• 한국표면공학회지
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• 제46권6호
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• pp.235-241
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• 2013

In this study, the effects of alloying elements and thermal aging on the contact resistance of electroplated gold alloy layers were investigated by surface analysis using X-ray photoelectron spectroscopy (XPS). The contact resistance of Au-Ag alloy was lower than that of Au-Ni or Au-Co alloy after thermal aging. The XPS results show that nickel and oxygen present as nickel oxides such as NiO and $Ni_2O_3$ on the surface of gold layers after thermal aging. The increase in the contact resistance after thermal aging is attributable to the nickel oxide layer formed on the surface of the gold layers. The content of nickel diffused from the underlayer during the thermal aging was high in the order of Au-Co, Au-Ni and Au-Ag alloy because the area of grain boundary was large in the order of Au-Ag, Au-Ni and Au-Co alloy.

• 한국신뢰성학회지:신뢰성응용연구
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• 제13권3호
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• pp.207-216
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• 2013

This paper, we classified LED failure mechanisms that occur due to the delamination and analyzed each of the mechanism that gives the LED PKGs the effect. Usually, the LED is composed of several materials which are LED chips, gold wire, phosphor, epoxy resin, adhesive, reflector and lead frame. These different materials are usually delaminated in trouble conditions which are huge temperature difference, hot and humid or mechanical shocked. When the components are delaminated, a luminance will be lost and moisture be absorbed easily, a thermal resistance be increased attendantly. In this paper, we experimented to investigate failure mechanism of the thermal resistance and failure mechanism of the decrease of luminance that occur due to the delamination. A thermal shock test was performed to reproduce this phenomena by subjecting samples to a cold-hot cyclling process between $-30^{\circ}C$(15min) and $110^{\circ}C$(15min). The samples were inspected at 200, 600 and 1,000 cycles. We measured feature of LED using the spatial analyzer, optical microscope, thermal resistance, photometer, scanning electron microscope (SEM). As a result, the progression of the crack and the thermal resistance and decrease in luminance are proportional to number of thermal shock.

• Journal of Welding and Joining
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• 제28권3호
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• pp.79-85
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• 2010

Hardfacing is one of the frequently applying method to increase surface hardness in hot forging die. Recently, hardfacing receives great attention due to it's repair availability and low cost. In hot forging die, crack resistance and thermal shock resistance have been considered as major properties, However there are few studies for the assessment of these properties. So, it is necessary to establish the assessment method for crack resistance and thermal shock resistance in hardfacing for hot forging die. In this study, flux cored arc welding was applied to make hardfacing welds. Three point bending test was carried out to assess hardfacing weld's crack resistance, and high temperature bending test using salt bath was developed for thermal shock resistance. Consequently, it was possible to assess crack resistance and thermal shock resistance of hardfacing welds for hot forging die quantitatively.

• Safety and Health at Work
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• 제11권4호
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• pp.405-417
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• 2020

Background: Electrical socket outlets are used continuously until a failure occurs because they have no indication of manufacturing date or exchange specifications. For this reason, 659 electrical fires related to electrical socket outlets broke out in the Republic of Korea at 2018 only, an increase year on year. To reduce electrical fires from electrical socket outlets, it is necessary to perform an accelerated test and analyze the thermal, insulation resistance, and material properties of electrical socket outlets by installation years. Methods: Thermal characteristics were investigated by measured the temperature increase of electrical socket outlets classified according to year with variation of the current level. Insulation resistance characteristics was measured according to temperature for an electrical socket outlets by their years of use. Finally, to investigate the thermal and insulation resistance characteristics in relation to outlet aging, this study analyzed electrical socket outlets' conductor surface and content, insulator weight, and thermal deformation temperature. Results: Analysis showed, regarding the thermal characteristics, that electrical socket outlet temperature rose when the current value increased. Moreover, the longer the time that had elapsed since an accelerated test and installation, the higher the electrical socket outlet temperature was. With respect to the insulation resistance properties, the accelerated test (30 years) showed that insulation resistance decreased from 110 ℃. In relation to the installation year (30 years), insulation resistance decreased from 70 ℃, which is as much as 40 ℃ lower than the result found by the accelerated test. Regarding the material properties, the longer the elapsed time since installation, the rougher the surface of conductor contact point was, and cracks increased. Conclusion: The 30-year-old electrical socket outlet exceeded the allowable temperature which is 65 ℃ of the electrical contacts at 10 A, and the insulation resistance began to decrease at 70 ℃. It is necessary to manage electrical socket outlets that have been installed for a long time.

• 대한금속재료학회지
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• 제46권9호
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• pp.585-592
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• 2008

Flip-chip bonding using Cu-Sn mushroom bumps composed of Cu pillar and Sn cap was accomplished, and the contact resistance and the thermal cycling reliability of the Cu-Sn mushroom bump joints were compared with those of the Sn planar bump joints. With flip-chip process at a same bonding stress, both the Cu-Sn mushroom bump joints and the Sn planar bump joints exhibited an almost identical average contact resistance. With increasing a bonding stress from 32 MPa to 44MPa, the average contact resistances of the Cu-Sn mushroom bump joints and the Sn planar bump joints became reduced from $30m{\Omega}/bump$ to $25m{\Omega}/bump$ due to heavier plastic deformation of the bumps. The Cu-Sn mushroom bump joints exhibited a superior thermal cycling reliability to that of the Sn planar bump joints at a bonding stress of 32 MPa. While the contact resistance characteristics of the Cu-Sn mushroom bump joints were not deteriorated even after 1000 thermal cycles ranging between $-40^{\circ}C$ and $80^{\circ}C$, the contact resistance of the Sn planar bump joints substantially increased with thermal cycling.

