• Transactions of the Korean Society of Mechanical Engineers B
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• v.28 no.12
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• pp.1475-1483
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• 2004

Loop thermosyphon(LTS) has many good characteristics such as low thermal resistance, no power consumption, noiseless operation and small size. To investigate the overall performance of LTS, we have performed various experiments varying three parameters: input power of the heater, working fluid(water, ethanol, FC3283) and filling ratio of the working fluid. At a combination of these parameters, temperature measurements are made at many locations of the LTS. The temperature difference between the evaporator and the condenser is used to obtain the thermal resistance. In addition, flow visualization using a high speed camera is carried out. The thermal resistance is not constant. It is lower at higher input power, which is one of the distinct merits of LTS. Flow instabilities are frequently observed when changing the working fluid, the input power and the filling ratio. The results show that the LTS can be readily put into practical use. Future practical application in electronic cooling is recommended.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.303-304
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• 2005

In this paper, we report a fluxless eutectic die bonding process which uses 80Au-20Sn eutectic alloy. The chip LEDs are picked and placed on silicon substrate wafers. The bonding process temperatures and force are $305\sim345^{\circ}C$ and 10$\sim$100gf, respectively. The bonding process was performed on graphite heater with nitrogen atmosphere. The quality of bonding are evaluated by shear test and thermal resistance. Results of fluxless eutectic die bonding show that shear strength is Max. 3.85kgf at 345$^{\circ}C$ /100gf and thermal resistance of junction to die bonding is Min. 3.09K/W at 325$^{\circ}C$/100gf.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.26 no.2
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• pp.243-250
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• 2017

A numerical study was conducted to calculate the cooling capacity variation of a power plant ACC (air-cooled condenser) caused by changes in operating conditions. A numerical model was developed using the ${\varepsilon}-NTU$ and finite volume method, containing 100 elements for a single low fin tube. The model was validated through a comparison of cooling capacity between the simulated values and manufacturer's data. Even though simple assumptions and previously presented heat transfer correlations were applied to the model, the prediction error was 1.9%. The simulated variables of the operating conditions were air velocity, air temperature, and mass flux. The analysis on the variation of thermal resistance along the tube showed that the water side thermal resistance was higher than the air side thermal resistance at the downstream end of the tube, indicating that the ACC capacity could be increased by applying technology to enhance in-tube flow condensation heat transfer.

• Korean Journal of Materials Research
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• v.14 no.12
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• pp.870-875
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• 2004

Heat flow characteristics in the newly developed Wave Heat Sink were analyzed under natural and forced convections by Icepak program using the finite volume method. Temperature distribution and thermal resistance of Wave Heat Sink with/without air vent hole on the top of fin were compared with those of a commercial Al extruded heat sink(Intel Heat Sink). Under the natural convection, the maximum temperature was $45.1^{\circ}C$ in the air vent hole typed Wave Heat Sink, which was superior to that of Intel Heat Sink. The thermal resistance was $2.51^{\circ}C/W$ in the air vent hole typed Wave Heat Sink, and it changed to $2.65^{\circ}C/W\;and\;2.16^{\circ}C/W$ with changes of gravity direction and fin height, respectively. Under the forced convection, the maximum temperature became lower than that under the natural convection. In addition, the thermal resistance lowered in the air vent hole typed Wave Heat Sink with higher fin height and it decreased with increasing the air flux.

• Transactions of the Korean Society of Mechanical Engineers
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• v.16 no.6
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• pp.1205-1215
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• 1992

The solidification rate is of special importance in determining the casting structures and properties. The heat transfer characteristics at the interface between the mold and the casting is one of the major factors that control the solidification rate. The thermal resistance exists due to the air-gap formation at the mold/casting interface during the freezing process. In this study two-dimensional Stefan problem with air-gap resistance in the rectangular mold is considered and the heat transfer characteristics is numerically examined by using the enthalpy method. The effects of the major parameters, such as mold geometry, thermal conductivity, heat transfer coefficient, and initial temperature of casting, on the thermal characteristics are investigated.

