• Title/Summary/Keyword: Thermal infrared

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Implementation of Infrared Thermal Image Processing System for Disaster Monitoring (재난 감시를 위한 적외선 열화상 처리 시스템의 구현)

  • Kim, Won-Ho;Kim, Dong-Keun
    • Journal of the Institute of Convergence Signal Processing
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    • v.11 no.1
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    • pp.9-12
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    • 2010
  • This paper presents design and implementation of infrared thermal image processing system based on the digital media processor for disaster monitoring. The digital thermal image processing board is designed and implemented by using commercial chips such as DM642 processor and video encoder, video decoder. The implemented functions for disaster monitoring are to analyze temperature distribution of a monitoring infrared thermal image and to detect disaster situation such as fire. For the input of infrared thermal image processing system, an infrared camera of type of the $320\;{\times}\;240\;{\mu}$-bolometer is used. The required functions are confirmed with 10 frame/second of processing performance by testing of the prototype and Practicality of the system was verified.

Realization of a High Speed Optic Scanner for Infrared Thermal Imaging (적외선 체열촬영시스템을 위한 고속 광주사기의 구현)

  • 이수열
    • Journal of Biomedical Engineering Research
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    • v.16 no.1
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    • pp.43-48
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    • 1995
  • A high speed optic scanner capable of 16 frames/sec imaging has been developed for the realization of the infrared thermal Imaging system with a single element infrared sensor. The high speed optic scanner is composed of a rotating polygon mirror for horizontal scanning, a flat mirror mounted on a galvanometer for vertical scanning, and a spherical mirror. It has been experimentally found that the optic scanner is capable of 16 framesllsec imaging with the frame matrix size of 256 x 64.

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Development of Al2TiO5-Clay Composites for Far Infrared Radiator (Al2TiO5-점토 복합체를 이용한 원적외선방사재질의 개발)

  • Han, Sang Mok;Shin, Dae Yong
    • Journal of Industrial Technology
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    • v.20 no.A
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    • pp.239-245
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    • 2000
  • Sintered $Al_2TiO_5$ has a very low thermal expansion and an infrared radiative selectively emitting large amounts of far infrared rays. However, it is week in mechanical strength. Spectral infrared emittance, thermal expansion coefficient, and mechanical strength of $Al_2TiO_5$-clay composites were studied to develop a material for far infrared radiators. The composites containing 10~50 mass% Jungsan clay had high emittance in the range of 2,000~500cm-1. The bending strength of the $Al_2TiO_5$-clay composites increased with increasing clay content. The $Al_2TiO_5$-clay composites with a clay content of 50mass% and heat-treated at $1,200^{\circ}C$ had a large strength for infrared radiators ; 86MPa. The average linear thermal expansion coefficient from $200{\sim}1,000^{\circ}C$ of the 50mass% jungsan clay containing compo sited heat-treated at $1,200^{\circ}C$ was lower than $3.87{\times}10-6/^{\circ}C$.

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Characteristics of Infrared Blocking, Stealth and Color Difference of Aluminum Sputtered Fabrics

  • Han, Hye Ree
    • Journal of the Korean Society of Clothing and Textiles
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    • v.43 no.4
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    • pp.592-604
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    • 2019
  • This study examines the stealth function of sputtered fabric with an infrared thermal imaging camera in terms of the thermal and infrared (IR) transmittance characteristics. Various base fabrics were selected, infrared imaging was performed, and infrared transmittance was measured. By infrared camera experiment it was found that the sample was concealed because it had a similar color to the surroundings when the aluminum layer was directed toward the outside. In addition, a comparison of the infrared thermographic image of the untreated sample and the sputtered sample in the laboratory showed that the difference in ${\Delta}E$ value ranged from 31 to 90.4 and demonstrated effective concealment. However, concealment was not observed in the case of the 3-layer (Nylon-Al-Nylon) model when a sputtered aluminum layer existed between two nylon layers. The direction of the sputtering layer did not affect the infrared transmittance in the infrared transmittance experiment. Therefore, it seems better to interpret the concealing effect in the infrared thermographic images by using thermal transfer theory rather than infrared transmittance theory. We believe that the results of this study will be applicable to developing high performance smart clothing and military uniforms.

Measurement of Temperature Distribution in the Infrared Panel Heater (적외선 패널히터의 온도분포 측정)

  • Lee, Kong-Hoon;Ha, Su-Seok;Kim, Ook-Joong
    • Proceedings of the KSME Conference
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    • 2004.11a
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    • pp.1178-1183
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    • 2004
  • Temperature distribution and heating characteristic of the panel heater for infrared heating have been investigated. The temperature variation with time is firstly measured with the thermocouple to figure out the response time of the heater to the power input. The heater reaches faster to the steady state in comparison to the ceramic heater. The infrared thermal imaging system is utilized to investigate the temperature distribution over the heater surface. The measured thermal images show that the thermal boundary layer induced by the free convection near the heater surface affects the temperature distribution on the surface. The images also show the fairly good uniformity of the temperature distribution in the core region of the surface.

