• 제목/요약/키워드: Thermal influence measurement

검색결과 81건 처리시간 0.033초

반구상의 볼바측정을 통한 스핀들 열변형 오차 측정 (Measurement of Spindle Thermal Errors in a Machine Tool Using Hemispherical Ball Bar Test)

  • 양승한;김기훈
    • 대한기계학회논문집A
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    • 제25권9호
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    • pp.1359-1367
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    • 2001
  • Improvement of machine tool accuracy is an essential part of quality control in manufacturing process. Among of all the errors of a particular machine tool, the thermal errors of the spindle have a notably significant effect on machining accuracy and have a direct influence upon both the surface finish and geometric shape of the finished workpiece. Therefore, this paper proposed new measurement method for thermal errors of the spindle in machine tools. The thermal errors are measured by a ball bar system instead of capacitance sensor system. The novel measurement method using ball bar system is more efficient, easier to use than conventional measurement system. And also the ball bar system is possible to measure both geometric errors and thermal errors at the same time.

Experimental Investigations for Thermal Mutual Evaluation in Multi-Chip Modules

  • Ayadi, Moez;Bouguezzi, Sihem;Ghariani, Moez;Neji, Rafik
    • Journal of Power Electronics
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    • 제14권6호
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    • pp.1345-1356
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    • 2014
  • The thermal behavior of power modules is an important criterion for the design of cooling systems and optimum thermal structure of these modules. An important consideration for high power and high frequency design is the spacing between semiconductor devices, substrate structure and influence of the boundary condition in the case. This study focuses on the thermal behavior of hybrid power modules to establish a simplified method that allows temperature estimation in different module components without decapsulation. This study resulted in a correction of the junction temperature values estimated from the transient thermal impedance of each component operating alone. The corrections depend on mutual thermal coupling between different chips of the hybrid structure. A new experimental technique for thermal mutual evaluation is presented. Notably, the classic analysis of thermal phenomena in these structures, which was independent of dissipated power magnitude and boundary conditions in the case, is incorrect.

주변 환경 온도 변화를 고려한 열화상 온도 데이터의 보정 알고리즘 설계 (Design of a Compensation Algorithm for Thermal Infrared Data considering Environmental Temperature Variations)

  • 송성호
    • 전기전자학회논문지
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    • 제25권2호
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    • pp.261-266
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    • 2021
  • 이 논문에서는 환경 온도 변화를 고려한 열 적외선 데이터 보정 알고리즘을 설계하는 방법을 제시한다. 첫째, 열 적외선 측정 모델은 적외선 측정 데이터와 모델 환경 매개 변수 간의 관계를 사용하여 매개 변수 종속적인 1차 입력-출력 방정식으로 주어지고, 적외선 데이터에 대한 환경 온도의 영향을 보상하기 위해 보상 함수를 구한다. 실험을 통해 제안된 알고리즘이 적외선 데이터에 대한 환경 온도 변화의 영향을 효과적으로 보상할 수 있음을 보인다.

광열변위법을 이용한 반무한 고체의 열확산계수 결정에 대한 이론적 연구 (A Theoretical Study for the Thermal Diffusivity Measurement of Semi-Infinite Solid Using Photothermal Displacement Method)

  • 전필수;이광재;유재석;박영무;이종화
    • 대한기계학회논문집B
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    • 제26권12호
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    • pp.1747-1755
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    • 2002
  • A complete theoretical treatment of the photothermal displacement technique has been performed for thermal diffusivity measurement in semi-infinite solid materials. The influence of the parameters, such as radius and modulation frequency of the heating beam and the thermal diffusivity, was studied. Usually, thermal diffusivity was determined by the deformation angle and phase angle as the relative position between the heating and probe beams. In this study, we proposed the simple analysis method based on the real part of deformation gradient as the relative position between two beams. It is independent in the parameters such as power of heating beam, absorption coefficient, reflectivity, Poisson's ratio, and thermal expansion coefficient.

