In this study, we try to improve the thermal performance by formation of via holes. The junction temperature and thermal resistance in the FR4-PCB with via-holes of 0.6[mm] was excellent in experiment and FR4-PCB with Via-holes of 0.6[mm] was excellent in simulation without solder. Further, the thermal resistance and the optical properties can be improved through a formation of via-holes.

패시브하우스 구축을 위한 건물외피시스템 단열성능 평가 기법 개발에 관한 연구 (A Study on the Thermal resistance Performance Evaluation Method of Building Exterior System for Passive House Construction)

  • 김영봉;문재식;박동천
    • 한국건축시공학회:학술대회논문집
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    • 한국건축시공학회 2017년도 추계 학술논문 발표대회
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    • pp.143-144
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    • 2017
  • Due to the recent depletion of natural resources and global warming, a passive house type building exterior system has been developed and applied. For this purpose, we developed a building exterior thermal resistance performance evaluation system and verify the feasibility of this system for evaluation of passive house building system.

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현지 측정에 의한 남한지역의 지중유효열전도도, 보어홀 전열저항 및 초기온도 분석 (Analysis of Soil Thermal Conductivities, Borehole Thermal Resistances and Initial Soil Temperature with In-Situ Testing in South Korea)

  • 노정근;연광석;송헌
    • 한국태양에너지학회 논문집
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    • 제32권5호
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    • pp.68-74
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    • 2012
  • Investigation of the effective soil thermal conductivity($k$) is the first step in designing the ground loop heat exchanger(borehole) of a geothermal heat pump system. Another important factor is the borehole thermal resistance($R_b$). Thermal response tests offer a good method to determine the ground thermal properties for the total heat transport in the ground. The first step is measured for initial soil temperature. This is done by supplying a only pump power into a borehole heat exchanger. They need to supply into water unload heat power more than 30 minutes. In this study, the initial soil temperature was found to analysis $14.1{\sim}16.0^{\circ}C$,the ratio was 68.7% represented. In this case of $k$, was 2.1~3.0 $W/m{\cdot}k$, $R_b$ was 0.11~0.20 $m{\cdot}K/W$. In this work, it is also shown that the distribution of a soil thermal conductivity and borehole thermal resistance were on the influence of initial soil temperature. And soil thermal conductivity was related with factors of equation by linear least square method, borehole thermal resistance was on the influence of composite factors.

크리프와 등온열화에 따른 초초임계압 발전설비용 페라이트계 11Cr-3.45W 내열합금강의 미세조직 변화 (Microstructural Development of Ferritic 11Cr-3.45W Heat-resistance Steel for Ultra-supercritical Power Plant During Creep and Thermal Aging)

  • 김정석
    • 열처리공학회지
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    • 제31권3호
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    • pp.91-96
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    • 2018
  • Microstructural development of ferritic 11Cr-3.45W heat-resistance steel for ultra-supercritical power plant during creep and thermal aging was investigated using electron microscopy. The test samples were isothermally aged at $700^{\circ}C$ for up to 4000 hours and subjected to creep loading at $700^{\circ}C$ for predetermined periods of lifetime to prepare the damaged materials. In this structural material, a various secondary phases are the primary influence on mechanical properties of ferritic heat-resistance steel. The typical precipitates of $M_{23}C_6$, MX and $M_2X$ secondary phases had been analyzed through qualitative and quantitative manner. Coarsening of precipitates and increase of lath width were observed during creep and thermal aging. This phenomenon was remarkable for creep process compared with isothermal aging process.

핀 바닥두께가 변하는 pin 핀의 해석 (Analysis of a Pin Fin with Variable Fin Base Thickness)

  • 강형석
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2008년도 춘계학술대회 논문집
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    • pp.642-645
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    • 2008
  • A pin fin with variable fin base thickness is analysed by using the one dimensional analytic method. Heat loss and fin thermal resistance are presented as a function of the fin base thickness, pin fin outer radius and convection characteristic numbers ratio. The relationship between the fin outer radius and fin base thickness for the same amount of heat loss is shown. One of the results indicates the fin thermal resistance decreases as the fin outer radius and/or convection characteristic numbers ratio increase whereas the fin thermal resistance is independent on the variation of fin base thickness.

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접촉열저항이 있는 수직벽에서의 응고과정 해석 (Analysis of the Solidification Process at a Vertical Wall With Thermal Contact Resistance)

  • 이진호;모정하;황기영
    • 대한기계학회논문집
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    • 제19권1호
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    • pp.193-201
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    • 1995
  • The role of thermal contact resistance between a casting and a metal mold as well as natural convection in the melt during solidification of a pure metal is numerically studied. Numerical simulation is performed for a rectangular cavity using the coordinate transformation by boundary-fitted coordinate and pure aluminum is used as the phase- change material. The influences of thermal contact resistance on the interface shape and position, solidified volume fraction, temperature field and local heat transfer are investigated.

열저항-열용량법에 의한 사무실용 건물의 소비에너지 해석 (Analysis of energy consumption of office building by thermal resistance-capacitance method)

  • 이창선;최영돈
    • 설비공학논문집
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    • 제9권1호
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    • pp.1-13
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    • 1997
  • This paper reports the dynamic analysis of energy consumption for an office building by heat resistance-capacitance method. If a building is divided into several wall components and the wall components is replaced by one thermal capacitance and several thermal resistances, the building becomes an electric circuit. By solving the simultaneous equations of the circuit, the dynamic heat transfer characteristics and the energy consumption rate of the building were predicted. Accuracy of modified BIN method was evaluated by the present resistance-capacitance method. The result shows that modified BIN method overpredicts the heating load of the office building 15%. Annual energy consumptions of equipments(fan, boiler, chiller) for various ventilating control system(CAV, VAV, FCU+VAV, FCU+CAV) were compared. FCU+CAV shows the minimum annual energy consumption.

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