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Experimental Study on the Performance of an Electric Component Liquid Cooling System with Variation of the Waterblock Internal Shape

워터블록 내부형상에 따른 수냉식 전자부품 냉각장치 성능변화에 관한 실험적 연구

  • Hahm, Hyung Chang (Graduate School of NID Fusion Technology, Seoul National University of Science and Technology) ;
  • Park, Chang Yong (Department of Mechanical System Design Engineering, Seoul National University of Science and Technology)
  • 함형창 (서울과학기술대학교 NID 융합기술대학원) ;
  • 박창용 (서울과학기술대학교 기계시스템디자인공학과)
  • Received : 2013.02.01
  • Published : 2013.06.10

Abstract

An experimental study on the performance of a liquid electric component cooling system was performed. The thermal resistance and pressure drop at a heat sink were measured, for aluminum waterblocks with four different internal shapes, with either smooth surface, porous media filling, or with fins of 5 mm height, or of 7 mm height. The fins had 0.5 mm thickness, and the gap between the fins was 0.5 mm. The waterblock internal dimension was $36.5{\times}36.5{\times}7mm$. Compared with the waterblock with smooth surface, the thermal resistance reduction was 11%, 46%, and 42% for waterblocks with porous media filling, 5 mm, and 7 mm fins, respectively. A new dimensionless parameter was suggested to evaluate the waterblock performance, with the simultaneous consideration of thermal resistance and pressure drop. The performance of the waterblock with fins of 5 mm height was best by parameter.

Keywords

References

  1. McGlen, R. J., Jachuck, R., and Lin, S., 2004, Integrated thermal management echniques for high power electric devices, Applied Thermal Enginering, Vol. 24, pp. 1143-1156. https://doi.org/10.1016/j.applthermaleng.2003.12.029
  2. Kandasamy, R., Wang, A.-Q., and Mujumdar, A, S., 2008, Transient cooling of electronics using phase change material(PCM)-based heat sinks, Vol. 28, pp. 1047-1057. https://doi.org/10.1016/j.applthermaleng.2007.06.010
  3. Zhang, Y. P., Yu, X. L., Feng, Q. K., and Zhang, R. T., 2009, Thermal performance study of integrated cold plate with power module, Applied Thermal Engineering, Vol. 29, pp. 3568-3573. https://doi.org/10.1016/j.applthermaleng.2009.06.013
  4. Lai, Y., Cordero, N., Barthel, F., Tebbe, F., Kuhn, J., Apfelbeck, R., and Wurtenberger, D., 2009, Liquid cooling of bright LEDs for automotive applications, Applied Thermal Engineering, pp. 1239-1244.
  5. Zhang, H. Y., Pinjala, D., Wong T. N., Toh K. C., and Joshi, Y. K., 2005, Single-phase liquid microchannel heat sink for electronics packages, Applied Thermal Engineering, Vol 25., pp. 1472-1487. https://doi.org/10.1016/j.applthermaleng.2004.09.014
  6. Kwon, O.-K., Choi, M.-J., Cha, D.-A., and Yun, J.-H., 2008, A study on thermal performance of micro channel Waterblock for computer cooling, Transactions of the Korean Society of Mechanical Engineers of KSME B, Vol. 32, pp. 776-783. https://doi.org/10.3795/KSME-B.2008.32.10.776
  7. Choi, M.-J., Kwon, O.-K., and Yun, J.-H., 2009, Flow distribution and heat transfer characteristics of the micro channel Waterblock with different shape of inlet, Koran Journal of Air-Conditioning and Refrigeration Engineering, Vol. 21, pp. 386-393.
  8. Moomsma, K., Poulikakos, D., and Zwick, F., 2003, Metal foams as compact high performance heat exchangers, Mechanics of Materials, Vol. 35, pp. 1161-1176. https://doi.org/10.1016/j.mechmat.2003.02.001
  9. Klein, S. A., 2004, Engineering Equation Solver, V.7.3, F-Chart Software, Madison, WI, USA.