박막의 열물성 측정 및 광학특성 연구 (A Study on Thermal Conductivity Measurement and Optical Characteristics of Thin Films)

  • 권혁록;이성혁
    • 전기학회논문지
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    • 제56권12호
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    • pp.2202-2207
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    • 2007
  • The present article investigates experimentally and theoretically thermal and optical characteristics of thin film structures through measurement of thermal conductivity of Pyrex 7740 and reflectance in silicon thin film. The $3{\omega}$ method is used to measure thermal conductivity of very thin film with high accuracy and the optical characteristics in thin films are studied to examine the influence of incidence angle of light on reflectance by using the CTM(Characteristics Transmission Method) and the 633 nm He-Ne laser reflectance measurement system. It is found that the estimated reflectance of silicon show good agreement with experimental data. In particular, the present study solves the EPRT(Equation of Phonon Radiative Transport) which is based on Boltzmann transport equation for predicting thermal conductivity of nanoscale film structures. From the results, the measured thermal conductivity is in good agreement with the previous published data. Moreover, thermal conductivities are estimated for different film thickness. It indicates that as film thickness decreases, thermal conductivity decreases substantially due to internal scattering.

광열편향법을 이용한 이방성 재료의 열전도계수 측정에 관한 이론적 연구 (A Theoretical Study for the Thermal Conductivity Measurement of Anisotropic Material using Photothermal Deflection Spectroscopy)

  • 전필수;김현정;유재석
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2007년도 춘계학술대회B
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    • pp.2465-2470
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    • 2007
  • We have analyzed the three-dimensional thermal conduction in anisotropic materials using nonsymmetric-Fourier transforms. And a complete theoretical treatment of the photothermal deflection spectroscopy has been performed for thermal conductivity measurement in anisotropic medium. Thermal conductivity tensor was determined by the deflection angle and phase angle with the relative position between the heating and probe beams. The influence of the parameters, such as modulation frequency of the heating beam, the thermal conductivity tensor, was investigated.

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온도분포 역해석 프로그램을 이용한 PSC 박스거더 교량 단면의 온도 분포 해석 (Temperature Analysis of PSC Box-girder Bridges Using Inverse Thermal Analysis Program)

  • 박민석;조병완;이명규
    • 한국안전학회지
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    • 제21권4호
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    • pp.95-101
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    • 2006
  • It is well known that the thermal load in PSC(prestressed concrete) box-girder bridge is the principal cause of detrimental crack. The longitudinal stress caused by the lateral stress from the temperature gradient in slab of PSC box-girder bridge has a considerable influence on the durability and economy of bridge structures. As the basic study for the rational consideration of thermal load and the derivation of design guide, the inverse thermal analysis program for PSC box-girder bridges using field measurement data is developed. In this paper, thermal analyses are performed using field monitoring data for the sample PSC box-girder bridge. It is proposed that the link between monitoring program and the inverse analysis program is available.

광열변위법을 이용한 재료의 열확산계수 측정에 대한 이론적 연구 (A Theoretical Study for the Thermal Diffusivity Measurement of Solid Material using Photothermal Displacement Method)

  • 전필수;이은호;이광재;유재석;김기현
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2000년도 춘계학술대회논문집B
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    • pp.132-137
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    • 2000
  • A complete theoretical treatment of the photothermal displacement technique has been performed for thermal diffusivity measurement in solid materials. The influence of parameters - radius and modulation frequency of pump beam and thickness of material - on the phase lag was studied. The phase decreases up to a certain position, then starts to increase and does have an asymptotic value. The position, where phase has the minimum value, is a function of thermal diffusion length thickness of sample, and radius of pump beam. A new method based on minimum phase lag is described to determine the thermal diffusivity of solid material.

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GMOH 기법에 의한 공작기계 원점의 열적거동 예측 (Estimation of Thermal Behavior for the Machine Origin of Machine Tools using GMOH Methodology)

  • 안중용
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 1997년도 추계학술대회 논문집
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    • pp.213-218
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    • 1997
  • Thermal deformation of machine origin of machine tools due to internal and external heat sources has been the most important problem to fabricate products with higher accuracy and performance. In order to solve this problem, GMDH models were constructed to estimate thermal deformation of machine origin for a vertical machining ceneter through measurement of temperature data of specific points on the machine tool. These models are nonlinear equations with high-order polynomials and implemented in a multilayered perceptron type network structure. Input variables and orders are automatically selected by correlation and optimization procedure. Sensors with small influence are deleted automatically in this algorithm. It was shown that the points of temperature measurement can be reduced without sacrificing the estimation accuracy of $\pm$5${\mu}{\textrm}{m}$. From the experimental result, it was confirmed that GMDH methodology was superior to least square models to estimate the thermal behavior of machine tools.

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