• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2005년도 춘계학술대회논문집
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• pp.330-333
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• 2005

The paper presents a numerical solution to the problem of a hot rigid indenter siding over a thermoelastic Winkler foundation with a thermal contact resistance at constant speed. It is shown analytically that no steady-state solution can exist for sufficiently high temperature or sufficiently small normal load or speed regardless of the thermal contact resistance. However, the steady state solution may exist in the same situation if the thermal contact resistance is considered. This means that the effect of the large values of temperature difference and small value of force or velocity which occur at no steady state can be lessened due to the thermal contact resistance. When there is no steady-state the predicted transient behavior involves regions of transient stationary contact interspersed with regions of separation regardless of the thermal contact resistance. Initially, the system typically exhibits a small number of relatively large contact and separation regions, but after the initial transient the trailing edge of the contact area is only established and the leading edge loses contact, reducing the total extent of contact considerably. As time progresses, larger and larger number of small contact areas are established, until eventually the accuracy of the algorithm is limited by the discretization used.

• 복식
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• 제58권6호
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• pp.24-34
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• 2008

The purpose of this study was to create a database of information on fabric factors(i.e., fabric insulation, fabric weight, clothing weight, fabric thickness, air permeability, and water vapor resistance) of clothing used for insulations, to compare them according to clothing types, and to estimate thermal resistance of clothing using these factors. A total of 25 kinds of clothing were selected(9 types for suits, 6 types of jacket, 5 types for shirts, and 5 types for trousers). The results of this study were as follows; Thermal insulation of clothing showed the highest positive correlation(0.85, p>0.01) with thermal insulation of fabric and very high positive correlation with water vapor resistance, fabric thickness, fabric weight, and clothing weight, respectively, 0.77, 0.77, 0.73, 0.71(p>0.01). Fabric weight of jacket was higher than that of shirts and trousers. Air permeability of shirts was the highest of clothing types. Clothing insulation of jacket was higher than that of shirts and trousers and its fabric insulation was also the highest of clothing types. Regression analysis showed that fabric thickness, water vapor resistance, and fabric weight would be useful factors for estimating the thermal resistance of clothing.

• 수산해양기술연구
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• 제43권4호
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• pp.362-369
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• 2007

This paper was studied on the characteristics of acid resistance and thermal shock for epoxy coatings in the strong acidic environment. The exhaust gas system, such as a air preheater, desulfurization equipment, for industrial boiler is damaged by dew point corrosion. To protect the acid corrosion, the coating using nonmetal was applied. The electrochemical polarization test, acid resistance and thermal shock test for epoxy coatings were carried out. And the acid resistance and thermal shock characteristics, aspect, and electrochemical anti-corrosion characteristics for epoxy coatings in the strong acidic environment were considered. The main results are as followings: As the epoxy glass flake coating by acidic thermal shock was damaged to the crack, blistering and elution etc., the current density of epoxy glass flake coating is high. But the damage of epoxy metal complex coating by acidic thermal shock was not occurred. Therefore the characteristics of acid resistance and thermal shock for epoxy metal complex coating is better than those for epoxy glass flake coating.

• KEPCO Journal on Electric Power and Energy
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• 제6권2호
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• pp.151-155
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• 2020

In this paper, a new experimental method to determine the thermal resistance of building wall was proposed by improving the heat flow method (HFM) based on the air-surface temperature ratio theory. This technique measures the thermal resistance of the wall excluding the inner and outer surface heat transfer resistance. Unlike conventional HFM, this value can be compared directly with the theoretical reference value. Its performance was verified using three mock-up structures with a theoretical thermal transmittance of 0.5, 3.3, and 0.18 W/㎡·K respectively. After measuring the variations in the temperature and heat transfer rate of the mock-ups for 383 hours, the thermal transmittances were determined to be 0.47, 3.10, and 0.18 W/㎡·K, which corresponded to errors of 5.2, 6.2 and 0.5%, respectively, compared to the theoretical values. It was concluded that this technique can directly compare the thermal resistance of the wall between the existent stage and initial stage after construction.

• Interaction and multiscale mechanics
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• 제1권4호
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• pp.397-409
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• 2008

The interfacial thermal resistance of pristine and defective carbon nanotubes (CNTs) embedded in low-density polyethylene matrix is studied in this paper. Interface thermal resistance in nanosystems is one of the most important factors that lead to the large variation in thermal conductivities in literature and the novelty of this paper lies in the estimation of the interfacial thermal resistance for defective nanotubes-systems. Thermal properties of CNT nanostructures are estimated using molecular dynamics (MD) simulations and the simulations were carried out for various temperatures by rescaling the velocities of carbon atoms in the nanotube. This paper also deals with the mesoscale thermal conductivities of composite systems, using effective medium theories by considering the size effect in the form of interfacial thermal resistance and also using the conventional micromechanical methods like Hashin-Shtrikman bounds and Wakashima-Tsukamoto estimates.

