• 센서학회지
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• 제27권5호
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• pp.300-305
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• 2018

The uncooled microbolometer thermal sensor for low cost and mass volume was designed to target the new infrared market that includes smart device, automotive, energy management, and so on. The microbolometer sensor features 80x60 pixels low-resolution format and enables the use of wafer-level vacuum packaging (WLVP) technology. Read-out IC (ROIC) implements infrared signal detection and offset correction for fixed pattern noise (FPN) using an internal digital to analog convertor (DAC) value control function. A reliable WLVP thermal sensor was obtained with the design of lid wafer, the formation of Au80%wtSn20% eutectic solder, outgassing control and wafer to wafer bonding condition. The measurement of thermal conductance enables us to inspect the internal atmosphere condition of WLVP microbolometer sensor. The difference between the measurement value and design one is $3.6{\times}10-9$ [W/K] which indicates that thermal loss is mainly on account of floating legs. The mean time to failure (MTTF) of a WLVP thermal sensor is estimated to be about 10.2 years with a confidence level of 95 %. Reliability tests such as high temperature/low temperature, bump, vibration, etc. were also conducted. Devices were found to work properly after accelerated stress tests. A thermal camera with visible camera was developed. The thermal camera is available for non-contact temperature measurement providing an image that merged the thermal image and the visible image.

• 한국재료학회지
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• 제22권9호
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• pp.476-481
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• 2012

Among the various roll-to-roll printing technologies such as gravure, gravure-offset, and reverse offset printing, reverse offset printing has the advantage of fine patterning, with less than 5 ${\mu}m$ line width. However, it involves complex processes, consisting of 1) the coating process, 2) the off process, 3) the patterning process, and 4) the set process of the ink. Each process demands various ink properties, including viscosity, surface tension, stickiness, and adhesion with substrate or clich$\acute{e}$; these properties are critical factors for the printing quality of fine patterning. In this study, Ag nano ink was developed for reverse offset printing and the effect of polyvinylpyrrolidone(PVP), used as a capping agent of Ag nano particles, on the printing quality was investigated. Ag nano particles with a diameter of ~60 nm were synthesized using the conventional polyol synthesis process. Ethanol and ethylene glycol monopropyl ether(EGPE) were used together as the main solvent in order to control the drying and absorption of the solvents during the printing process. The rheological behavior, especially ink adhesion and stickiness, was controlled with washing processes that have an effect on the offset process and that played a critical role in the fine patterning. The electrical and thermal behaviors were analyzed according to the content of PVP in the Ag ink. Finally, an Ag mesh pattern with a line width of 10 ${\mu}m$ was printed using reverse offset printing; this printing showed an electrical resistivity of 36 ${\mu}{\Omega}{\cdot}cm$ after sintering at $200^{\circ}C$.

• Journal of Advanced Marine Engineering and Technology
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• 제40권2호
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• pp.96-101
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• 2016

The thermal management of high-power LED components in an assembly structure is crucial for the stable operation and proper luminous function. This study employs numerical tools to determine the optimum thermal design in LEDs with a heat sink consisting of a crevice-type vapor-chamber heat pipe. The effects of the MCPCB are investigated in terms of the substrate thicknesses on which the LEDs are mounted. Further, different placement configurations in a system module are considered. This study found that for a confined area, a power of 40 W/LED is applicable to a high-power package. Furthermore, the thermal conductivity of dielectric layer materials should ideally be greater than 0.9 W/m.K. The temperature conditions of the vapor chamber in a heat pipe greatly affect the thermal performance of the system. At an offset distance of 9.0 mm and a $2^{\circ}C$ increase in the temperature of the heat pipe, the resulting maximum temperature increase is approximately $1.9^{\circ}C$ for each heat dissipation temperature. Finally, at a thermal conductivity of 0.3 W/m.K, it was found that the total thermal resistance changes dramatically. Above 1.2 W/m.K, the resistance change reduces exponentially.

• Journal of Advanced Research in Ocean Engineering
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• 제1권3호
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• pp.148-156
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• 2015

Deck plates of ships or offshore structures would make out-of-plane distortion for their thin thickness. These distortions are usually straightened by thermal straightening such as flame heating method. After thermal straightening, the blocks are lifted and moved by cranes to assemble it at dry-dock stage. After this lifting process, out-of-plane deformation again happens frequently. And then, they continuously cause quality and accuracy problems in the final dry-dock process. So, it takes more time for repair and correction working. According to preceding research, the lifting process by cranes would offset the effect on thermal straightening. The target of this study is to develop a methodology analyzing the remaining efficiency of thermal straightening after block lifting. The development was based on the assumption of yield state at straightening region. Therefore the remaining efficiency was obtained by different stiffness slope while lifting & relieving. The efficiency formula was designed using inherent strain, and we made a table of zero-efficiency by cooling speed and class rule's steels. As a result, if the stress orthogonal to straightened line is calculated during lifting analysis by FEA, the efficiency can be obtained linearly to the values in the table. Finally, even optimized carling position can be designed by considering the regional data from series project and welding region on deck.