• Journal of the Korean Ceramic Society
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• v.46 no.5
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• pp.478-483
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• 2009

Thermal shock and hot corrosion resistance of silicon nitride ceramics are investigated in this study. Silicon nitrides are fabricated by nitride pressureless sintering (NPS) process, which process is the continuous process of nitridation reaction of Si metal combined with subsequent pressureless sintering. The results of thermal shock test show it sustains 400MPa of initial strength during test in the designated condition of ${\Delta}T=700{\sim}25^{\circ}C$ up to maximum 4,800 cycles. Hot corrosion tests also reveal that the strength degradation of NPS silicon nitride did not occur at $700^{\circ}C$ with an exposure in Ar, $H_2$, Na and K for 1,275 h.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.25 no.6
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• pp.331-337
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• 2013

An experimental study on the performance of a liquid electric component cooling system was performed. The thermal resistance and pressure drop at a heat sink were measured, for aluminum waterblocks with four different internal shapes, with either smooth surface, porous media filling, or with fins of 5 mm height, or of 7 mm height. The fins had 0.5 mm thickness, and the gap between the fins was 0.5 mm. The waterblock internal dimension was $36.5{\times}36.5{\times}7mm$. Compared with the waterblock with smooth surface, the thermal resistance reduction was 11%, 46%, and 42% for waterblocks with porous media filling, 5 mm, and 7 mm fins, respectively. A new dimensionless parameter was suggested to evaluate the waterblock performance, with the simultaneous consideration of thermal resistance and pressure drop. The performance of the waterblock with fins of 5 mm height was best by parameter.

• Transactions of the Korean Society of Pressure Vessels and Piping
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• v.19 no.2
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• pp.109-116
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• 2023

This study presents a CRUD modelling to simulate the thermal resistance behavior of CRUD, deposited on the surface of a cladding tube of a fuel assembly. When heat produced from fuels transfers to a coolant through a cladding tube, the CRUD acting as an additional thermal resistance is expressed as two layers, i.e., a solid oxide layer and an imaginary fluid layer, which are added to the experimental tube's heat structure of the MARS-KS input data. The validation calculation for the experiments performed in UNIST-DISNY facility showed that the center and surface temperatures of the cladding tube increased as the porosity and the steam amount inside pores of the CRUD got higher. In addition, the temperature gradient in the imaginary fluid layer was calculated to be larger than that in the solid oxide part, indicating that the steam amount inside the layer acted more largely as thermal resistance. It was also evaluated through sensitivity calculations that the cladding tube temperature was more sensitive to the CRUD porosity and the steam amount in pores than to the inlet flow rate of the coolant.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.1
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• pp.91-98
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• 2010

The increasing of power and processing speed and miniaturization of central processor unit (CPU) used in electronics equipment requires better performing thermal management systems. A typical thermal management package consists of thermal interfaces, heat dissipaters, and external cooling systems. There have been a number of experimental techniques and procedures for estimating thermal conductivity of thin, compressible thermal interface material (TIM). The TIM performance is affected by many factors and thus TIM should be evaluated under specified application conditions. In compact packaging of electronic equipment the chip is interfaced with a thin heat spreader. As the package is made thinner, the coupling between heat flow through TIM and that in the heat spreader becomes stronger. Thus, a TIM characterization system for considering the heat spreader effect is proposed and demonstrated in detail in this paper. The TIM test apparatus developed based on ASTM D-5470 standard for thermal interface resistance measurement of high performance TIM, including the precise measurement of changes in in-situ materials thickness. Thermal impedances are measured and compared for different directions of heat dissipation. The measurement of the TIM under the practical conditions can thus be used as the thermal criteria for the TIM selection.

• 한국태양에너지학회:학술대회논문집
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• 2008.11a
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• pp.220-225
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• 2008

Cylindrical stainless-steel/sodium heat pipe for a high-temperature solar thermal application was manufactured and tested for transient and steady-state operations. Two layers of stainless-steel screen mesh wick was inserted as a capillary structure. The outer diameter of the heat pipe was 12.7 mm and the total length was 250 mm. The effective heat transport length, the thermal load, and the operating temperature were varied as thermal transport conditions of the heat pipe. The thermal load was supplied by an electric furnace up to 1kW and the cooling was performed by forced convection of air The effective thermal conductivity and the thermal resistance were investigated as a function of heat flux, heat transport length, and vapor temperature. Typical range of the total effective thermal conductivity was as low as 43,500 W/m K for heat flux of 176.4 kW/$m^2$ and of operating temperature of 1000 K.