• 한국통신학회논문지
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• 제39C권3호
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• pp.234-238
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• 2014

Multichip packaging was achieved the best solution to significantly reduce thermal resistance at the same time, to increase luminance intensity in LEDs packaging application. For the packaging, thermal spreading resistance is an important parameter to get influence the total thermal performance of LEDs. In this study, silicon-based multichip light emitting diodes (LEDs) packaged module has been examined for thermal characteristics in several parameters. Compared to the general conventional single LED packaged chip module, multichip LED packaged module has many advantages of low cost, low density, small size, and low thermal resistance. This analyzed module is comprised of multichip LED array, which consists of 32 LED packaged chips with supplement power of 0.2 W at every single chip. To realize the extent of thermal distribution, the computer-aided design model of 6.4 W Si-based multichip LED module was designed and was performed by the simulation basis of actual fabrication flow. The impact of thermal distribution is analyzed in alternative ways both optimizing numbers of fins and the thickness of that heatsink. In addition, a thermal resistance model was designed and derived from analytical theory. The optimum simulation results satisfies the expectations of the design goal and the measurement of IR camera results. tart after striking space key 2 times.

• 소성∙가공
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• 제11권1호
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• pp.61-68
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• 2002

The thermal shock and thermal fatigue test has been carried out to analyze the thermal characteristics of tool steels for hot forging and the effects of mechanical properties on this study have been investigated. The resistance to thermal shock is first of all a matter of good toughness and ductility. Therefore, a proper hot-work tool steel should be characterized by high fracture strength and high temperature toughness. Based on these results, some critical temperature($T_{fracture}$) at which fracture occur can be measured to characterize the thermal resistance of the materials. During thermal fatigue tests, the thermal fatigue cracks occur because of the repetitive heating and cooling of the die surface and the thermal fatigue damage was evaluated by analyzing different number of cycles to failure. The results showed that the resistance to thermal shock and thermal fatigue were found to be favoured by high hot tensile strength and high hot hardness, and thermal resistance of SKD61 was superior to that of ESC, SKT4 and this was caused by higher mechanical properties of SKD61.

• 대한기계학회논문집B
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• 제26권5호
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• pp.716-723
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• 2002

Heat transfer in linear motor driven stages for surface mounting device applications was investigated. A simple one-dimensional thermal resistance model (TRM) was introduced. In order to reduce three-dimensional nature to one-dimensional, a few assumptions and simplifications were employed suitably. A good agreement with a finite element heat transfer analysis in temperature profile was obtained. For validation, the analysis was compared with the measurement with respect to motor driving power. Overall discrepancy was less than 7$^{\circ}C$. The influence of two high thermal resistance parts, insulation sheet and thermal contact between the coil assembly and the mounting plate, was examined through the analysis. Additionally, the thermal resistance analysis was applied to another stage including an internal cooling-air passage, and was found available for this system as well. After validation, the cooling effect was surveyed in terms of motor power, and cooling-air and -water flow rate.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2001년도 추계학술대회논문집B
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• pp.96-101
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• 2001

Heat transfer in linear motor driven stages for surface mounting device applications was investigated. A simple one-dimensional thermal resistance model was introduced. In order to reduce three-dimensional nature to one-dimensional, a few assumptions and simplifications were employed suitably. A good agreement with a finite element heat transfer analysis in temperature profile was obtained. For validation, the analysis was compared with the measurement with respect to motor driving power. Overall discrepancy was less than $7^{\circ}C$. The influence of two high thermal resistance parts, insulation sheet and thermal contact between the coil assembly and the mounting plate, was examined through the analysis. Additionally, the thermal resistance analysis was applied to another stage including an internal cooling-air passage, and was found available for this system as well. After validation, the cooling effect was surveyed in terms of motor power, and cooling-air flow rate.

• 한국전기전자재료학회논문지
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• 제17권4호
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• pp.367-372
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• 2004

Two new extraction methods for the thermal Resistance of HBT(Heterojunction Bipolar Transistors) are proposed. First, the analytical expression, based on the thermal characteristics that the base to emitter junction voltage drops with the increase of junction temperature, is derived. Second, the thermal resistance equation that can predict the measured DC(Direct Current) data optimally is derived. These optimal thermal resistance expression is applied to the 2 finger 2${\times}$20${\mu}{\textrm}{m}$-AlGaAs/GaAs HBT and shows the good agreement with the measured data.