• 산업기술연구
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• 제26권A호
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• pp.139-146
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• 2006

Many concrete bridge decks develop transverse cracking shortly after construction. These cracks accelerate corrosion of reinforcing steel and lead to concrete deterioration, damage to components beneath the deck, unsightly appearance. These cracks shorten the service life and increase maintenance costs of bridge structures. In this study, VES-LMC overlay, which provides the same benefits as a conventional overlay, is designed to cure very quickly. Although the materials for VES overlays are more expensive, the cost is more than offset by the savings on traffic control and work zone safety measures. Otherwise, reaction of hydration occurs very rapidly in beginning step(concrete placing). As a results, thermal cracking can be occur by thermal stress in accordance with hydration-heat The purpose of this study was to estimate diagnosis of crack occurrence of VES-LMC through field tests at early-age.

• 센서학회지
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• 제22권1호
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• pp.44-48
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• 2013

For a successful commercialization of microbolometer, it is required to develop a robust package including thermal stabilizing mechanism. In order to regulate the temperature within some operating range, thermoelectric cooler is generally used but it's not easy to model the whole package due to the coupled physics nature of thermoelectric cooler. In this paper, SPICE-compatible modeling methodology of a microbolometer package is presented, whose steady-state results matched well with FEM results at the maximum difference of 5.95%. Although the time constant difference was considerable as 15.7%, it can be offset by the quite short simulation time compared to FEM simulation. The developed model was also proven to be useful for designing the thermal stabilizer through parametric and transient analyses under the various working conditions.

• 한국인쇄학회지
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• 제22권1호
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• pp.1-8
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• 2004

The key points of the CTP board is as follows: Film, brightness, plate exposure is eliminated, the reduction of personal expenses, and the reduction of time consumption. But above all, the accurate reappearance of the highlighting and shadow portion as well as self modification of the dust edge portion stands out as the most impressive improvements. In this paper, using a digital test from 4.0 and a Thermal CTP color printing control, the two parts of the Thermal CTP utilized a 1%-99% dot reappearance. Also, using an opposite line target, the results of the CTP plates and printing were compared. Finally, research was made on the printing quality on the slur development of the plate and the result when there was a lack of weave connection.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2008년도 하계종합학술대회
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• pp.1043-1044
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• 2008

In this study, a novel algorithm of the improvement residual non-uniformity (RNU) in thermal imaging system is proposed using correlated double sample signal processing. The proposed method attempts to eliminate offset variation of ROIC in IR detector causing the variation of FPA (focal plane array) temperature and suppling power. Experimental results show that the proposed method confirmed a better performance than the existing RNU system.

• 대한안전경영과학회지
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• 제9권5호
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• pp.79-85
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• 2007

Intelligent machines respond to external environments on the basis of decisions that are made by sensing the changes in the environment and analyzing the obtained information. This study focuses on the construction of a knowledge base which enables decision making with that information. Approximately 70% of all errors that occur in machine tools are caused by thermal error. In order to proactive deal with these errors, a system which measures the temperature of each part and predicts and compensates the displacement of each axis has been developed. The system was built in an open type controller to enable machine tools to measure temperature changes and compensate the displacement. The construction of a machining knowledge base is important for the implementation of intelligent machine tools, and is expected to be applicable to the network based intelligent machine tools which look set to appear sooner or later.

• 한국대기환경학회지
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• 제27권2호
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• pp.133-141
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• 2011

In this study, different calibration approaches for reduced sulfur compounds (RSCs) were investigated by using thermal desorption coupled with gas chromatography (GC) and pulsed flame photometric detection (PFPD). To evaluate the effects of calibration procedures, gaseous standards of 4 RSCs ($H_2S$, $CH_3SH$, DMS, and DMDS) prepared at 10 ppm level were analyzed at 7 loading injection volumes (40, 60, 80, 100, 160, 240, and 320 ${\mu}L$). The results were then compared with calibration curves made with the Z (zero offset) and N (non-zero offset) method. The concentrations of unknown samples were then quantified by using R (ratio) method in which the slope values are compared between standards and samples. Secondly, in A (average) method, results obtained from a multi-point analysis of unknown samples were also averaged to extract representative values for each sample. Results of both experiments showed that analytical error of low molecular weight components (such as $H_2S$ and $CH_3SH$) was greatly expanded with the Z method. In conclusion, the combined application of N-A method was the more realistic approach to reduce biases in the quantification of RSCs.