• 한국세라믹학회지
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• 제54권4호
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• pp.314-322
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• 2017

This study investigates changes in the mechanical behavior, such as changes in indentation load-displacement curve, wear resistance and contact fatigue resistance of thermal barrier coatings (TBCs) by thermal cycling test and thermal shock test. Relatively dense and porous TBCs on nickel-based bondcoat/superalloy are prepared; the highest temperature applied during thermal durability test is $1350^{\circ}C$. The results indicate that the porous TBCs have relatively longer lifetime during thermal cycling and thermal shock tests, while denser TBCs have relatively higher wear and contact fatigue resistance. The mechanical behavior is influenced by sintering of the TBCs by exposure to high temperature during tests.

• 한국의류학회지
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• 제23권1호
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• pp.3-13
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• 1999

This study was performed for purpose of getting fundamental information requisite to wear velvet clothes that is more comfortable for the human body and also the environment. It was carried out in a human wearing test and thermal manikin test at the same time in a controlled-condition chamber. The experimental environment had a ambient temperature of 15$\pm$0.5$^{\circ}C$ with the relative humidity at 5$^{\circ}C$$\pm$5% and with air velocity at less that than 0.2m/sec. Velvet differ from common plain weaves in thermal properties because it's constructed in two parts one is ground part and the other part is pile part. In order to investigate the thermal resistance of velvet eight different combination of 4 velvet kinds and 2 lings kinds as experimental clothes. [(4 velvet kinds : Acetate cuprammoium Rayon Cotton Wool) (2 lining kinds : acetate viscose rayon)longrightarrow8 combination: Aa, Av, Ra, Rv, Ca, Cv, Wa, Wv: the simplified character] The results of this study can be summarized as follows : 1. For the regional thermal resistance the differences in eight clothes as well as differences in each part were significant. As a whole the breast part showed the highest thermal resistance and the leg part was higher than the shank part. The rank of the total thermal resistance was put at Wa>Wv>Ca>Cv>Aa>Av>Ra>Rv in this order. 2. Considered clothing microclimate microclimate temperature has a similar tendency to the total thermal resistance. It showed a significance in the differences of eight clothes and each parts. the belly part was highest in every combination. On the other hand for clothing humidity there was a significance between back and breast part only in the human wearing test. 3. It was indicated that CLO value was highly positively correlated with the clothings' weight and showed a high negative correlation with the air permeability.

• 한국포장학회지
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• 제12권1호
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• pp.45-53
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• 2006

Thermal insulation is used in a variety of applications to protect temperature sensitive products from thermal damage. Several factors affect the performance of insulation packages. Among these factors, the thermal resistance of the insulating wall is the most important factor to determine the performance of the insulating package. In many cases, insulating wall consists of multi-layered structure and the heat transfer through this structure is a very complex process. In this study, an one-dimensional mathematical model, which includes all of the heat transfer principles covering conduction, convection and radiation in multi-layered structure, were developed. Based on this model, several heat transfer phenomena occurred in the air space between the layer of the insulating wall were investigated. From the simulation results, it was observed that the heat transfer through the air space between the layer were dominated by conduction and radiation and the low emissivity of the surface of each solid layer of the wall can dramatically increase the thermal resistance of the wall. For practical use, an equation was derived for the calculation of the thermal resistance of a multi-layered wall.

• International Journal of Air-Conditioning and Refrigeration
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• 제6권
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• pp.1-13
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• 1998

The basic heat transfer process that occurs in a building can best be illustrated by an electrical circuit network. Present paper reports the dynamic simulation of annual energy consumption in an office building by the thermal resistance capacitance network method. Unsteady thermal behaviors and annual energy consumption in an office building were examined in detail by solving the simultaneous circuit equations of thermal network. The results are used to evaluate the accuracy of the modified BIN method for the energy consumption analysis of a large building. Present thermal resistance-capacitance method predicts annual energy consumption of an office building with the same accuracy as that of response factor method. However, the modified BIN method gives 15% lower annual heating load and 25% lower cooling load than those from the present method. Equipment annual energy consumptions for fan, boiler and chiller in the HVAC system are also calculated for various control systems as CAV, VAV, FCU+VAV and FCU+CAV. FCU+CAV system appears to consume minimum annual energy among them.

• 한국미생물·생명공학회지
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• 제5권1호
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• pp.5-12
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• 1977

As a basic study for the application of the spore-tearing lactic acid bacteria to foods, the effects of the sporulating conditions on the growth and sporogenesis were studied were observed. The results obtained are as follow. 1. All carbohydrates added to sporulation media except dextrin decreased the sporulation rate and the thermal resistance of spores. Dextrin stimulated the growth, however, there in no effect on the thermal resistance. 2. As nitrogen source, the protein hydrolysates such as peptone, casamino acid were effective to obtain were spores of the increased thermal resistance. 3. Ca$\^$＋＋/, Mn$\^$＋＋/ of the metal ions added to casamino acid containing medium validly increased the total growth, sporulation rate and thermal resistance. Its optimum concentration was 40 ppm each. 4. Biotin of vitamines had an effect on the total growth, sporulation and thermal resistance of spores. Its optimum concentration was 30${\gamma}$/ml. 5. The resistant spores required the adequate maturation period, more than 36 hours, sufficient aeration. and optimum temperature, 37∼45$^{\circ}C$.