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Development of Infrared Thermal Image Target Simulator System (적외선 열상표적 모사장치 개발)

  • 김병문;심장섭;정순기
    • Journal of the Korea Society of Computer and Information
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    • v.9 no.1
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    • pp.63-70
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    • 2004
  • This paper describes modeling, design and performance test results of infrared thermal image target system which can generate infrared thermal image on aircraft. The system is designed to control image shape and intensity so that the infrared image shape and its emitting intensity are so similar to that of real aircraft. When applying the technique suggested in this paper, the system consumes only small electric power energy about 30(㎾) to generate infrared thermal image which is equivalent to that of real aircraft under full power operation. After verifying performance test, the system developed here has been used as a target for korean potable surface to air missile(KPSAM) at the stage of evaluation test such as target adaptive guidance test and auto-pilot logic test.

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THERMAL MODELS AND FAR INFRARED EMISSION OF ASTEROIDS

  • KIM SAM;LEE HYUNG MOK;NAKAGAWA TAKAO;HASEGAWA SUNAO
    • Journal of The Korean Astronomical Society
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    • v.36 no.1
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    • pp.21-31
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    • 2003
  • ASTRO-F /FIS will carry out all sky survey in the wavelength from 50 to 200 ${\mu}m$. At far infrared, stars and galaxies may not be good calibration sources because the IR fluxes could be sensitive to the dust shell of stars and star formation activities of galaxies. On the other hand, asteroids could be good calibration sources at far infrared because of rather simple spectral energy distribution. Recent progresses in thermal models for asteroids enable us to calculate the far infrared flux fairly accurately. We have derived the Bond albedos and diameters for 559 asteroids based on the IRAS and ground based optical data. Using these thermal parameters and standard thermal model, we have calculated the spectral energy distributions of asteroids from 10 to 200 ${\mu}m$. We have found that more than $70\%$ of our sample asteroids have flux errors less than $10\%$ within the context of the best fitting thermal models. In order to assess flux uncertainties due to model parameters, we have computed SEDs by varing external parameters such as emissivity, beaming parameter and phase integral. We have found that about 100 asteroids can be modeled to be better than $5.8\%$ of flux uncertainties. The systematic effects due to uncertainties in phase integral are not so important.

Development of $Al_2TiO_5$-Clay Composites for Infrared Radiator ($Al_2TiO_5$-점토 복합체를 이용한 적외선 방사체의 개발)

  • 신대용;한상목
    • Journal of the Korean Ceramic Society
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    • v.37 no.2
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    • pp.122-127
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    • 2000
  • The thermal expansion, thermal stability, mechanical strength and infrared radiative property of Al2TiO5-clay composites, prepared from synthesized Al2TiO5 and clay, were investigated to develop a material for far infrared radiators. The emittance of composites containing 10~50 wt% clay, heated at 1,20$0^{\circ}C$ for 3 h, increased with increasing clay content and emittance was about 0.3 and 0.92 in the ranges of 3,400~2,500 cm-1 and 2,500~400cm-1, respectively. The bulk density and bending strength of the Al2TiO5-clay composites increased with increasing clay content. 50 wt% Al2TiO5-50 wt% clay composite, heat-treated at 1,20$0^{\circ}C$, had an adequate strength for infrared radiators; 80 MPa. The degree of thermal expansion hysteresis decreased with increasing clay content and the mean thermal expansion coefficient increased with increasing clay content. The thermal expansion coefficient of 50 wt% Al2TiO5-50 wt% clay composite heated at 1,20$0^{\circ}C$ was 5.78$\times$10-6/$^{\circ}C$.

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Analysis on the Thermal Response of Electronic Assemblies during Forced Convection-Infrared Reflow Soldering (강제대류-적외선 리플로 솔더링시 전자조립품의 열적반응 분석)

  • 손영석;신지영
    • Journal of Welding and Joining
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    • v.21 no.6
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    • pp.46-54
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    • 2003
  • The thermal response of electronic assemblies during forced convection-infrared reflow soldering is studied. Soldering for attaching electronic components to printed circuit boards is performed in a process oven that is equipped with porous panel heaters, through which air is injected in order to dampen temperature fluctuations in the oven which can be established by thermal buoyancy forces. Forced convection-infrared reflow soldering process with air injection is simulated using a 2-dimensional numerical model. The multimode heat transfer within the reflow oven as well as within the electronic assembly is simulated. Parametric study is also performed to study the effects of various conditions such as conveyor speed, blowing velocity, and electronic assembly emissivity on the thermal response of electronic assemblies. The results of this study can be used in the process oven design and selecting the oven operating conditions to ensure proper solder melting and solidification.

Heat Transfer Analysis of Infrared Reflow Soldering Process for Attaching Electronic Components to Printed Circuit Boards (전자부품의 인쇄회로기판 부착시 적외선 Reflow Soldering과정 열전달 해석)

  • Son, Young-Seok
    • Journal of Welding and Joining
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    • v.15 no.6
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    • pp.105-115
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    • 1997
  • A numerical study is performed to predict the thermal response of a detailed card assembly during infrared reflow soldering. The card assembly is exposed to discontinuous infrared panel heater temperature distributions and high radiative/convective heating and cooling rates at the inlet and exit of the oven. The convective, radiative and conduction heat transfer within the reflow oven as well as within the card assembly are simulated and the predictions illustrate the detailed thermal responses. The predictions show that mixed convection plays an important role with relatively high frequency effects attributed to buoyancy forces, however the thermal response of the card assembly is dominated by radiation. The predictions of the detailed card assembly thermal response can be used to select the oven operating conditions to ensure proper solder melting and minimization of thermally induced card assembly tresses and warpage.

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